Multilayer PCB RO3003 Blind Vias 1.66mm Thick with ENIG

This 10-layer PCB is fabricated by laminating 5 pieces of RO3003 core boards with FR28 PP sheets, featuring an Immersion Gold (ENIG) surface finish. Configured with 1oz finished copper per layer and a pressed thickness of 1.66mm, it adopts a double-sided design without solder mask or silkscreen. This PCB is sized at 75mm × 63mm per unit (1PCS) and incorporates blind vias (L7-L10, L9-L10). To meet the requirements of high-frequency applications, RO3003 ceramic-filled PTFE composites and FR28 fastRise prepreg synergistically deliver exceptional electrical stability, low loss, and reliable interlayer bonding, satisfying the performance demands of high-frequency automotive radar and RF systems.

PCB Specifications

RO3003 Material Introduction

RO3010 materials are ceramic-filled PTFE composites engineered for commercial microwave and RF applications, offering exceptional electrical-mechanical stability at competitive costs. Core characteristics include:

-Superior Dimensional Stability: X/Y-axis CTE of 17 ppm/°C, perfectly matched to copper, ensuring minimal etch shrinkage (less than 0.5 mils per inch after etch and bake) and excellent structural consistency.

-Reliable Thermal Performance: Z-axis CTE of 24 ppm/°C, delivering outstanding plated through-hole reliability even in severe thermal environments, suitable for high-temperature operating scenarios.

-Stable Dielectric Properties: Dielectric constant (Dk) maintains high stability across temperature variations, supporting consistent signal transmission in high-frequency bands.

-Flexible Processability: Fabricated via standard PTFE PCB processing techniques (with minor modifications), compatible with multilayer designs using different Dk materials without warpage or reliability risks.

FR28 fastRise Prepreg

FR28 fastRise™ is a high-performance thermosetting prepreg designed for low-loss interlayer bonding in high-frequency circuits, enabling 77 GHz automotive radar applications. Core advantages include:

-Ultra-Low Loss: Exhibits the lowest loss among thermosetting prepregs, minimizing signal attenuation in high-speed digital/RF circuits.

-Non-Reinforced Design: Eliminates skew and signal variation, ensuring high-fidelity transmission in high-frequency systems.

-Broad Compatibility: Bonds seamlessly with PTFE, epoxy, low-flow epoxy, LCP, polyimide, and hydrocarbon materials, ideal for integration with RO3003 core boards.

-Low-Temperature Lamination: Cures at 215°C (420°F), enabling 5+ sequential laminations at lower temperatures than FEP/PFA, reducing process-induced variation and supporting resistive foil applications.

-Process Versatility: Flexible in prepreg stage for laser ablation, foil lamination, and conductive paste impregnation, facilitating stacked/staggered microvia designs and subassembly interconnection.

-High Reliability: Passes rigorous reliability tests (IST, HATS, CAF) when paired with stable dielectric materials, ensuring long-term performance in harsh environments.

Quality & Application Scope

This 10-layer PCB adheres to strict RF/microwave manufacturing standards, with Immersion Gold finish ensuring excellent conductivity, solderability, and corrosion resistance.

Typical applications include 77 GHz automotive radar systems, high-frequency communication devices, RF transceivers, and precision microwave modules. It is also suitable for avionics, aerospace, and commercial RF equipment requiring stable electrical performance, low loss, and reliable interlayer bonding. This PCB is available worldwide, supporting global high-frequency electronics project needs and ensuring timely delivery.