|
Product Details:
Payment & Shipping Terms:
|
| Material: | F4BTME298 Core | PCB Size: | 51.51mm X 111.92 Mm=1PCS, +/- 0.15mm |
|---|---|---|---|
| Copper Weight: | 1oz (1.4 Mils) Outer Layers | Surface Finish: | Immersion Tin |
| Layer Count: | 2-layer | PCB Thickness: | 1.6mm |
| High Light: | F4BTME298 rf circuit board,60mil rf circuit board,Immersion Tin rf board |
||
Introducing the F4BTME298 PCB, a high-performance printed circuit board engineered for demanding applications. This PCB is constructed using advanced F4BTME laminates, which are meticulously manufactured through a specialized process that combines glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. The result is a substrate that excels in high-frequency performance, thermal stability, and insulation.
Key Features
Dielectric Constant (Dk): 2.98 ±0.06 at 10 GHz, ensuring superior signal integrity.
Dissipation Factor: Exceptionally low at 0.0018 at 10 GHz and 0.0023 at 20 GHz, minimizing energy loss.
Thermal Performance: Coefficient of thermal expansion (CTE) values of 15 ppm/°C (X-axis), 16 ppm/°C (Y-axis), and 78 ppm/°C (Z-axis), with operating temperatures from -55°C to 288°C.
Low Moisture Absorption: Only 0.05%, maintaining performance in humid conditions.
Passive Intermodulation (PIM): Outstanding performance with a PIM value of <-160 dBc.
| Product Features | Test Conditions | Unit | F4BTME298 | F4BTME300 | F4BTME320 | F4BTME350 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.98 | 3.0 | 3.2 | 3.5 | |
| Dielectric Constant Tolerance | / | / | ±0.06 | ±0.06 | ±0.06 | ±0.07 | |
| Loss Tangent (Typical) | 10GHz | / | 0.0018 | 0.0018 | 0.0020 | 0.0025 | |
| 20GHz | / | 0.0023 | 0.0023 | 0.0026 | 0.0035 | ||
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -78 | -75 | -75 | -60 | |
| Peel Strength | 1 OZ F4BTM | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | |
| 1 OZ F4BTME | N/mm | >1.4 | >1.4 | >1.4 | >1.4 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | ≥1×10^7 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >32 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >34 | >35 | >40 | >40 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 15,16 | 15,16 | 13,15 | 10,12 |
| Z direction | -55 º~288ºC | ppm/ºC | 78 | 72 | 58 | 51 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.05 | ≤0.05 | ≤0.05 | ≤0.05 | |
| Density | Room Temperature | g/cm3 | 2.25 | 2.25 | 2.20 | 2.20 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.42 | 0.42 | 0.50 | 0.54 | |
| PIM | Only applicable to F4BTME | dBc | ≤-160 | ≤-160 | ≤-160 | ≤-160 | |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth, nano-ceramics F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
||||
PCB Stackup Configuration
This PCB features a robust 2-layer rigid stackup:
Copper Layer 1: 35 μm
Core Material: F4BTME298 (1.524 mm / 60 mil)
Copper Layer 2: 35 μm
This configuration results in a finished board thickness of 1.6 mm, with a total copper weight of 1 oz (1.4 mils) across the outer layers.
Construction Details
Board Dimensions: 51.51 mm x 111.92 mm (±0.15 mm)
Minimum Trace/Space: 6/5 mils
Minimum Hole Size: 0.3 mm
Vias: 41 total, with no blind vias included.
Surface Finish: Immersion Tin for excellent solderability.
Silkscreen and Solder Mask: Features a white top silkscreen and a green top solder mask; no bottom silkscreen or solder mask.
Each PCB undergoes rigorous 100% electrical testing prior to shipment to ensure reliability and performance.
Quality Assurance
This PCB meets the IPC-Class-2 quality standard, ensuring high reliability for various applications.
Applications
The F4BTME298 PCB is ideal for a wide range of applications, including:
Aerospace and cabin equipment
Microwave and RF technologies
Military radar systems
Feed networks
Phase-sensitive and phased array antennas
Satellite communications
Availability
The F4BTME298 PCB is available for global, making it accessible for engineers and designers worldwide seeking high-performance solutions for their projects.
| PCB Material: | PTFE / glass fiber cloth / Nano-ceramic filler | ||
| Designation (F4BTME ) | F4BTM | DK (10GHz) | DF (10 GHz) |
| F4BTME298 | 2.98±0.06 | 0.0018 | |
| F4BTME300 | 3.0±0.06 | 0.0018 | |
| F4BTME320 | 3.2±0.06 | 0.0020 | |
| F4BTME350 | 3.5±0.07 | 0.0025 | |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB | ||
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (or overall thickness) | 0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm | ||
| PCB size: | ≤400mm X 500mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
