We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

Home ProductsRF PCB Board

TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating

Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating

TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating
TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating

Large Image :  TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-030.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: TLX-8 Layer Count: 2 Layers
PCB Thickness: 1.6mm PCB Size: 99 X 88mm=1PCS
Solder Mask: Green Silkscreen: White
Copper Weight: 1oz Surface Finish: OSP
High Light:

Low DF OSP Surface Finish PCB

,

DK2.55 OSP Surface Finish PCB

,

DK2.55 OSP Coating PCB

 

Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.

 

TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.

 

TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.

 

There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).

 

TLX-8 Low DF DK2.55 OSP Surface Finish PCB UL 94 V-O Rating 0

 

Benefits:

Excellent mechanical & thermal properties

Low & stable DK

Dimensionally stable

Low moisture absorption

UL 94 V-O rating

Tightly controlled DK

Low DF

For low layer count microwave designs

 

Applications:

Antennas

Couplers, Splitters, Combiners,

Amplifiers, Mixers, Filters

Passive components

 

PCB Specifications

PCB SIZE 99 x 88mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
TLX-8 1.575mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 15 mil / 10 mil
Minimum / Maximum Holes: 0.5mm/2.0mm
Number of Different Holes: N/A
Number of Drill Holes: N/A
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TLX-8 1.575mm
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING  
Surface Finish OSP
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Data Sheet of TLX-8

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3   2.55   2.55
Df @1.9 GHz IPC-650 2.5.5.5.1   0.0012   0.0012
Df @10 GHz IPC-650 2.5.5.5.1   0.0017   0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2  
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2  
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2  
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2  
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2  
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2  
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2  
Poisson's Ratio ASTM D 3039   0.135 N/mm  
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm  
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm  
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M  
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M  
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 21 ppm/ 21
CTE(Y axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 23 ppm/ 23
CTE(Z axis)(25-260) IPC-650 2.4.41/ASTM D 3386 ppm/ 215 ppm/ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) 535  
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) 553  
Flammability Rating UL-94   V-0   V-0

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)