3mm F4BTME300 PCB Board Double Sided Immersion Silver

Introducing our newly shipped PCB which based on F4BTME300 laminates. The F4BTME300 is a member of the F4BTME series laminates, sets new standards in performance and reliability for advanced electronic applications. Manufactured using a meticulous process that combines glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin, these substrates incorporate cutting-edge technologies to deliver exceptional results.

Built upon the F4BM dielectric layer, the F4BTME laminates feature high dielectric constant and low-loss nano-ceramics. This integration results in an enhanced dielectric constant, superior heat resistance, reduced thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, all while maintaining low loss characteristics. The laminates are expertly paired with reverse-treated RTF copper foil, ensuring outstanding performance in terms of PIM, precise line control, and minimized conductor loss.

Key Features:

This PCB boasts an impressive array of features that make it an ideal choice for a wide range of applications:

1. Dielectric Constant (Dk): With a Dk of 3.5 at 10GHz, this PCB offers excellent signal integrity and efficient transmission capabilities.

2. Dissipation Factor: The F4BTME300 exhibits a low dissipation factor of .0018 at 10GHz and 0.0023 at 20GHz, enabling minimal signal loss and superior performance.

3. Thermal Stability: With a CTE (Coefficient of Thermal Expansion) of 15 ppm/°C in the x-axis, 16 ppm/°C in the y-axis, and 78 ppm/°C in the z-axis, this PCB maintains stability across a wide temperature range of -55°C to 288°C.

4. Low Thermal Coefficient: The F4BTME300 features a low thermal coefficient of Dk at -75 ppm/°C in the temperature range of -55°C to 150°C, ensuring consistent performance in challenging environments.

5. PIM Performance: With a PIM value of less than -160 dbc, this PCB guarantees minimal interference and superior signal quality.

6. Moisture Absorption: The F4BTME300 demonstrates excellent moisture resistance, with a moisture absorption rate of only 0.05%.

PCB Stackup and Construction Details:

This newly shipped PCB is a 2-layer rigid PCB designed to meet the demands of high-performance applications. Its construction details are as follows:

- Board Dimensions: Measuring 170mm x 95mm with a tolerance of +/- 0.15mm, this PCB provides ample space for component placement and routing.

- Minimum Trace/Space: With a minimum trace/space requirement of 7/7 mils, it enables precise and intricate circuit designs.

- Minimum Hole Size: Supporting holes as small as 0.4mm, this PCB accommodates miniaturized components and ensures efficient assembly.

- Finished Board Thickness: The finished board thickness is 3.1mm, providing robustness and durability.

- Surface Finish: This PCB features an immersion silver surface finish, offering excellent solderability and oxidation resistance.

- Silkscreen and Solder Mask: The top silkscreen is white, providing clear component labeling, while the top solder mask is black, offering optimal protection and insulation.

- Electrical Testing: Each PCB undergoes a rigorous 100% electrical test before shipment, ensuring the highest quality and reliability.

Typical Applications:

The F4BTME300 PCB is well-suited for a wide range of advanced applications, including:

- Aerospace Equipment: It meets the stringent requirements of aerospace equipment, both in space and cabin settings.

- Microwave and RF Applications: The F4BTME300 excels in microwave and RF systems, delivering exceptional performance and reliability.

- Radar Systems: Military radar and other radar applications benefit from the high-quality signal transmission and low interference provided by this PCB.

- Antenna Systems: Whether it's feed networks, phase-sensitive antennas, or phased array antennas, the F4BTME300 ensures optimal performance and signal integrity.

- Satellite Communications: This PCB is an ideal choice for satellite communication systems, offering reliability and stability in demanding environments.