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Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold
Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

Large Image :  Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99/PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Material: F4BTM450 Core PCB Size: 63mm X 63 Mm=1PCS, +/- 0.15mm
Copper Weight: 1oz (1.4 Mils) Outer Layers Surface Finish: Immersion Gold
Layer Count: 2-layer PCB Thickness: 3.2mm
High Light:

Black Soldermask F4BTM PCB


Immersion Gold F4BTM PCB


3.2mm F4BTM PCB

Introducing our newly shipped PCB based on F4BTM. This series of advanced circuit laminates combines a glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, meticulously prepared using scientific techniques and rigorous pressing processes.

The F4BTM PCB series builds upon the F4BM dielectric layer, incorporating high-dielectric and low-loss nanoscale ceramics. This unique composition provides numerous benefits, including:


1. Enhanced Performance:
- Higher Dielectric Constant (Dk):
Achieve superior signal transmission with a Dk of 4.5 at 10 GHz, enabling efficient high-frequency operation.


- Low Dissipation Factor:
Experience minimal signal loss with a dissipation factor of 0.002 at 10 GHz, ensuring optimal performance in demanding applications.


- Improved Thermal Stability:
The F4BTM PCB exhibits a low coefficient of thermal expansion (CTE) with values of 10 ppm/°C (X-axis), 12 ppm/°C (Y-axis), and 51 ppm/°C (Z-axis) within the temperature range of -55°C to 288°C. This exceptional thermal stability ensures reliable performance under extreme temperature conditions.


- Consistent Dielectric Constant over Temperature:
Benefit from a low thermal coefficient of Dk at -60 ppm/°C within the temperature range of -55°C to 150°C, allowing for consistent signal integrity across varying thermal environments.


- Excellent Moisture Resistance:
With a moisture absorption rate of 0.05%, the F4BTM PCB offers exceptional resistance to moisture, ensuring long-term reliability even in humid conditions.


Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.


2. Versatile PCB Construction:

- 2-Layer Rigid PCB:
This PCB is a 2-layer rigid PCB, providing a robust foundation for your high-frequency designs.


- Superior Build Quality:
Featuring 35 μm copper layers on both the top and bottom sides and a 3.05 mm (120 mil) F4BTM450 core, this PCB offers excellent electrical conductivity and structural integrity.


- Precise Specifications:
The board dimensions measure 63 mm x 63 mm with a tolerance of +/- 0.15 mm, providing ample space for your circuitry. The minimum trace/space is 6/8 mils, and the minimum hole size is 0.4 mm, enabling intricate and compact designs.


- Reliable Plating and Surface Finish:
This RF PCB includes 20 μm via plating thickness for reliable interconnection. It is finished with an immersion gold surface finish, ensuring superior conductivity and protection against oxidation.


- Rigorous Quality Assurance:
Each PCB undergoes a comprehensive 100% electrical test prior to shipment, guaranteeing optimal functionality and performance.


PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz)
F4BTM298 2.98±0.06 0.0018
F4BTM300 3.0±0.06 0.0018
F4BTM320 3.2±0.06 0.0020
F4BTM350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..


Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 0


3. Wide Range of Applications:
The F4BTM PCB is suitable for various applications, including:

- Aerospace Equipment, Space, and Cabin Equipment
- Microwave and RF Systems
- Radar and Military Radar Systems
- Feed Networks
- Phase-Sensitive Antennas and Phased Array Antennas
- Satellite Communications


4. Global Availability and Quality Standards:
The F4BTM PCB is available worldwide, enabling you to access this advanced technology regardless of your location. It adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and consistent performance.


Unlock the potential of high-frequency circuitry with the F4BTM PCB. Experience unrivaled performance, outstanding reliability, and unparalleled design flexibility for your cutting-edge electronic projects.


Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 1

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

Send your inquiry directly to us (0 / 3000)