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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish
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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish
  • name

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-052.V1.0
Base Material:
Rogers RO4730G3
Layer Count:
2-layer
PCB Thickness:
0.6 Mm
PCB Size:
59.6mm X 40.5mm (
Copper Weight:
1oz (equivalent To 1.4 Mils Or 35μm)
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Highlight:

2-layer RF PCB RO4730G3

,

ENIG finish Rogers PCB

,

high-frequency Rogers PCB board

Product Description
High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.

 

1. PCB Specifications

Specification Category Details
Base Material Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count 2 layers
Physical Dimensions - Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes - Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias - Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness Finished board thickness: 0.6 mm
Copper Weight 1 oz (equivalent to 35 μm) on both outer layers
Surface Finish Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask - Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen - Top side: White legend silkscreen- Bottom side: No silkscreen

 

2. PCB Stack-up

Layer Position Material Thickness
Top Layer 35 μm Copper 35 μm (1oz)
Core Layer Rogers RO4730G3 0.508mm (20mil)
Bottom Layer 35 μm Copper 35 μm (1oz)

 

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

 

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

 

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

 

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

 

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

 

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

 

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

 

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

 

Characteristic Category Technical Specification
Stable Dielectric Constant (Dk) 3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk) Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience - Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE) - X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation Thermal Conductivity: 0.45 W/mK

 

4. Typical Applications:

This PCB is ideally suited for:

 

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

 

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

 

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

 

Availability: This PCB is available for order and shipment worldwide.

 

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish
  • name
High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-052.V1.0
Base Material:
Rogers RO4730G3
Layer Count:
2-layer
PCB Thickness:
0.6 Mm
PCB Size:
59.6mm X 40.5mm (
Copper Weight:
1oz (equivalent To 1.4 Mils Or 35μm)
Surface Finish:
Electroless Nickel Immersion Gold (ENIG)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

2-layer RF PCB RO4730G3

,

ENIG finish Rogers PCB

,

high-frequency Rogers PCB board

Product Description
High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.

 

1. PCB Specifications

Specification Category Details
Base Material Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count 2 layers
Physical Dimensions - Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes - Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias - Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness Finished board thickness: 0.6 mm
Copper Weight 1 oz (equivalent to 35 μm) on both outer layers
Surface Finish Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask - Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen - Top side: White legend silkscreen- Bottom side: No silkscreen

 

2. PCB Stack-up

Layer Position Material Thickness
Top Layer 35 μm Copper 35 μm (1oz)
Core Layer Rogers RO4730G3 0.508mm (20mil)
Bottom Layer 35 μm Copper 35 μm (1oz)

 

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

 

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

 

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

 

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

 

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

 

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

 

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

 

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

 

Characteristic Category Technical Specification
Stable Dielectric Constant (Dk) 3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk) Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience - Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE) - X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation Thermal Conductivity: 0.45 W/mK

 

4. Typical Applications:

This PCB is ideally suited for:

 

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

 

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

 

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

 

Availability: This PCB is available for order and shipment worldwide.

 

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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