Send Message
Home ProductsRF PCB Board

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

I'm Online Chat Now

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service
15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service 15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

Large Image :  15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: TMM13i PCB Size: 90mm X 65 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 15 Mil
High Light:

TMM13i PCB Prototyping Service


Immersion Gold PCB Prototyping Service


15mil PCB Prototyping Service

Introducing a newly shipped PCB based on Rogers TMM 13i material. TMM13i substrate is a cutting-edge ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. Combining the advantages of ceramic and PTFE substrates, TMM13i offers exceptional performance while maintaining the ease of soft substrate processing techniques.


Key Features:

The TMM13i PCB boasts impressive features that ensure reliable signal transmission and operational stability:
- Isotropic Dielectric Constant (Dk) of 12.85 +/- .35 ensures consistent signal propagation.
- Dissipation factor of .0019 at 10GHz minimizes signal loss for optimal performance.
- Thermal coefficient of Dk of -70 ppm/°K provides excellent thermal stability.
- Coefficient of thermal expansion matched to copper for reliable operation.
- Decomposition Temperature (Td) of 425 °C TGA ensures high-temperature resilience.
- Thermal Conductivity of 0.76W/mk enables efficient heat dissipation.
- Available in a versatile thickness range of .0015 to .500 inches, with tight tolerance of +/- .0015".



The TMM13i PCB offers a range of benefits that enhance its reliability and functionality:
- Mechanical properties resist creep and cold flow, ensuring long-term durability.
- Resistant to process chemicals, reducing damage during fabrication.
- Eliminates the need for sodium napthanate treatment prior to electroless plating.
- Based on a thermoset resin, allowing for reliable wire-bonding.


Property TMM13i Direction Units Condition Test Method
Dielectric Constant,εProcess 12.85±0.35 Z   10 GHz IPC-TM-650
Dielectric Constant,εDesign 12.2 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0019 Z - 10 GHz IPC-TM-650
Thermal Coefficient of dielectric constant -70 - ppm/°K -55℃-125℃ IPC-TM-650
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity - - - ASTM D257
Surface Resistivity - - Mohm - ASTM D257
Electrical Strength(dielectric strength) 213 Z V/mil - IPC-TM-650 method
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity - Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 4.0 (0.7) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) - X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570
3.18mm (0.125") 0.13
Specific Gravity 3 - - A ASTM D792
Specific Heat Capacity - - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -


This PCB utilizes a 2-layer rigid PCB stackup, offering a straightforward and adaptable design. The stackup consists of three main components:


1. Copper_layer_1: With a thickness of 35 μm, this layer plays a crucial role in efficient signal conduction. It ensures reliable transmission of electrical signals throughout the PCB, minimizing losses and maintaining signal integrity.


2. Rogers TMM10i Core: This core layer has a thickness of 0.381 mm (15mil) and is made of Rogers TMM10i material. It is specifically chosen for its exceptional electrical properties, providing optimal performance in high-frequency applications. The TMM10i core contributes to signal stability and minimizes any undesirable effects that could hinder the PCB's functionality.


3. Copper_layer_2: Similar to Copper_layer_1, this layer has a thickness of 35 μm. It acts as an additional conductor, supporting consistent signal performance and ensuring effective signal transmission throughout the PCB.

By combining these layers, this PCB achieves a balanced stackup configuration that enables efficient signal conduction, excellent electrical properties, and reliable performance for a wide range of high-frequency applications.


PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM13i
Dielectric constant: 12.85
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..


PCB Specifications:

- Board dimensions: 90mm x 65mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 7/7 mils for intricate circuit designs.
- Minimum Hole Size: 0.5mm for versatile component placement.
- No Blind vias for simplified manufacturing and structural integrity.
- Finished board thickness: 0.5mm for durability and compactness.
- Finished Cu weight: 1oz (1.4 mils) outer layers for excellent conductivity.
- Via plating thickness: 20 μm for reliable electrical connections.
- Surface finish: Immersion Gold for enhanced conductivity and protection against oxidation.
- Top and Bottom Silkscreen: No for a clean and unobstructed PCB surface.
- Top Solder Mask: Green for added protection.
- Bottom Solder Mask: No for a clean and unobstructed PCB surface.
- 100% Electrical test used prior to shipment for quality assurance.


PCB Statistics:

- Components: 17
- Total Pads: 47
- Thru Hole Pads: 31
- Top SMT Pads: 16
- Bottom SMT Pads: 0
- Vias: 10
- Nets: 3


15mil TMM13i PCB Immersion Gold Fast PCB Prototyping Service 0


Artwork and Quality:

This PCB is supplied with Gerber RS-274-X artwork, meeting the IPC-Class-2 quality standard. It is available worldwide, ensuring accessibility for various applications.


Typical Applications:

The TMM13i PCB is suitable for a wide range of applications, including:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and couplers
- Satellite communication systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers


Discover the dependability and efficiency offered by the TMM13i Isotropic Thermoset Microwave PCB, opening up a whole new range of opportunities for your electronic projects.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)