This high-performance 2-layer rigid PCB is made of Rogers TMM13i, an isotropic thermoset microwave ceramic-polymer composite. Tailored for reliable plated thru-hole strip-line and micro-strip applications, it leverages the material’s isotropic Dk, ceramic-PTFE advantages, and soft substrate process compatibility, delivering stable electrical and mechanical performance for RF, microwave, and satellite communication uses.
PCB Construction Details
| Item |
Specifications |
| Base Material |
Rogers TMM13i |
| Layer Count |
2 layers |
| Board Dimensions |
63.58mm x 89.2mm per unit |
| Minimum Trace/Space |
6 mil trace width and 7 mil spacing |
| Minimum Hole Size |
0.3mm |
| Finished Board Thickness |
0.5mm |
| Finished Copper Weight |
1 oz (corresponding to 1.4 mils) for outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Gold |
| Top Silkscreen |
Black |
| Bottom Silkscreen |
Not applied |
| Top Solder Mask |
Not applied |
| Bottom Solder Mask |
Not applied |
| Quality Control |
100% electrical testing is conducted prior to shipment |
PCB Stack-up
| Layer |
Description |
Thickness |
| 1 |
Copper Layer 1 (Outer Top) |
35 μm |
| - |
TMM13i Substrate |
0.381 mm (15 mil) |
| 2 |
Copper Layer 2 (Outer Bottom) |
35 μm |
Artwork, Accepted Standard and Availability
Artwork for this PCB is provided in the Gerber RS-274-X format, the industry standard for PCB manufacturing.
The PCB complies with the IPC-Class-2 accepted standard, a globally recognized benchmark guaranteeing consistent electrical performance, reliable manufacturing quality, and adherence to industry requirements for microwave applications.
Furthermore, this PCB is available worldwide, catering to the needs of international customers and RF/microwave circuit projects globally.
Introduction to Rogers TMM13i Material
The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite specifically tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while enabling the convenience of soft substrate processing methods—simplifying fabrication while maintaining high performance.
Key Features of Rogers TMM13i Material
| Key Features |
Specifications |
| Dielectric Constant (Dk) |
12.85 +/- 0.35 |
| Dissipation Factor |
0.0019 at 10 GHz |
| Thermal Coefficient of Dk |
-70 ppm/°K |
| Coefficient of Thermal Expansion (CTE) |
Copper-matched (-55 to 288 °C): X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 20 ppm/°C |
| Process Compatibility & Flammability |
Lead-free process compatible; UL 94 V-0 flammability rating |
Key Benefits of Rogers TMM13i Material
-Superior mechanical properties resist creep and cold flow, ensuring long-term structural stability.
-Resistant to process chemicals, minimizing damage during fabrication and enhancing yield.
-Eliminates the need for sodium napthanate treatment prior to electroless plating, simplifying manufacturing processes.
-Based on a thermoset resin, enabling reliable wire-bonding for high-reliability electronic assemblies.
Typical Applications
Leveraging its high reliability, isotropic Dk, and excellent mechanical/electrical properties, this PCB is specifically designed for the following applications:
-Chip Testers
-Dielectric Polarizers and Lenses
-Filters and Couplers
-RF and Microwave Circuitry
-Satellite Communication Systems
Conclusion
Fabricated utilizing Rogers TMM13i isotropic thermoset microwave material, this 2-layer printed circuit board (PCB) delivers high reliability and consistent performance for plated thru-hole strip-line, micro-strip, and other demanding radio frequency (RF) and microwave applications.
The core advantages of Rogers TMM13i—encompassing its isotropic dielectric constant (Dk), copper-matched coefficient of thermal expansion (CTE), lead-free process compatibility, and chemical resistance—establish this PCB as a highly reliable solution for high-performance, high-reliability microwave design applications.
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