This custom 2-layer rigid PCB uses F4BTM300 substrate, designed for RF, microwave, radar and aerospace applications. The finished board measures 105.4mm × 76mm with ±0.15mm tolerance and 0.6mm overall thickness. Fabricated with 1oz outer copper weight, 20μm via plating and immersion gold surface finish, it features black top solder mask and white top silkscreen, with no solder mask or silkscreen applied on the bottom side. The board uses only through-hole vias without blind vias, supports 5/8 mil minimum trace/space and 0.35mm minimum hole size. Every unit is 100% electrically tested before shipment and built to IPC-Class-2 standard, available for worldwide delivery.
PCB Specifications
| Specification Item |
Detailed Parameter |
| Base Material |
F4BTM300 high-frequency laminate |
| Layer Configuration |
2-layer rigid PCB |
| Board Dimensions |
105.4mm × 76mm (±0.15mm tolerance, 1PCS) |
| Minimum Trace / Space |
5/8 mils |
| Minimum Hole Size |
0.35mm |
| Via Type |
Through-hole only, no blind vias |
| Finished Board Thickness |
0.6mm |
| Outer Layer Copper Weight |
1oz (1.4 mils) finished copper |
| Via Plating Thickness |
20μm |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Top: White; Bottom: None |
| Solder Mask |
Top: Black; Bottom: None |
| Pre-Shipment Test |
100% full electrical testing |
2-Layer PCB Stack-up Structure
| Layer Structure |
Material & Thickness |
| Top Copper Layer |
35μm conductive copper foil |
| Dielectric Core Substrate |
F4BTM300 Core, 0.508 mm (20mil) |
| Bottom Copper Layer |
35μm conductive copper foil |
PCB Statistic
This PCB layout is exported as Gerber RS-274-X production artwork. The board layout statistics are listed below:
| Statistical Item |
Quantity / Format |
| Total Components |
13 |
| Total Pads |
94 |
| Thru Hole Pads |
51 |
| Top SMT Pads |
43 |
| Bottom SMT Pads |
0 |
| Vias |
36 |
| Nets |
2 |
F4BTM300 Material Introduction
The F4BTM series laminates are manufactured through a meticulous process that involves the scientific formulation of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. These substrates are built upon the F4BM dielectric layer and incorporate high dielectric constant and low loss nano-ceramics. This integration results in enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics. Furthermore, F4BTM laminates are specifically paired with reverse-treated RTF copper foil, providing exceptional performance in terms of PIM, precise line control, and minimized conductor loss.
Core Material Advantages
Built on F4BTM300 laminate, this 2-layer PCB delivers the key material benefits for high frequency designs:
Stable Dk of 3 ±0.06 at 10GHz with low dissipation factor across microwave frequencies.
Low thermal coefficient of Dk, maintaining consistent dielectric behaviour under temperature variation.
Low PIM performance (< -160 dBc), suitable for antenna and radar systems
Low moisture absorption, supporting reliable operation in challenging environments.
Reverse-treated RTF copper foil helps cut conductor loss and enables tight line geometry control.
Typical Applications
F4BTM300 PCBs are selected for high-reliability RF and microwave systems:
- Aerospace equipment, space and cabin equipment
- Microwave and RF circuits
- Radar and military radar systems
- Feed networks
- Phase-sensitive antennas and phased array antennas
- Satellite communications
Conclusion
This custom F4BTM300 two-layer rigid PCB is fabricated from nano-ceramic filled PTFE laminate for high-frequency RF and microwave projects. It follows IPC-Class-2 requirements and passes full electrical testing before shipment. We accept Gerber RS-274-X files for prototyping and volume orders, with worldwide shipping available for aerospace, radar and satellite communication customers.
Your message must be between 20-3,000 characters!
English
