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RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-181.V1.0
Base Material:
Composites Of Ceramic Filled PTFE And Woven Fiberglass
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Highlight:

60mil High Frequency PCB

,

Taconic High Frequency PCB

,

400mmX500mm High Frequency PCB

Product Description

 

RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

 

RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.

 

The benefits of RF-10 laminates. It has excellent adhesion to smooth coppers, high thermal conductivity for enhanced thermal management, high DK for RF circuit size reduction and low 0.0025 loss tangent @ 10 GHz etc.

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 0

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 1

 

The RF-10 has a wide range of applications. Includiing aircraft collision avoidance systems, GPS antennas, microstrip patch antennas, passive components (filters, couplers, power dividers) etc.

 

Our PCB Capability (RF-10)

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 2

 

RF-10 Typical Values

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK(-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

products
PRODUCTS DETAILS
RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-181.V1.0
Base Material:
Composites Of Ceramic Filled PTFE And Woven Fiberglass
Layer Count:
Double Sided PCB, Multilayer PCB, Hybrid PCB
PCB Thickness:
10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

60mil High Frequency PCB

,

Taconic High Frequency PCB

,

400mmX500mm High Frequency PCB

Product Description

 

RF-10 Printed Circuit Board 10mil 20mil 60mil Taconic RF-10 High Frequency PCB Low Loss High DK RF PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Taconic's RF-10 laminates are composites of ceramic filled PTFE and woven fiberglass, which have the advantage of high dielectric constant (10.2 10GHz) and low dissipation factor (0.0025 10GHz). Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

 

RF-10 high frequency materials are engineered to provide a cost effective substrates, responding to a need in RF applications for size reduction. It bonds well to smooth low profile copper too. The low dissipation combined with the use of very smooth copper results in optimal insertion losses at higher frequency where skin effect losses play a substantial role.

 

The benefits of RF-10 laminates. It has excellent adhesion to smooth coppers, high thermal conductivity for enhanced thermal management, high DK for RF circuit size reduction and low 0.0025 loss tangent @ 10 GHz etc.

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 0

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 1

 

The RF-10 has a wide range of applications. Includiing aircraft collision avoidance systems, GPS antennas, microstrip patch antennas, passive components (filters, couplers, power dividers) etc.

 

Our PCB Capability (RF-10)

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

RF-10 Printed 60mil Taconic High Frequency PCB Low Loss 400mmX500mm 2

 

RF-10 Typical Values

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK(-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

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