| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB utilizes Rogers RT duroid 5880LZ as its base material and adheres strictly to IPC-Class-2 quality standards. Configured as a 2-layer rigid structure, it is specifically engineered to meet the rigorous performance demands of high-frequency, weight-critical electronic systems. The RT duroid 5880LZ material imparts exceptional dielectric stability, low-loss performance, and lightweight characteristics to the PCB, rendering it highly suitable for mission-critical aerospace, military, and communication applications.
PCB Specifications
| Construction Parameter | Details |
| Base Material | Rogers RT duroid 5880LZ (filled PTFE composite) |
| Layer Count | 2-layer rigid structure |
| Board Dimensions | 78mm x 96mm per piece, with a tolerance of ±0.15mm |
| Trace/Space | Minimum 5 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.25mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (equivalent to 1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold, |
| Silkscreen | White silkscreen on top layer |
| Solder Mask | Green solder mask on top layer |
| Quality Control | 100% electrical testing performed prior to shipment |
Stack-up Configuration
The 2-layer rigid PCB adopts an optimized stackup to maximize the performance advantages of Rogers RT duroid 5880LZ material. The stackup structure (from top to bottom) is as follows:
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer with white silkscreen and green solder mask |
| RT duroid 5880LZ Core | 0.254mm (10mil) thickness | Low-loss dielectric base ensuring stable high-frequency performance |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer without silkscreen or solder mask |
![]()
RT duroid 5880LZ Material Introduction
Rogers RT duroid 5880LZ is a high-performance filled polytetrafluoroethylene (PTFE) composite material, specifically designed for exacting stripline and microstrip circuit applications that demand superior high-frequency performance. Its unique filler formulation results in a low-density, lightweight structure, making it an ideal choice for weight-sensitive high-performance systems.
A key advantage of RT duroid 5880LZ laminates is their uniform dielectric constant across panels, which remains stable over a broad frequency range. The material’s exceptionally low dissipation factor extends its usability to Ku-band frequencies and above, ensuring minimal signal attenuation in high-frequency operations. Additionally, RT duroid 5880LZ is easily machined, cut, and sheared, with excellent resistance to all solvents and reagents—both hot and cold—commonly used in PCB etching, edge plating, and hole plating processes.
RT duroid 5880LZ Key Features
RT duroid 5880LZ laminates exhibit outstanding electrical, mechanical, and thermal properties, including:
| Property | Specification | Description |
| Dielectric Constant (Dk) | 2.0 ± 0.04 at 10 GHz and 23°C | Ensures consistent signal propagation and impedance control in high-frequency circuits. |
| Dissipation Factor (Df) | 0.0021 - 0.0027 at 10 GHz and 23°C | Minimizes signal attenuation and energy loss, enabling operation at Ku-band and above. |
| Z-Axis Coefficient of Thermal Expansion (CTE) | 40 ppm/°C | Reduces thermal stress and ensures dimensional stability under temperature fluctuations. |
| Outgassing Properties | TML 0.01%, CVCM 0.01%, WVR 0.01% | Meets strict low-outgassing requirements for aerospace and high-reliability applications. |
| Density | 1.4 gm/cm³ | Lightweight construction, ideal for weight-sensitive airborne and military systems. |
| Flammability Rating | UL 94 V-0 | Complies with strict fire safety standards for electronic components. |
| Lead-Free Compatibility | Lead-Free Process Compatible | Aligns with modern manufacturing standards and environmental regulations. |
Typical Applications
Leveraging its lightweight design, low dielectric loss, and high-frequency stability, this PCB is ideally suited for the following critical applications:
-Airborne antenna systems
-Lightweight feed networks
-Military radar systems
-Missile guidance systems
-Point-to-point digital radio antennas
Quality & availability
This PCB strictly complies with IPC-Class-2 quality standards, which guarantees reliable performance. The artwork is provided in Gerber RS-274-X format, the industry standard for PCB manufacturing. Additionally,this PCB is available for worldwide, effectively supporting global project requirements and enabling timely delivery.
![]()
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Standard Packaging: | Vacuum bags+Cartons |
| Delivery Period: | 8-9 working days |
| Payment Method: | T/T |
| Supply Capacity: | 5000PCS per month |
This PCB utilizes Rogers RT duroid 5880LZ as its base material and adheres strictly to IPC-Class-2 quality standards. Configured as a 2-layer rigid structure, it is specifically engineered to meet the rigorous performance demands of high-frequency, weight-critical electronic systems. The RT duroid 5880LZ material imparts exceptional dielectric stability, low-loss performance, and lightweight characteristics to the PCB, rendering it highly suitable for mission-critical aerospace, military, and communication applications.
PCB Specifications
| Construction Parameter | Details |
| Base Material | Rogers RT duroid 5880LZ (filled PTFE composite) |
| Layer Count | 2-layer rigid structure |
| Board Dimensions | 78mm x 96mm per piece, with a tolerance of ±0.15mm |
| Trace/Space | Minimum 5 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.25mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (equivalent to 1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold, |
| Silkscreen | White silkscreen on top layer |
| Solder Mask | Green solder mask on top layer |
| Quality Control | 100% electrical testing performed prior to shipment |
Stack-up Configuration
The 2-layer rigid PCB adopts an optimized stackup to maximize the performance advantages of Rogers RT duroid 5880LZ material. The stackup structure (from top to bottom) is as follows:
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer with white silkscreen and green solder mask |
| RT duroid 5880LZ Core | 0.254mm (10mil) thickness | Low-loss dielectric base ensuring stable high-frequency performance |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer without silkscreen or solder mask |
![]()
RT duroid 5880LZ Material Introduction
Rogers RT duroid 5880LZ is a high-performance filled polytetrafluoroethylene (PTFE) composite material, specifically designed for exacting stripline and microstrip circuit applications that demand superior high-frequency performance. Its unique filler formulation results in a low-density, lightweight structure, making it an ideal choice for weight-sensitive high-performance systems.
A key advantage of RT duroid 5880LZ laminates is their uniform dielectric constant across panels, which remains stable over a broad frequency range. The material’s exceptionally low dissipation factor extends its usability to Ku-band frequencies and above, ensuring minimal signal attenuation in high-frequency operations. Additionally, RT duroid 5880LZ is easily machined, cut, and sheared, with excellent resistance to all solvents and reagents—both hot and cold—commonly used in PCB etching, edge plating, and hole plating processes.
RT duroid 5880LZ Key Features
RT duroid 5880LZ laminates exhibit outstanding electrical, mechanical, and thermal properties, including:
| Property | Specification | Description |
| Dielectric Constant (Dk) | 2.0 ± 0.04 at 10 GHz and 23°C | Ensures consistent signal propagation and impedance control in high-frequency circuits. |
| Dissipation Factor (Df) | 0.0021 - 0.0027 at 10 GHz and 23°C | Minimizes signal attenuation and energy loss, enabling operation at Ku-band and above. |
| Z-Axis Coefficient of Thermal Expansion (CTE) | 40 ppm/°C | Reduces thermal stress and ensures dimensional stability under temperature fluctuations. |
| Outgassing Properties | TML 0.01%, CVCM 0.01%, WVR 0.01% | Meets strict low-outgassing requirements for aerospace and high-reliability applications. |
| Density | 1.4 gm/cm³ | Lightweight construction, ideal for weight-sensitive airborne and military systems. |
| Flammability Rating | UL 94 V-0 | Complies with strict fire safety standards for electronic components. |
| Lead-Free Compatibility | Lead-Free Process Compatible | Aligns with modern manufacturing standards and environmental regulations. |
Typical Applications
Leveraging its lightweight design, low dielectric loss, and high-frequency stability, this PCB is ideally suited for the following critical applications:
-Airborne antenna systems
-Lightweight feed networks
-Military radar systems
-Missile guidance systems
-Point-to-point digital radio antennas
Quality & availability
This PCB strictly complies with IPC-Class-2 quality standards, which guarantees reliable performance. The artwork is provided in Gerber RS-274-X format, the industry standard for PCB manufacturing. Additionally,this PCB is available for worldwide, effectively supporting global project requirements and enabling timely delivery.
![]()