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TLY-5 PCB Material Copper Clad Laminate
  • name

TLY-5 PCB Material Copper Clad Laminate

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLY-5
Laminate Thickness:
0.089mm 0.127mm 0.191mm 0.254mm 0.508mm 0.762mm 1.524mm 3.175mm
Laminate Size:
12X18 Inch, 16X18 Inch, 18X24 Inch, 16X36 Inch, 24X36 Inch, 18X48 Inch
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Highlight:

TLY-5 copper clad laminate

,

PCB material copper laminate

,

copper clad laminate with warranty

Product Description

TLY-5 laminates are fabricated using ultra-lightweight woven fiberglass substrates, delivering superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiber matrix inherent to TLY-5 imparts enhanced mechanical robustness to the laminate, rendering it well-suited for high-volume production environments. Boasting a low dissipation factor, this material is ideally engineered for 77 GHz automotive radar systems and a broad spectrum of other millimeter-wave antenna applications.


Comparative OEM validation testing conducted at 77 GHz—pitting lightly reinforced TLY-5 against its closest chopped fiber-reinforced counterpart—has verified drop-in compatibility, with equivalent insertion loss and dielectric performance metrics. The key competitive advantage lies in TLY-5’s substantially higher manufacturing yields.


TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For the majority of available thicknesses, the Dk value can be customized to any point within this interval, with a tight tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation factor (Df) of approximately 0.0009, a standout performance within the low-Dk material category.

 

TLY-5 PCB Material Copper Clad Laminate 0
 

Key Benefits

  • Exceptional dimensional stability
  • Industry-leading low dissipation factor
  • High peel strength
  • Minimal moisture absorption
  • Uniform, consistent dielectric constant
  • Laser ablatable
     

Typical Applications

  • Automotive radar systems
  • Satellite and cellular communications infrastructure
  • Power amplifiers
  • Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise converters (LNCs)
  • Aerospace and avionics
  • Ka-band, E-band, and W-band systems
  • Phased array antennas and RF filters/couplers

 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

TLY-5 PCB Material Copper Clad Laminate 1

Tags: 

0.1mm Copper Clad Laminate,  

BME217 Copper Clad Laminate,  

12mm Copper Clad Laminate

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB

Copper Clad Laminates
TLY-5 PCB Material Copper Clad Laminate
  • name
TLY-5 PCB Material Copper Clad Laminate
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Part Number:
TLY-5
Laminate Thickness:
0.089mm 0.127mm 0.191mm 0.254mm 0.508mm 0.762mm 1.524mm 3.175mm
Laminate Size:
12X18 Inch, 16X18 Inch, 18X24 Inch, 16X36 Inch, 24X36 Inch, 18X48 Inch
Copper Weight:
0.5OZ（0.018mm）1OZ（0.035mm）
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

TLY-5 copper clad laminate

,

PCB material copper laminate

,

copper clad laminate with warranty

Product Description

TLY-5 laminates are fabricated using ultra-lightweight woven fiberglass substrates, delivering superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiber matrix inherent to TLY-5 imparts enhanced mechanical robustness to the laminate, rendering it well-suited for high-volume production environments. Boasting a low dissipation factor, this material is ideally engineered for 77 GHz automotive radar systems and a broad spectrum of other millimeter-wave antenna applications.


Comparative OEM validation testing conducted at 77 GHz—pitting lightly reinforced TLY-5 against its closest chopped fiber-reinforced counterpart—has verified drop-in compatibility, with equivalent insertion loss and dielectric performance metrics. The key competitive advantage lies in TLY-5’s substantially higher manufacturing yields.


TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For the majority of available thicknesses, the Dk value can be customized to any point within this interval, with a tight tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation factor (Df) of approximately 0.0009, a standout performance within the low-Dk material category.

 

TLY-5 PCB Material Copper Clad Laminate 0
 

Key Benefits

  • Exceptional dimensional stability
  • Industry-leading low dissipation factor
  • High peel strength
  • Minimal moisture absorption
  • Uniform, consistent dielectric constant
  • Laser ablatable
     

Typical Applications

  • Automotive radar systems
  • Satellite and cellular communications infrastructure
  • Power amplifiers
  • Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise converters (LNCs)
  • Aerospace and avionics
  • Ka-band, E-band, and W-band systems
  • Phased array antennas and RF filters/couplers

 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

TLY-5 PCB Material Copper Clad Laminate 1

Tags: 

0.1mm Copper Clad Laminate,

BME217 Copper Clad Laminate,

12mm Copper Clad Laminate

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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