Introducing our newly shipped PCB based on WL-CT300.The WL-CT300 Organic Polymer Ceramic Fiberglass Cloth-Covered Copper Clad Laminate produced by Wangling. The WL-CT300 is a high-frequency material based on thermosetting resin, offering exceptional performance and versatility. Its composition includes hydrocarbon resin, ceramics, and fiberglass cloth in the dielectric layer, providing excellent low-loss characteristics essential for high-frequency designs. With simplified PCB processing compared to PTFE materials and superior stability and consistency in circuitry, the WL-CT300 is an ideal substitute for similar foreign products.
Key Features:
1. Dielectric constant of 3.0 at 10 GHz/23°C, ensuring reliable signal transmission in high-frequency applications.
2. Dissipation factor of 0.003 at 10 GHz, minimizing signal loss and maintaining signal integrity.
3. Excellent Thermal Coefficient of Dielectric Constant (TCDK) of 27 ppm/°C, ensuring stable performance across varying temperatures.
4. High thermal conductivity of 0.41 W/MK, facilitating efficient heat dissipation and thermal management.
5. Low moisture absorption of 0.15%, maintaining consistent electrical properties even in humid environments.
6. Matched copper coefficient of thermal expansion (CTE) in X-axis (15 ppm/°C), Y-axis (14 ppm/°C), and Z-axis (31 ppm/°C), reducing the risk of mechanical stress and ensuring dimensional stability.
PCB Stackup:
The WL-CT300 PCB features a 2-layer rigid construction with precise specifications:
- Copper_layer_1: 35 μm
- WL-CT300 core layer: 0.254 mm (10mil)
- Copper_layer_2: 35 μm
PCB Construction Details:
To meet your specific requirements, the WL-CT300 PCB offers the following construction details:
- Board dimensions: 167.8mm x 91.6mm, allowing for a single PCB in each order with a tight tolerance of +/- 0.15mm.
- Minimum Trace/Space: 4/5 mils, enabling intricate circuit designs and high packing density.
- Minimum Hole Size: 0.3mm, providing flexibility for component mounting.
- No blind vias, simplifying the manufacturing process.
- Finished board thickness: 0.3mm, contributing to its compact form factor.
- Finished copper weight: 1oz (1.4 mils) on the outer layers, ensuring robust conductivity and durability.
- Via plating thickness: 20 μm, promoting reliable interconnection between layers.
- Surface finish: Immersion Silver, enhancing solderability and corrosion resistance.
- No top or bottom silkscreen or solder mask, resulting in a clean and minimalistic appearance.
- Each PCB undergoes a thorough 100% electrical test prior to shipment, ensuring its adherence to quality standards.
PCB Statistics:
This PCB supports a total of 41 components, with 190 pads available for seamless component integration. It includes 141 thru-hole pads and 49 top surface mount technology (SMT) pads. There are no bottom SMT pads. With 162 vias and 2 nets, this PCB facilitates efficient signal routing and connectivity.
Artwork and Standards:
This PCB accepts Gerber RS-274-X artwork, simplifying the manufacturing process. It adheres to the IPC-Class-2 standard, ensuring high reliability and performance. This PCB is available worldwide, making it easily accessible for various applications.
Typical Applications:
The WL-CT300 PCB finds applications in a wide range of industries, including:
- Base station antennas and satellite antennas for reliable wireless communication.
- Automotive radar, sensors, and navigation systems for advanced driver assistance.
- Power amplifiers for efficient signal amplification.
- Satellite high-frequency heads for satellite communications.
- RF devices and filters for precise signal manipulation.
- WIMAX antennas and distributed antennas for wireless broadband communication.
With its exceptional characteristics, adherence to standards, and global availability, the WL-CT300 PCB is a reliable choice for high-frequency applications in various industries.
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