MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.
Key Features:
The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".
Benefits:
The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.
Property | TMM13i | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 12.85±0.35 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 12.2 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0019 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -70 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | - | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | - | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 213 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | - | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 4.0 (0.7) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | - | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.13 | |||||
Specific Gravity | 3 | - | - | A | ASTM D792 | |
Specific Heat Capacity | - | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:
1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.
2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.
3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.
By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.
PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: | TMM13i |
Dielectric constant: | 12.85 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc.. |
PCB Specifications:
- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.
PCB Statistics:
- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3
Artwork and Quality:
This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.
Typical Applications:
The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.
Key Features:
The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".
Benefits:
The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.
Property | TMM13i | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 12.85±0.35 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 12.2 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0019 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -70 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | - | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | - | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 213 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | - | Z | W/m/K | 80 ℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 4.0 (0.7) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | - | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.13 | |||||
Specific Gravity | 3 | - | - | A | ASTM D792 | |
Specific Heat Capacity | - | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:
1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.
2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.
3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.
By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.
PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: | TMM13i |
Dielectric constant: | 12.85 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc.. |
PCB Specifications:
- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.
PCB Statistics:
- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3
Artwork and Quality:
This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.
Typical Applications:
The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.