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TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish
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TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish
  • name

TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers TMM10
Layer Count:
2 Layers
PCB Thickness:
0.5mm
PCB Size:
85mm × 120mm
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Electroless Palladium Immersion Gold (EPIG, Nickel-free)
Highlight:

Rogers PCB laminate 15mil thick

,

Nickel-free Rogers PCB board

,

EPIG finish Rogers laminate

Product Description

This PCB adopts Rogers TMM10 as its base material, features a nickel-free Electroless Palladium Immersion Gold (EPIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. With a double-sided rigid structure, it is engineered to fulfill the high-reliability demands of RF, microwave, and precision electronic applications, while the EPIG finish ensures superior corrosion resistance, solderability, and compatibility with precision assembly processes.

 

PCB Specifications

Construction Parameter Specification
Base Material Rogers TMM10 (thermoset microwave material)
Layer Count Double-sided (2-layer rigid structure)
Board Dimensions 85mm × 120mm per unit, with a tolerance of ±0.15mm
Minimum Trace/Space Minimum 5 mils (trace) and 7 mils (space)
Minimum Hole Size 0.4mm
Blind Vias Not used
Finished Board Thickness 0.5mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm, ensuring reliable via conductivity
Surface Finish Electroless Palladium Immersion Gold (EPIG, nickel-free)
Silkscreen White silkscreen on the top layer; no silkscreen on the bottom layer
Solder Mask Green solder mask on the top layer; no solder mask on the bottom layer
Quality Control 100% electrical testing conducted prior to shipment

 

Stack-up Configuration

Layer Specification Function
Copper Layer 1 35 μm (1oz) thickness Top signal layer, equipped with white silkscreen and green solder mask
Rogers TMM10 Core 0.381mm (15mil) thickness Low-loss dielectric core layer
Copper Layer 2 35 μm (1oz) thickness Bottom signal layer, without silkscreen or solder mask

 

TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish 0

 

Rogers TMM10 Material Introduction

Rogers TMM10 is a high-performance thermoset microwave material that combines the advantages of both PTFE and ceramic-based substrates. Unlike conventional materials, it is not restricted by the same mechanical limitations and production process constraints, rendering it highly versatile for various high-frequency applications.

 

TMM10 Material Features

Property Type Property Specification
Electrical Properties Dielectric Constant (Dk) 9.20 ± 0.230
Dissipation Factor 0.0022 at 10GHz
Thermal Coefficient of Dk -38 ppm/°K
Thermal & Physical Properties Decomposition Temperature (Td) 425°C (TGA analysis)
Thermal Conductivity 0.76 W/mK
Coefficient of Thermal Expansion (CTE) X/Y/Z: 21/21/20 ppm/K
Thickness Range 0.0015-0.500 inches, tolerance ±0.0015 inches

 

TMM10 Material Benefits

-Superior Mechanical Stability: TMM10 possesses excellent mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.

 

-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication processes.

 

-Simplified Plating Process: It eliminates the need for sodium naphthanate treatment prior to electroless plating, streamlining manufacturing workflows and shortening production cycles.

 

-Reliable Wire-Bonding Capability: As a thermoset resin-based material, TMM10 enables reliable wire-bonding, a critical requirement for high-frequency and precision electronic assemblies.

 

Typical Applications

-Chip Testers

-Dielectric Polarizers

-Satellite Communication Systems

-GPS Antennas

-Patch Antennas

 

Quality & Availability

This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring consistent performance. It is available for worldwide, supporting global project requirements and facilitating timely delivery to international clients.

 

TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish 1

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish
  • name
TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers TMM10
Layer Count:
2 Layers
PCB Thickness:
0.5mm
PCB Size:
85mm × 120mm
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz (1.4 Mils) On Both Outer Layers
Surface Finish:
Electroless Palladium Immersion Gold (EPIG, Nickel-free)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers PCB laminate 15mil thick

,

Nickel-free Rogers PCB board

,

EPIG finish Rogers laminate

Product Description

This PCB adopts Rogers TMM10 as its base material, features a nickel-free Electroless Palladium Immersion Gold (EPIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. With a double-sided rigid structure, it is engineered to fulfill the high-reliability demands of RF, microwave, and precision electronic applications, while the EPIG finish ensures superior corrosion resistance, solderability, and compatibility with precision assembly processes.

 

PCB Specifications

Construction Parameter Specification
Base Material Rogers TMM10 (thermoset microwave material)
Layer Count Double-sided (2-layer rigid structure)
Board Dimensions 85mm × 120mm per unit, with a tolerance of ±0.15mm
Minimum Trace/Space Minimum 5 mils (trace) and 7 mils (space)
Minimum Hole Size 0.4mm
Blind Vias Not used
Finished Board Thickness 0.5mm
Finished Copper Weight 1oz (1.4 mils) on both outer layers
Via Plating Thickness 20 μm, ensuring reliable via conductivity
Surface Finish Electroless Palladium Immersion Gold (EPIG, nickel-free)
Silkscreen White silkscreen on the top layer; no silkscreen on the bottom layer
Solder Mask Green solder mask on the top layer; no solder mask on the bottom layer
Quality Control 100% electrical testing conducted prior to shipment

 

Stack-up Configuration

Layer Specification Function
Copper Layer 1 35 μm (1oz) thickness Top signal layer, equipped with white silkscreen and green solder mask
Rogers TMM10 Core 0.381mm (15mil) thickness Low-loss dielectric core layer
Copper Layer 2 35 μm (1oz) thickness Bottom signal layer, without silkscreen or solder mask

 

TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish 0

 

Rogers TMM10 Material Introduction

Rogers TMM10 is a high-performance thermoset microwave material that combines the advantages of both PTFE and ceramic-based substrates. Unlike conventional materials, it is not restricted by the same mechanical limitations and production process constraints, rendering it highly versatile for various high-frequency applications.

 

TMM10 Material Features

Property Type Property Specification
Electrical Properties Dielectric Constant (Dk) 9.20 ± 0.230
Dissipation Factor 0.0022 at 10GHz
Thermal Coefficient of Dk -38 ppm/°K
Thermal & Physical Properties Decomposition Temperature (Td) 425°C (TGA analysis)
Thermal Conductivity 0.76 W/mK
Coefficient of Thermal Expansion (CTE) X/Y/Z: 21/21/20 ppm/K
Thickness Range 0.0015-0.500 inches, tolerance ±0.0015 inches

 

TMM10 Material Benefits

-Superior Mechanical Stability: TMM10 possesses excellent mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.

 

-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication processes.

 

-Simplified Plating Process: It eliminates the need for sodium naphthanate treatment prior to electroless plating, streamlining manufacturing workflows and shortening production cycles.

 

-Reliable Wire-Bonding Capability: As a thermoset resin-based material, TMM10 enables reliable wire-bonding, a critical requirement for high-frequency and precision electronic assemblies.

 

Typical Applications

-Chip Testers

-Dielectric Polarizers

-Satellite Communication Systems

-GPS Antennas

-Patch Antennas

 

Quality & Availability

This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring consistent performance. It is available for worldwide, supporting global project requirements and facilitating timely delivery to international clients.

 

TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish 1

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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