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Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
F4BTM450 Core
PCB Size:
63mm X 63 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
3.2mm
Highlight:

Black Soldermask F4BTM PCB

,

Immersion Gold F4BTM PCB

,

3.2mm F4BTM PCB

Product Description

Introducing our newly shipped PCB based on F4BTM. This series of advanced circuit laminates combines a glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, meticulously prepared using scientific techniques and rigorous pressing processes.

The F4BTM PCB series builds upon the F4BM dielectric layer, incorporating high-dielectric and low-loss nanoscale ceramics. This unique composition provides numerous benefits, including:

 

1. Enhanced Performance:
- Higher Dielectric Constant (Dk):
Achieve superior signal transmission with a Dk of 4.5 at 10 GHz, enabling efficient high-frequency operation.

 

- Low Dissipation Factor:
Experience minimal signal loss with a dissipation factor of 0.002 at 10 GHz, ensuring optimal performance in demanding applications.

 

- Improved Thermal Stability:
The F4BTM PCB exhibits a low coefficient of thermal expansion (CTE) with values of 10 ppm/°C (X-axis), 12 ppm/°C (Y-axis), and 51 ppm/°C (Z-axis) within the temperature range of -55°C to 288°C. This exceptional thermal stability ensures reliable performance under extreme temperature conditions.

 

- Consistent Dielectric Constant over Temperature:
Benefit from a low thermal coefficient of Dk at -60 ppm/°C within the temperature range of -55°C to 150°C, allowing for consistent signal integrity across varying thermal environments.

 

- Excellent Moisture Resistance:
With a moisture absorption rate of 0.05%, the F4BTM PCB offers exceptional resistance to moisture, ensuring long-term reliability even in humid conditions.

 

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

 

2. Versatile PCB Construction:

- 2-Layer Rigid PCB:
This PCB is a 2-layer rigid PCB, providing a robust foundation for your high-frequency designs.

 

- Superior Build Quality:
Featuring 35 μm copper layers on both the top and bottom sides and a 3.05 mm (120 mil) F4BTM450 core, this PCB offers excellent electrical conductivity and structural integrity.

 

- Precise Specifications:
The board dimensions measure 63 mm x 63 mm with a tolerance of +/- 0.15 mm, providing ample space for your circuitry. The minimum trace/space is 6/8 mils, and the minimum hole size is 0.4 mm, enabling intricate and compact designs.

 

- Reliable Plating and Surface Finish:
This RF PCB includes 20 μm via plating thickness for reliable interconnection. It is finished with an immersion gold surface finish, ensuring superior conductivity and protection against oxidation.

 

- Rigorous Quality Assurance:
Each PCB undergoes a comprehensive 100% electrical test prior to shipment, guaranteeing optimal functionality and performance.

 

PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz)
F4BTM298 2.98±0.06 0.0018
F4BTM300 3.0±0.06 0.0018
F4BTM320 3.2±0.06 0.0020
F4BTM350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 0

 

3. Wide Range of Applications:
The F4BTM PCB is suitable for various applications, including:

- Aerospace Equipment, Space, and Cabin Equipment
- Microwave and RF Systems
- Radar and Military Radar Systems
- Feed Networks
- Phase-Sensitive Antennas and Phased Array Antennas
- Satellite Communications

 

4. Global Availability and Quality Standards:
The F4BTM PCB is available worldwide, enabling you to access this advanced technology regardless of your location. It adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and consistent performance.

 

Unlock the potential of high-frequency circuitry with the F4BTM PCB. Experience unrivaled performance, outstanding reliability, and unparalleled design flexibility for your cutting-edge electronic projects.

 

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 1

products
PRODUCTS DETAILS
Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
F4BTM450 Core
PCB Size:
63mm X 63 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
3.2mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Black Soldermask F4BTM PCB

,

Immersion Gold F4BTM PCB

,

3.2mm F4BTM PCB

Product Description

Introducing our newly shipped PCB based on F4BTM. This series of advanced circuit laminates combines a glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, meticulously prepared using scientific techniques and rigorous pressing processes.

The F4BTM PCB series builds upon the F4BM dielectric layer, incorporating high-dielectric and low-loss nanoscale ceramics. This unique composition provides numerous benefits, including:

 

1. Enhanced Performance:
- Higher Dielectric Constant (Dk):
Achieve superior signal transmission with a Dk of 4.5 at 10 GHz, enabling efficient high-frequency operation.

 

- Low Dissipation Factor:
Experience minimal signal loss with a dissipation factor of 0.002 at 10 GHz, ensuring optimal performance in demanding applications.

 

- Improved Thermal Stability:
The F4BTM PCB exhibits a low coefficient of thermal expansion (CTE) with values of 10 ppm/°C (X-axis), 12 ppm/°C (Y-axis), and 51 ppm/°C (Z-axis) within the temperature range of -55°C to 288°C. This exceptional thermal stability ensures reliable performance under extreme temperature conditions.

 

- Consistent Dielectric Constant over Temperature:
Benefit from a low thermal coefficient of Dk at -60 ppm/°C within the temperature range of -55°C to 150°C, allowing for consistent signal integrity across varying thermal environments.

 

- Excellent Moisture Resistance:
With a moisture absorption rate of 0.05%, the F4BTM PCB offers exceptional resistance to moisture, ensuring long-term reliability even in humid conditions.

 

Product Technical Parameters Product Models & Data Sheet
Product Features Test Conditions Unit F4BTM298 F4BTM300 F4BTM320 F4BTM350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260 -55~+260 -55~+260 -55~+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

 

2. Versatile PCB Construction:

- 2-Layer Rigid PCB:
This PCB is a 2-layer rigid PCB, providing a robust foundation for your high-frequency designs.

 

- Superior Build Quality:
Featuring 35 μm copper layers on both the top and bottom sides and a 3.05 mm (120 mil) F4BTM450 core, this PCB offers excellent electrical conductivity and structural integrity.

 

- Precise Specifications:
The board dimensions measure 63 mm x 63 mm with a tolerance of +/- 0.15 mm, providing ample space for your circuitry. The minimum trace/space is 6/8 mils, and the minimum hole size is 0.4 mm, enabling intricate and compact designs.

 

- Reliable Plating and Surface Finish:
This RF PCB includes 20 μm via plating thickness for reliable interconnection. It is finished with an immersion gold surface finish, ensuring superior conductivity and protection against oxidation.

 

- Rigorous Quality Assurance:
Each PCB undergoes a comprehensive 100% electrical test prior to shipment, guaranteeing optimal functionality and performance.

 

PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM ) F4BTM DK (10GHz) DF (10 GHz)
F4BTM298 2.98±0.06 0.0018
F4BTM300 3.0±0.06 0.0018
F4BTM320 3.2±0.06 0.0020
F4BTM350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 0

 

3. Wide Range of Applications:
The F4BTM PCB is suitable for various applications, including:

- Aerospace Equipment, Space, and Cabin Equipment
- Microwave and RF Systems
- Radar and Military Radar Systems
- Feed Networks
- Phase-Sensitive Antennas and Phased Array Antennas
- Satellite Communications

 

4. Global Availability and Quality Standards:
The F4BTM PCB is available worldwide, enabling you to access this advanced technology regardless of your location. It adheres to the IPC-Class-2 quality standard, ensuring high-quality manufacturing and consistent performance.

 

Unlock the potential of high-frequency circuitry with the F4BTM PCB. Experience unrivaled performance, outstanding reliability, and unparalleled design flexibility for your cutting-edge electronic projects.

 

Double Sided F4BTM PCB 3.2mm with Black Soldermask and Immersion Gold 1

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