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F4BTME298 Rf Circuit Board 60mil 2-Layer Immersion Tin
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F4BTME298 Rf Circuit Board 60mil 2-Layer Immersion Tin
  • name

F4BTME298 Rf Circuit Board 60mil 2-Layer Immersion Tin

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
F4BTME298 Core
PCB Size:
51.51mm X 111.92 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Tin
Layer Count:
2-layer
PCB Thickness:
1.6mm
Highlight:

F4BTME298 rf circuit board

,

60mil rf circuit board

,

Immersion Tin rf board

Product Description

Introducing the F4BTME298 PCB, a high-performance printed circuit board engineered for demanding applications. This PCB is constructed using advanced F4BTME laminates, which are meticulously manufactured through a specialized process that combines glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. The result is a substrate that excels in high-frequency performance, thermal stability, and insulation.

 

Key Features
Dielectric Constant (Dk): 2.98 ±0.06 at 10 GHz, ensuring superior signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 10 GHz and 0.0023 at 20 GHz, minimizing energy loss.
Thermal Performance: Coefficient of thermal expansion (CTE) values of 15 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 78 ppm/°C (Z-axis), with operating temperatures from -55°C to 288°C.
Low Moisture Absorption: Only 0.05%, maintaining performance in humid conditions.
Passive Intermodulation (PIM): Outstanding performance with a PIM value of <-160 dBc.

 

Product Features Test Conditions Unit F4BTME298 F4BTME300 F4BTME320 F4BTME350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

 

PCB Stackup Configuration
This PCB features a robust 2-layer rigid stackup:

Copper Layer 1: 35 μm
Core Material: F4BTME298 (1.524 mm / 60 mil)
Copper Layer 2: 35 μm

 

This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) across the outer layers.

 

Construction Details
Board Dimensions: 51.51 mm x 111.92 mm (±0.15 mm)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
Vias: 41 total, with no blind vias included.
Surface Finish: Immersion Tin for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen and a green top solder mask; no bottom silkscreen or solder mask.
Each PCB undergoes rigorous 100% electrical testing prior to shipment to ensure reliability and performance.

 

Quality Assurance

This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.

 

Applications
The F4BTME298 PCB is ideal for a wide range of applications, including:

 

Aerospace and cabin equipment
Microwave and RF technologies
Military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
 

Availability

The F4BTME298 PCB is available for global, making it accessible for engineers and designers worldwide seeking high-performance solutions for their projects.

 

PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTME ) F4BTM DK (10GHz) DF (10 GHz)
F4BTME298 2.98±0.06 0.0018
F4BTME300 3.0±0.06 0.0018
F4BTME320 3.2±0.06 0.0020
F4BTME350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
F4BTME298 Rf Circuit Board 60mil 2-Layer Immersion Tin
  • name
F4BTME298 Rf Circuit Board 60mil 2-Layer Immersion Tin
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
F4BTME298 Core
PCB Size:
51.51mm X 111.92 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Tin
Layer Count:
2-layer
PCB Thickness:
1.6mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

F4BTME298 rf circuit board

,

60mil rf circuit board

,

Immersion Tin rf board

Product Description

Introducing the F4BTME298 PCB, a high-performance printed circuit board engineered for demanding applications. This PCB is constructed using advanced F4BTME laminates, which are meticulously manufactured through a specialized process that combines glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. The result is a substrate that excels in high-frequency performance, thermal stability, and insulation.

 

Key Features
Dielectric Constant (Dk): 2.98 ±0.06 at 10 GHz, ensuring superior signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 10 GHz and 0.0023 at 20 GHz, minimizing energy loss.
Thermal Performance: Coefficient of thermal expansion (CTE) values of 15 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 78 ppm/°C (Z-axis), with operating temperatures from -55°C to 288°C.
Low Moisture Absorption: Only 0.05%, maintaining performance in humid conditions.
Passive Intermodulation (PIM): Outstanding performance with a PIM value of <-160 dBc.

 

Product Features Test Conditions Unit F4BTME298 F4BTME300 F4BTME320 F4BTME350
Dielectric Constant (Typical) 10GHz / 2.98 3.0 3.2 3.5
Dielectric Constant Tolerance / / ±0.06 ±0.06 ±0.06 ±0.07
Loss Tangent (Typical) 10GHz / 0.0018 0.0018 0.0020 0.0025
20GHz / 0.0023 0.0023 0.0026 0.0035
Dielectric Constant Temperature Coefficient -55 º~150ºC PPM/℃ -78 -75 -75 -60
Peel Strength 1 OZ F4BTM N/mm >1.6 >1.6 >1.6 >1.6
1 OZ F4BTME N/mm >1.4 >1.4 >1.4 >1.4
Volume Resistivity Standard Condition MΩ.cm ≥1×10^7 ≥1×10^7 ≥1×10^7 ≥1×10^7
Surface Resistivity Standard Condition MΩ ≥1×10^6 ≥1×10^6 ≥1×10^6 ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >26 >30 >32 >32
Breakdown Voltage (XY direction) 5KW,500V/s KV >34 >35 >40 >40
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 15,16 15,16 13,15 10,12
Z direction -55 º~288ºC ppm/ºC 78 72 58 51
Thermal Stress 260℃, 10s,3 times No delamination No delamination No delamination No delamination
Water Absorption 20±2℃, 24 hours % ≤0.05 ≤0.05 ≤0.05 ≤0.05
Density Room Temperature g/cm3 2.25 2.25 2.20 2.20
Long-Term Operating Temperature High-Low Temperature Chamber ℃ -55～+260 -55～+260 -55～+260 -55～+260
Thermal Conductivity Z direction W/(M.K) 0.42 0.42 0.50 0.54
PIM Only applicable to F4BTME dBc ≤-160 ≤-160 ≤-160 ≤-160
Flammability / UL-94 V-0 V-0 V-0 V-0
Material Composition / / PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil.

 

PCB Stackup Configuration
This PCB features a robust 2-layer rigid stackup:

Copper Layer 1: 35 μm
Core Material: F4BTME298 (1.524 mm / 60 mil)
Copper Layer 2: 35 μm

 

This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) across the outer layers.

 

Construction Details
Board Dimensions: 51.51 mm x 111.92 mm (±0.15 mm)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
Vias: 41 total, with no blind vias included.
Surface Finish: Immersion Tin for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen and a green top solder mask; no bottom silkscreen or solder mask.
Each PCB undergoes rigorous 100% electrical testing prior to shipment to ensure reliability and performance.

 

Quality Assurance

This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.

 

Applications
The F4BTME298 PCB is ideal for a wide range of applications, including:

 

Aerospace and cabin equipment
Microwave and RF technologies
Military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
 

Availability

The F4BTME298 PCB is available for global, making it accessible for engineers and designers worldwide seeking high-performance solutions for their projects.

 

PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTME ) F4BTM DK (10GHz) DF (10 GHz)
F4BTME298 2.98±0.06 0.0018
F4BTME300 3.0±0.06 0.0018
F4BTME320 3.2±0.06 0.0020
F4BTME350 3.5±0.07 0.0025
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..
Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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