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2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold
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2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold
  • name
  • name

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-274.V1.0
Base Material:
TF300 High-frequency Dielectric Material
Layer Count:
2 Layers
PCB Thickness:
0.7mm
PCB Size:
70mm × 49mm (1 Piece), Dimensional Tolerance: ±0.15mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz
Surface Finish:
Immersion Gold
Highlight:

No Stiffener Flexible PCB Board

,

RFID Sensor Flexible PCB Board

,

No Stiffener Polyimide Flex PCB

Product Description

This is a customized 2-layer rigid high-frequency PCB fabricated with Wangling TF300 high-performance dielectric substrate, designed for high-stability microwave and millimeter-wave circuits and miniature antenna systems. The board is finished with immersion gold, with no solder mask or silkscreen applied on either top or bottom surfaces.

 

PCB Specification

Parameter Item Specification
Base Material TF300 high-frequency dielectric material
Layer Count 2 layers rigid PCB
Board Dimensions 70mm × 49mm (1 piece), dimensional tolerance: ±0.15mm
Minimum Trace / Space 5 mils / 5 mils
Minimum Mechanical Hole Size 0.3mm
Via Type No blind vias adopted; only through-hole vias are used
Finished Board Thickness 0.7mm
Outer Layer Finished Copper Weight 1oz (1.4 mils)
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Silkscreen Layer No top and bottom silkscreen
Solder Mask Layer No top and bottom solder mask
Quality Test 100% electrical test before shipment

 

PCB Layer Stack-up Structure

Layer Name Specification
Copper Layer 1 (Top Layer) 35μm finished copper thickness
Dielectric Core Wangling TF300 high-frequency material, 0.635mm (25mil) thickness
Copper Layer 2 (Bottom Layer) 35μm finished copper thickness

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 0

 

Artwork & Quality Standards

Artwork Format: Manufactured based on standard Gerber RS-274-X files, the industry-standard format ensuring high-precision patterning and full production compatibility.

 

Quality Standard: Manufactured and inspected in accordance with IPC-Class-2 reliability specifications, meeting general commercial and industrial-grade performance requirements.

 

Supply Coverage: Available for worldwide shipment with standardized production and complete quality control, supporting stable global delivery.

 

Wangling TF Series Material Overview

Wangling TF series substrates are high-performance high-frequency dielectric materials composed of PTFE resin and ceramic filler, featuring a fiberglass-free structure. The dielectric constant can be precisely tuned by adjusting the ceramic-to-PTFE ratio. Manufactured via proprietary processes, TF-series materials deliver outstanding microwave performance, superior thermal stability and long-term reliability, making them ideal for high-precision high-frequency PCB designs.

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 1

 

Core Material Performance Features

Tunable & Stable Dielectric Performance

TF300 features a stable, tunable DK of 3.0–16 with multiple standard options and ultra-low dielectric loss, perfectly meeting microwave and millimeter-wave circuit fabrication requirements.

 

Wide Temperature Stability

It enables continuous stable operation at -80℃ to +200℃, delivering outstanding thermal adaptability for harsh aerospace and industrial environments.

 

Customizable Thickness & High Processability

This material supports customized thickness ranging from 0.635mm to 2.5mm and is fully compatible with standard thermoplastic PCB manufacturing processes for high production yield.

 

Reliable Environmental Adaptability

With excellent radiation resistance and ultra-low outgassing properties, it maintains stable electrical and mechanical performance in extreme high-reliability working scenarios.

 

TF300 Typical Material Properties

Dielectric Constant (DK) 3.0±0.06 @10 GHz
Dissipation Factor (DF) 0.001 @10 GHz
Thermal Coefficient of Dielectric Constant (TCDK) -60 ppm/℃ (-55℃~150℃)
Peel Strength (1oz Copper) ＞0.6 N/mm
Coefficient of Thermal Expansion (CTE) X/Y Axis: 60 ppm/℃; Z Axis: 80 ppm/℃
Water Absorption ≤0.05% (20±2℃, 24 h)
Density 2.41 g/cm3
Thermal Conductivity 0.3 W/m·K
Applicable Copper Foil Standard electrolytic copper foil: 0.5oz, 1oz

 

Typical Application Scenarios

Aerospace equipment, space systems, aircraft and in-cabin electronic equipment

 

Microwave circuits, high-frequency antennas and phase-sensitive antenna devices

 

Early warning radars, airborne radars and radar signal processing modules

 

Phased array antennas and beamforming network systems

 

Satellite communication and navigation equipment

 

High-frequency power amplifier modules

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 2

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

Taconic PCB

PTFE PCB Board

F4B PCB

Multilayer PCB

Hybrid PCB

HDI PCB Board

High Speed PCB

FR 4 PCB Board

Custom PCBs
2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold
  • name
  • name
2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-274.V1.0
Base Material:
TF300 High-frequency Dielectric Material
Layer Count:
2 Layers
PCB Thickness:
0.7mm
PCB Size:
70mm × 49mm (1 Piece), Dimensional Tolerance: ±0.15mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

No Stiffener Flexible PCB Board

,

RFID Sensor Flexible PCB Board

,

No Stiffener Polyimide Flex PCB

Product Description

This is a customized 2-layer rigid high-frequency PCB fabricated with Wangling TF300 high-performance dielectric substrate, designed for high-stability microwave and millimeter-wave circuits and miniature antenna systems. The board is finished with immersion gold, with no solder mask or silkscreen applied on either top or bottom surfaces.

 

PCB Specification

Parameter Item Specification
Base Material TF300 high-frequency dielectric material
Layer Count 2 layers rigid PCB
Board Dimensions 70mm × 49mm (1 piece), dimensional tolerance: ±0.15mm
Minimum Trace / Space 5 mils / 5 mils
Minimum Mechanical Hole Size 0.3mm
Via Type No blind vias adopted; only through-hole vias are used
Finished Board Thickness 0.7mm
Outer Layer Finished Copper Weight 1oz (1.4 mils)
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Silkscreen Layer No top and bottom silkscreen
Solder Mask Layer No top and bottom solder mask
Quality Test 100% electrical test before shipment

 

PCB Layer Stack-up Structure

Layer Name Specification
Copper Layer 1 (Top Layer) 35μm finished copper thickness
Dielectric Core Wangling TF300 high-frequency material, 0.635mm (25mil) thickness
Copper Layer 2 (Bottom Layer) 35μm finished copper thickness

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 0

 

Artwork & Quality Standards

Artwork Format: Manufactured based on standard Gerber RS-274-X files, the industry-standard format ensuring high-precision patterning and full production compatibility.

 

Quality Standard: Manufactured and inspected in accordance with IPC-Class-2 reliability specifications, meeting general commercial and industrial-grade performance requirements.

 

Supply Coverage: Available for worldwide shipment with standardized production and complete quality control, supporting stable global delivery.

 

Wangling TF Series Material Overview

Wangling TF series substrates are high-performance high-frequency dielectric materials composed of PTFE resin and ceramic filler, featuring a fiberglass-free structure. The dielectric constant can be precisely tuned by adjusting the ceramic-to-PTFE ratio. Manufactured via proprietary processes, TF-series materials deliver outstanding microwave performance, superior thermal stability and long-term reliability, making them ideal for high-precision high-frequency PCB designs.

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 1

 

Core Material Performance Features

Tunable & Stable Dielectric Performance

TF300 features a stable, tunable DK of 3.0–16 with multiple standard options and ultra-low dielectric loss, perfectly meeting microwave and millimeter-wave circuit fabrication requirements.

 

Wide Temperature Stability

It enables continuous stable operation at -80℃ to +200℃, delivering outstanding thermal adaptability for harsh aerospace and industrial environments.

 

Customizable Thickness & High Processability

This material supports customized thickness ranging from 0.635mm to 2.5mm and is fully compatible with standard thermoplastic PCB manufacturing processes for high production yield.

 

Reliable Environmental Adaptability

With excellent radiation resistance and ultra-low outgassing properties, it maintains stable electrical and mechanical performance in extreme high-reliability working scenarios.

 

TF300 Typical Material Properties

Dielectric Constant (DK) 3.0±0.06 @10 GHz
Dissipation Factor (DF) 0.001 @10 GHz
Thermal Coefficient of Dielectric Constant (TCDK) -60 ppm/℃ (-55℃~150℃)
Peel Strength (1oz Copper) ＞0.6 N/mm
Coefficient of Thermal Expansion (CTE) X/Y Axis: 60 ppm/℃; Z Axis: 80 ppm/℃
Water Absorption ≤0.05% (20±2℃, 24 h)
Density 2.41 g/cm3
Thermal Conductivity 0.3 W/m·K
Applicable Copper Foil Standard electrolytic copper foil: 0.5oz, 1oz

 

Typical Application Scenarios

Aerospace equipment, space systems, aircraft and in-cabin electronic equipment

 

Microwave circuits, high-frequency antennas and phase-sensitive antenna devices

 

Early warning radars, airborne radars and radar signal processing modules

 

Phased array antennas and beamforming network systems

 

Satellite communication and navigation equipment

 

High-frequency power amplifier modules

 

2-layer TF300 PCB 25mil High Frequency Substrate with Immersion Gold 2

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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