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TLY-5 PCB Material Copper Clad Laminate

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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TLY-5 PCB Material Copper Clad Laminate

TLY-5 PCB Material Copper Clad Laminate
TLY-5 PCB Material Copper Clad Laminate

Large Image :  TLY-5 PCB Material Copper Clad Laminate

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

TLY-5 PCB Material Copper Clad Laminate

Description
Part Number: TLY-5 Laminate Thickness: 0.089mm 0.127mm 0.191mm 0.254mm 0.508mm 0.762mm 1.524mm 3.175mm
Laminate Size: 12X18 Inch, 16X18 Inch, 18X24 Inch, 16X36 Inch, 24X36 Inch, 18X48 Inch Copper Weight: 0.5OZ(0.018mm)1OZ(0.035mm)
Highlight:

TLY-5 copper clad laminate

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PCB material copper laminate

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copper clad laminate with warranty

TLY-5 laminates are fabricated using ultra-lightweight woven fiberglass substrates, delivering superior dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiber matrix inherent to TLY-5 imparts enhanced mechanical robustness to the laminate, rendering it well-suited for high-volume production environments. Boasting a low dissipation factor, this material is ideally engineered for 77 GHz automotive radar systems and a broad spectrum of other millimeter-wave antenna applications.


Comparative OEM validation testing conducted at 77 GHz—pitting lightly reinforced TLY-5 against its closest chopped fiber-reinforced counterpart—has verified drop-in compatibility, with equivalent insertion loss and dielectric performance metrics. The key competitive advantage lies in TLY-5’s substantially higher manufacturing yields.


TLY-5 features a dielectric constant (Dk) range of 2.17–2.40. For the majority of available thicknesses, the Dk value can be customized to any point within this interval, with a tight tolerance of ±0.02. At 10 GHz, the material exhibits a dissipation factor (Df) of approximately 0.0009, a standout performance within the low-Dk material category.

 

TLY-5 PCB Material Copper Clad Laminate 0
 

Key Benefits

  • Exceptional dimensional stability
  • Industry-leading low dissipation factor
  • High peel strength
  • Minimal moisture absorption
  • Uniform, consistent dielectric constant
  • Laser ablatable
     

Typical Applications

  • Automotive radar systems
  • Satellite and cellular communications infrastructure
  • Power amplifiers
  • Low-noise blocks (LNBs), low-noise amplifiers (LNAs), low-noise converters (LNCs)
  • Aerospace and avionics
  • Ka-band, E-band, and W-band systems
  • Phased array antennas and RF filters/couplers

 

TLY TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK at 10 GHz IPC-650 2.5.5.5   2.2   2.2
Df at 10 GHz IPC-650 2.5.5.5   0.0009   0.0009
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Dielectric Strength ASTM D 149 V/mil 2,693 V/mil 106,023
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 1010 Mohms/cm 1010
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 1010 Mohms/cm 109
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 108 Mohms 108
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 108 Mohms 108
Flex Strength(MD) IPC-650 2.4.4 psi 14,057 N/mm2 96.91
Flex Strength(CD) IPC-650 2.4.4 psi 12,955 N/mm2 89.32
Peel Stength(½ oz.ed copper) IPC-650 2.4.8 Ibs./inch 11 N/mm 1.96
Peel Stength(1 oz.CL1 copper) IPC-650 2.4.8 Ibs./inch 16 N/mm 2.86
Peel Stength(1 oz..CV1 copper) IPC-650 2.4.8 Ibs./inch 17 N/mm 3.04
Peel Stength IPC-650 2.4.8(after elevated temp.) Ibs./inch 13 N/mm 2.32
Young's Modulus(MD) ASTM D 3039/IPC-650 2.4.19 psi 1.4 x 106 N/mm2 9.65 x 103
Poisson's Ratio(MD) ASTM D 3039/IPC-650 2.4.19   0.21   0.21
Thermal Conductivity ASTM F 433 W/M*K 0.22 W/M*K 0.22
Dimensional Stability(MD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.038   -0.038
Dimensional Stability(CD,10mil) IPC-650 2.4.39(avg.after bake&thermal stress) mils/inch -0.031   -0.031
Density(Specific Gravity) ASTM D 792 g/cm3 2.19 g/cm3 2.19
CTE(X axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 26 ppm/℃ 26
CTE(Y axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 15 ppm/℃ 15
CTE(Z axis)(25-260℃) ASTM D 3386(TMA) ppm/℃ 217 ppm/℃ 217
NASA Outgassing(% TML)     0.01   0.01
NASA Outgassing(% CVCM)     0.01   0.01
NASA Outgassing(% WVR)     0.00   0.00
UL-94 Flammability Rating UL-94   V-0   V-0

 

TLY-5 PCB Material Copper Clad Laminate 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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