Material Composition
The base material for this PCB is TP980, known for its advanced dielectric properties. This thermoplastic material comprises a blend of ceramics and polyphenylene oxide (PPO) resin, intentionally designed without fiberglass reinforcement. This unique composition allows for precise adjustments of the dielectric constant, making TP980 suitable for a wide range of high-frequency applications.
PCB Stackup
The stack-up of this PCB is meticulously designed to optimize performance:
- Copper Layer 1: 35 μm of copper is used for the first layer, providing necessary routing and grounding capabilities.
- TF980 Core: The core material, measuring 4.0 mm (157.5 mils), contributes significantly to the board's dielectric properties, enhancing signal integrity and thermal management.
- Copper Layer 2: An additional 35 μm copper layer serves a similar function as the first, allowing for efficient routing and component placement.
PCB Specification
| Parameter |
Specification |
| Base Material |
TP980 |
| Layer Count |
Double Sided |
| Board Dimensions |
68mm x 68mm ± 0.15mm |
| Minimum Trace/Space |
7/5 mils |
| Minimum Hole Size |
0.7mm |
| Blind Vias |
No |
| Finished Board Thickness |
4.1mm |
| Finished Cu Weight |
1oz (1.4 mils) for outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen |
No |
| Bottom Silkscreen |
No |
| Top Solder Mask |
No |
| Bottom Solder Mask |
No |
| Electrical Testing |
100% electrical test prior to shipment |
Artwork and Quality Standards
This PCB artwork is supplied in the Gerber RS-274-X format, a widely used standard in PCB manufacturing that ensures compatibility across various fabrication processes. This format allows for precise communication of the PCB design to manufacturers.
Adhering to IPC-Class-2 quality standards, this PCB meets essential requirements for reliability and performance, ensuring it can be used in various applications without compromising functionality.
Availability
The TP980 PCB is available worldwide, making it a versatile choice for manufacturers and designers looking to implement high-frequency solutions in their electronic products.
Features of TP980
- Dielectric Constant (Dk): 9.8 ± 0.2 at 10 GHz, ensuring stable performance for high-frequency signals.
- Dissipation Factor: 0.0012 at 10 GHz, indicating low energy loss during signal transmission.
- Thermal Coefficient of Dielectric Constant (TCDK): -40 ppm/°C, maintaining performance across a wide temperature range of -55°C to 150°C.
- CTE Values:
- X-axis: 40 ppm/°C
- Y-axis: 40 ppm/°C
- Z-axis: 55 ppm/°C
- Thermal Conductivity: 0.65 W/mk, facilitating effective heat dissipation.
- Moisture Absorption: 0.01%, reducing the risk of moisture-related failures.
- UL Rating: 94-V0, ensuring compliance with fire safety standards.
Typical Applications
The TP980 PCB is particularly suited for demanding applications, including:
- Global Satellite Navigation Systems: Offering the necessary precision and reliability for navigation technology.
- Missile-borne Technologies: Meeting stringent performance and reliability standards essential in defense applications.
- Fuze Technology: Providing robust and reliable performance in critical safety applications.
- Miniaturized Antennas: Enabling compact designs without sacrificing performance, crucial in modern communication systems.
Conclusion
TP980 PCB exemplifies the intersection of advanced materials science and electronics engineering. With its exceptional dielectric properties, robust construction, and adherence to quality standards, it is a premier choice for high-frequency applications. As the demand for reliable and efficient PCBs continues to rise, the TP980 stands ready to meet the challenges of modern electronic design.
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