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4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board

4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board
4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board

Large Image :  4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: Rogers RO3003 Layer Count: 4-layer
PCB Size: 190mm X 90 Mm=1PCS PCB Thickness: 2.4 Mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Highlight:

1OZ RF High-Frequency Circuit Board

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4-Layer RO3003 PCB

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RO3003 PCB

As the demand for high-performance printed circuit boards (PCBs) continues to rise, driven by advancements in technology and increasing complexity of electronic devices, the introduction of the Rogers RO3003 High-Frequency PCB marks a significant milestone in the industry. Designed specifically for commercial microwave and RF applications, this innovative PCB offers exceptional performance characteristics that make it ideal for a variety of advanced uses, including automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure.

 

Understanding Rogers RO3003: The Material Advantage

The Rogers RO3003 PCB is constructed from ceramic-filled PTFE composites, which provide numerous advantages over traditional PCB materials. One of the standout features of the RO3003 laminate is its excellent stability of dielectric constant (Dk) across varying temperatures and frequencies. This stability eliminates the step change in Dk that often occurs near room temperature with PTFE glass materials, ensuring reliable performance in critical applications.

 

Key Features and Specifications

1. Dielectric Constant: The RO3003 PCB has a Dk of 3 ± 0.04 at 10 GHz and 23°C. This low and stable Dk is essential for maintaining signal integrity in high-frequency applications.

 

2. Dissipation Factor: With a dissipation factor of 0.001 at 10 GHz and 23°C, the RO3003 minimizes signal loss, making it suitable for applications that require high efficiency and low power consumption.

 

3. Thermal Stability: The RO3003 laminate boasts a thermal degradation temperature (Td) greater than 500°C, ensuring reliable performance even under extreme thermal conditions.

 

4. Thermal Conductivity: At 0.5 W/mK, the thermal conductivity of the RO3003 allows for effective heat dissipation, which is crucial in high-power applications where overheating can lead to component failure.

 

5. Absorption: With a moisture absorption rate of only 0.04%, the RO3003 PCB maintains its properties in various environmental conditions, further enhancing its reliability.

 

6. Coefficient of Thermal Expansion (CTE): The low CTE values (X-axis: 17 ppm/°C, Y-axis: 16 ppm/°C, Z-axis: 25 ppm/°C) ensure that the PCB maintains its dimensional stability across a wide temperature range, which is critical for multi-layer board designs.

 

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107   COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04   % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9   j/g/k   Calculated
Thermal Conductivity 0.5   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Benefits of the Rogers RO3003 PCB

1. Low Dielectric Loss

The RO3003 PCB’s low dielectric loss allows it to function efficiently in applications operating at frequencies up to 77 GHz. This capability is particularly important for advanced telecommunications technologies and automotive radar systems, where high-frequency signals must be transmitted with minimal degradation.

 

2. Excellent Mechanical Properties

The mechanical properties of the RO3003 PCB are stable across temperature variations, enabling reliable stripline and multi-layer board constructions. This reliability is essential for high-density designs that require precise electrical characteristics.

 

3. Uniform Mechanical Properties

The RO3003 offers uniform mechanical properties across a range of dielectric constants, making it suitable for multi-layer board designs that incorporate various materials. This flexibility is particularly beneficial for hybrid designs that combine epoxy glass and other materials.

 

4. Stable Dielectric Constant

The stable dielectric constant of the RO3003 PCB across temperature and frequency ranges is ideal for various applications, including band pass filters, microstrip patch antennas, and voltage-controlled oscillators. This stability ensures consistent performance in demanding environments.

 

5. Low In-Plane Expansion Coefficient

The RO3003 PCB’s low in-plane expansion coefficient allows it to match copper, which is crucial for ensuring reliable surface-mounted assemblies. This characteristic minimizes the risk of mechanical stress and failure due to temperature changes.

 

6. Economical Manufacturing Process

The volume manufacturing process associated with the RO3003 PCB results in economical laminate pricing, making it an attractive option for large-scale production without compromising quality.

 

PCB Construction and Specifications

The Rogers RO3003 PCB features a 4-layer rigid stackup, designed for optimal performance:

 

- Copper Layer 1: 35 μm
- Rogers RO3003: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm
- Prepreg RO4450F: 4 mil (0.101 mm)
- Copper Layer 3: 35 μm
- Rogers RO3003: 20 mil (0.508 mm)
- Copper Layer 4: 35 μm

 

Important Dimensions and Specifications

- Board Dimensions: 190 mm x 90 mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.4 mm
- Finished Board Thickness: 2.4 mm
- Finished Copper Weight: 1 oz (1.4 mils)
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Silkscreen Colors: Top - Yellow, Bottom - Green
- Electrical Testing: 100% electrical test prior to shipment

 

4 Layer RO3003 PCB 1OZ RF High Frequency Circuit Board 0

 

Typical Applications

The Rogers RO3003 PCB is versatile and suitable for a wide range of applications, including:

 

- Automotive Radar Applications: Supporting advanced driver assistance systems and safety features in vehicles.
 

- Global Positioning Satellite Antennas: Ensuring reliable signal reception and transmission.
 

- Cellular Telecommunications Systems: Ideal for power amplifiers and antennas in mobile networks.
 

- Patch Antennas for Wireless Communications: Facilitating effective data transmission in wireless systems.
 

- Direct Broadcast Satellites: Ensuring high-quality signal delivery for satellite communications.
 

- Remote Meter Readers: Supporting efficient data collection in utility industries.
 

- Power Backplanes: Providing robust support for high-power electronic systems.

 

Conclusion

The Rogers RO3003 High-Frequency PCB represents a significant advancement in PCB technology, specifically designed to meet the demanding requirements of RF and microwave applications. With its exceptional dielectric stability, low loss characteristics, and robust mechanical properties, the RO3003 PCB is poised to enhance the performance of a wide array of electronic devices.

 

For more information on the Rogers RO3003 PCB or to discuss your specific project needs, please contact our sales team at sales10@bichengpcb.com. We are committed to providing quality products and exceptional support to help you achieve your project goals.

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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