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15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM13i
PCB Size:
90mm X 65 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
15 Mil
Highlight:

TMM13i PCB Prototyping Service

,

Immersion Gold PCB Prototyping Service

,

15mil PCB Prototyping Service

Product Description

Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.

 

Key Features:

The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".

 

Benefits:

The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.

 

Property TMM13i Direction Units Condition Test Method
Dielectric Constant,εProcess 12.85±0.35 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 12.2 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0019 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -70 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity - - Mohm.cm - ASTM D257
Surface Resistivity - - Mohm - ASTM D257
Electrical Strength(dielectric strength) 213 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity - Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 4.0 (0.7) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) - X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 3 - - A ASTM D792
Specific Heat Capacity - - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:

 

1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.

 

2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.

 

3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.

By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM13i
Dielectric constant: 12.85
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..

 

PCB Specifications:

- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.

 

PCB Statistics:

- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3

 

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service 0

 

Artwork and Quality:

This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.

 

Typical Applications:

The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

 

Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.

products
PRODUCTS DETAILS
15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
TMM13i
PCB Size:
90mm X 65 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
15 Mil
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

TMM13i PCB Prototyping Service

,

Immersion Gold PCB Prototyping Service

,

15mil PCB Prototyping Service

Product Description

Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.

 

Key Features:

The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".

 

Benefits:

The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.

 

Property TMM13i Direction Units Condition Test Method
Dielectric Constant,εProcess 12.85±0.35 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 12.2 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0019 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -70 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity - - Mohm.cm - ASTM D257
Surface Resistivity - - Mohm - ASTM D257
Electrical Strength(dielectric strength) 213 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity - Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 4.0 (0.7) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) - X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 3 - - A ASTM D792
Specific Heat Capacity - - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

 

This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:

 

1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.

 

2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.

 

3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.

By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.

 

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM13i
Dielectric constant: 12.85
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..

 

PCB Specifications:

- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.

 

PCB Statistics:

- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3

 

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service 0

 

Artwork and Quality:

This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.

 

Typical Applications:

The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

 

Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.

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