logo
products
PRODUCTS DETAILS
Home > Products >
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
  • name
  • name
  • name

Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-040.V1.0
Base Material:
RO3003
Layer Count:
2 Layers
PCB Thickness:
1.6mm
PCB Size:
88 X 92mm=1PCS
Silkscreen:
Black
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Highlight:

RO3003 RF PCB Board

,

1.6mm RF PCB Board

Product Description

 

 Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Cellular telecommunications systems

2) Direct broadcast satellites

3) Global positioning satellite antennas

4) Remote meter readers

 

PCB Specifications

PCB SIZE 88 x 92mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003 1.524mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.2 mm
Number of Different Holes: 7
Number of Drill Holes: 95
Number of Milled Slots: 0
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3003 1.524mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001 0

 

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 930
823		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
16
25		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

Recommended Products
25mil RT Duroid 6010.2LM PCB 2-layer Rigid Circuit Board With Immersion Gold

25mil RT Duroid 6010.2LM PCB 2-layer Rigid Circuit Board With Immersion Gold

Contact Now
6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

6.35mm F4BTMS350 RF PCB 1OZ Hot Air Soldering Level (HASL)

Contact Now
Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Immersion Gold PCB based on 20mil RO3003 Laminates 2 Layer Circuit Boards

Contact Now
RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

Contact Now
F4BM220 PCB Double-Sided 0.8mm Substrate Immersion Gold

F4BM220 PCB Double-Sided 0.8mm Substrate Immersion Gold

Contact Now
2-Layer PCB TP980 7.62mm Thick ENIG With Electroless Nickel Immersion Gold Coating

2-Layer PCB TP980 7.62mm Thick ENIG With Electroless Nickel Immersion Gold Coating

Contact Now
Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

Double-Sided PCB TFA300 10mil 0.254mm Immersion Gold Finish

Contact Now
Precision 2 Layer RF PCB Built On 20mil RO4534 Material With Immersion Gold

Precision 2 Layer RF PCB Built On 20mil RO4534 Material With Immersion Gold

Contact Now
F4BTMS1000 PCB Double-Sided 0.508mm OSP Finished

F4BTMS1000 PCB Double-Sided 0.508mm OSP Finished

Contact Now
F4BTMS430 PCB 2 Layer 125mil 3.175mm Hot Air Soldering Level HASL

F4BTMS430 PCB 2 Layer 125mil 3.175mm Hot Air Soldering Level HASL

Contact Now
F4BM220 PCB 2 Layer 1.575mm 1oz Copper ENIG Finished

F4BM220 PCB 2 Layer 1.575mm 1oz Copper ENIG Finished

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
  • name
  • name
  • name
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-040.V1.0
Base Material:
RO3003
Layer Count:
2 Layers
PCB Thickness:
1.6mm
PCB Size:
88 X 92mm=1PCS
Silkscreen:
Black
Copper Weight:
0.5oz
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RO3003 RF PCB Board

,

1.6mm RF PCB Board

Product Description

 

 Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Cellular telecommunications systems

2) Direct broadcast satellites

3) Global positioning satellite antennas

4) Remote meter readers

 

PCB Specifications

PCB SIZE 88 x 92mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003 1.524mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.2 mm
Number of Different Holes: 7
Number of Drill Holes: 95
Number of Milled Slots: 0
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3003 1.524mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001 0

 

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   MΩ COND A IPC 2.5.17.1
Tensile Modulus 930
823		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
16
25		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.