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2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Adhesiveless Polyimide
Layer Count:
2-layer
PCB Thickness:
0.12mm
PCB Size:
110mm × 130mm
Silkscreen:
White
Solder Mask:
Green
Copper Weight:
0.5oz For Outer Layers
Surface Finish:
ENIG
Highlight:

ENIG 2-layer Polyimide PCB

,

0.12mm 2-layer Polyimide PCB

Product Description

This 2-layer flexible PCB is engineered for high-reliability flexible electronic applications, leveraging adhesiveless polyimide (SF202 series FCCL) material. It is specifically designed to meet the requirements of high-frequency signal transmission and dynamic bending scenarios, balancing superior performance and practicality for use cases ranging from foldable mobile phones to automotive electronics.

 

PCB Specification

Parameter Details
Layer Count 2-Layer (flexible structure)
Base Material Adhesiveless Polyimide (SF202 series adhesiveless double-sided flexible copper-clad laminate)
Board Dimensions 110mm × 130mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 8 mils (trace) / 6 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; total vias: 51; via plating thickness: 15 μm
Finished Board Thickness 0.12mm
Finished Copper Weight 0.5oz (0.7 mils) for outer layers
Surface Finish Electroless Nickle Immersion Gold (ENIG)
Silkscreen White on top layer; no silkscreen on bottom layer
Solder Mask Green on both top and bottom layers
Quality Assurance 100% electrical testing before shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Layer (Copper_layer_1) Copper 22 μm
Substrate Layer SF305 Polyimide Core 0.05mm (50 μm)
Bottom Layer (Copper_layer_2) Copper 22 μm

 

Core Material Introduction (SF202 Adhesiveless PI Film Based FCCL)

SF202 is an adhesiveless double-sided flexible copper-clad laminate (FCCL) developed by Shengyi Technology for high-reliability flexible electronic devices. It is tailored for high-frequency signal transmission and dynamic bending applications, ideal for fields with strict FPC requirements such as foldable mobile phones, computers, digital cameras, VCRs, flat panel displays, automotive electronics, and precision instruments. Its core advantages include low dielectric loss, high bending resistance, and excellent dimensional stability.

 

Key Advantages of SF202 Material:

FR-4 Process Compatibility: Adaptable to standard flexible PCB fabrication workflows, reducing manufacturing costs and lead times

 

Adhesiveless Design: Enhances flexibility and bending resistance while reducing overall board thickness

 

Environmental Compliance: Halogen-free, UL 94 V-0 rated, and RoHS compliant (free of Pb, Hg, Cd, Cr6+, PBB, PBDE)

 

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 3.2 at 1 GHz (tested per IPC-TM-650 standard)
Dissipation Factor 0.007 at 1 GHz (tested per IPC-TM-650 standard)
90° Peel Strength ≥1 N/mm
Chemical Resistance ≥80%
Moisture Absorption ≤1.5%
Dielectric Strength 150 V/μm
Flammability Rating UL 94 V-0 (material) / UL 94 VTM-0 (PCB)
Comprehensive Performance Excellent flexibility, thermal resistance, dimensional stability, and electrical performance
Soldering & Chemical Performance Superior soldering reliability and chemical resistance

 

Core Benefits

-Low Dielectric Loss: Ensures reliable high-frequency signal transmission, critical for communication devices like mobile phones and digital cameras

 

-High Bending Resistance: Adapts to dynamic bending scenarios, ideal for foldable electronics and automotive moving parts

 

-Thermal Resilience: Withstands high-temperature operating environments and lead-free soldering processes

 

-Dimensional Stability: Minimizes deformation during fabrication and operation, ensuring long-term reliability

 

-Environmental Safety: Halogen-free and RoHS compliant, meeting global sustainability standards

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2 quality standards. IPC-Class-2 is a widely recognized industry standard for printed circuit boards, specifying requirements for acceptability that ensure reliable performance in general electronic applications.

 

Availability: Worldwide supply is supported.

 

Typical Applications

-Consumer Electronics: Computers, mobile phones (especially foldable models), digital cameras, VCRs

 

-Automotive Electronics: Various in-vehicle electronic components

 

-Office Equipment: Office automation devices

 

-Other Fields: Flat panel displays, precision instruments, and other high-reliability flexible electronic devices

 

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 1

products
PRODUCTS DETAILS
2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Adhesiveless Polyimide
Layer Count:
2-layer
PCB Thickness:
0.12mm
PCB Size:
110mm × 130mm
Silkscreen:
White
Solder Mask:
Green
Copper Weight:
0.5oz For Outer Layers
Surface Finish:
ENIG
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

ENIG 2-layer Polyimide PCB

,

0.12mm 2-layer Polyimide PCB

Product Description

This 2-layer flexible PCB is engineered for high-reliability flexible electronic applications, leveraging adhesiveless polyimide (SF202 series FCCL) material. It is specifically designed to meet the requirements of high-frequency signal transmission and dynamic bending scenarios, balancing superior performance and practicality for use cases ranging from foldable mobile phones to automotive electronics.

 

PCB Specification

Parameter Details
Layer Count 2-Layer (flexible structure)
Base Material Adhesiveless Polyimide (SF202 series adhesiveless double-sided flexible copper-clad laminate)
Board Dimensions 110mm × 130mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 8 mils (trace) / 6 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; total vias: 51; via plating thickness: 15 μm
Finished Board Thickness 0.12mm
Finished Copper Weight 0.5oz (0.7 mils) for outer layers
Surface Finish Electroless Nickle Immersion Gold (ENIG)
Silkscreen White on top layer; no silkscreen on bottom layer
Solder Mask Green on both top and bottom layers
Quality Assurance 100% electrical testing before shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Layer (Copper_layer_1) Copper 22 μm
Substrate Layer SF305 Polyimide Core 0.05mm (50 μm)
Bottom Layer (Copper_layer_2) Copper 22 μm

 

Core Material Introduction (SF202 Adhesiveless PI Film Based FCCL)

SF202 is an adhesiveless double-sided flexible copper-clad laminate (FCCL) developed by Shengyi Technology for high-reliability flexible electronic devices. It is tailored for high-frequency signal transmission and dynamic bending applications, ideal for fields with strict FPC requirements such as foldable mobile phones, computers, digital cameras, VCRs, flat panel displays, automotive electronics, and precision instruments. Its core advantages include low dielectric loss, high bending resistance, and excellent dimensional stability.

 

Key Advantages of SF202 Material:

FR-4 Process Compatibility: Adaptable to standard flexible PCB fabrication workflows, reducing manufacturing costs and lead times

 

Adhesiveless Design: Enhances flexibility and bending resistance while reducing overall board thickness

 

Environmental Compliance: Halogen-free, UL 94 V-0 rated, and RoHS compliant (free of Pb, Hg, Cd, Cr6+, PBB, PBDE)

 

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 0

 

Key Material Features

Feature Specification/Description
Dielectric Constant (Dk) 3.2 at 1 GHz (tested per IPC-TM-650 standard)
Dissipation Factor 0.007 at 1 GHz (tested per IPC-TM-650 standard)
90° Peel Strength ≥1 N/mm
Chemical Resistance ≥80%
Moisture Absorption ≤1.5%
Dielectric Strength 150 V/μm
Flammability Rating UL 94 V-0 (material) / UL 94 VTM-0 (PCB)
Comprehensive Performance Excellent flexibility, thermal resistance, dimensional stability, and electrical performance
Soldering & Chemical Performance Superior soldering reliability and chemical resistance

 

Core Benefits

-Low Dielectric Loss: Ensures reliable high-frequency signal transmission, critical for communication devices like mobile phones and digital cameras

 

-High Bending Resistance: Adapts to dynamic bending scenarios, ideal for foldable electronics and automotive moving parts

 

-Thermal Resilience: Withstands high-temperature operating environments and lead-free soldering processes

 

-Dimensional Stability: Minimizes deformation during fabrication and operation, ensuring long-term reliability

 

-Environmental Safety: Halogen-free and RoHS compliant, meeting global sustainability standards

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2 quality standards. IPC-Class-2 is a widely recognized industry standard for printed circuit boards, specifying requirements for acceptability that ensure reliable performance in general electronic applications.

 

Availability: Worldwide supply is supported.

 

Typical Applications

-Consumer Electronics: Computers, mobile phones (especially foldable models), digital cameras, VCRs

 

-Automotive Electronics: Various in-vehicle electronic components

 

-Office Equipment: Office automation devices

 

-Other Fields: Flat panel displays, precision instruments, and other high-reliability flexible electronic devices

 

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 1

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