Introducing our newly shipped PCB based on F4BM265, an advanced high-performance PCB developed by Wangling. Scientifically formulated and precisely pressed, F4BM265 combines fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film to deliver exceptional electrical performance and enhanced stability. With improved characteristics compared to F4B265, this laminate offers lower dielectric loss, increased insulation resistance, and enhanced stability, making it a viable alternative to similar foreign products for various applications.
Features:
- Impressive Electrical Performance:F4BM265 exhibits remarkable electrical properties, including a dielectric constant (Dk) of 2.65 at 10GHz, ensuring efficient signal transmission. With a dissipation factor of 0.0013 at 10GHz, it minimizes signal loss, enhancing overall performance.
-Enhanced Dimensional Stability:F4BM265 achieves precise control of the dielectric constant by adjusting the ratio of PTFE to fiberglass cloth, resulting in exceptional dimensional stability. It offers lower thermal expansion, improved temperature drift, and a slight increase in dielectric loss, ensuring reliable operation in demanding environments.
- Optimal Thermal Management: F4BM265 has a low coefficient of thermal expansion (CTE) of 14 ppm/°C (x-axis), 17 ppm/°C (y-axis), and 142 ppm/°C (z-axis) over a temperature range of -55°C to 288°C. This ensures stability and reliability, even in extreme temperature conditions.
- Excellent Moisture Resistance: With a moisture absorption rate of less than 0.08%, F4BM265 demonstrates high resistance to moisture, safeguarding the PCB's performance and longevity.
- Dependable Safety: F4BM265 meets UL-94 V0 flammability standards, complying with stringent safety regulations.
| Product Technical Parameters |
Product Model & Data Sheet |
| Product Features |
Test Conditions |
Unit |
F4BM217 |
F4BM220 |
F4BM233 |
F4BM245 |
F4BM255 |
F4BM265 |
F4BM275 |
F4BM294 |
F4BM300 |
| Dielectric Constant (Typical) |
10GHz |
/ |
2.17 |
2.2 |
2.33 |
2.45 |
2.55 |
2.65 |
2.75 |
2.94 |
3.0 |
| Dielectric Constant Tolerance |
/ |
/ |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.05 |
±0.05 |
±0.05 |
±0.06 |
±0.06 |
| Loss Tangent (Typical) |
10GHz |
/ |
0.001 |
0.001 |
0.0011 |
0.0012 |
0.0013 |
0.0013 |
0.0015 |
0.0016 |
0.0017 |
| 20GHz |
/ |
0.0014 |
0.0014 |
0.0015 |
0.0017 |
0.0018 |
0.0019 |
0.0021 |
0.0023 |
0.0025 |
| Dielectric Constant Temperature Coefficient |
-55ºC～150ºC |
PPM/℃ |
-150 |
-142 |
-130 |
-120 |
-110 |
-100 |
-92 |
-85 |
-80 |
| Peel Strength |
1 OZ F4BM |
N/mm |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
| 1 OZ F4BME |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
| Volume Resistivity |
Standard Condition |
MΩ.cm |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
| Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
| Electrical Strength (Z direction) |
5KW,500V/s |
KV/mm |
>23 |
>23 |
>23 |
>25 |
>25 |
>25 |
>28 |
>30 |
>30 |
| Breakdown Voltage (XY direction) |
5KW,500V/s |
KV |
>30 |
>30 |
>32 |
>32 |
>34 |
>34 |
>35 |
>36 |
>36 |
| Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
2,534 |
2,534 |
2,230 |
2,025 |
1,621 |
1,417 |
1,416 |
1,215 |
1,215 |
| Z direction |
-55 º~288ºC |
ppm/ºC |
240 |
240 |
205 |
187 |
173 |
142 |
112 |
98 |
95 |
| Thermal Stress |
260℃, 10s,3 times |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
| Water Absorption |
20±2℃, 24 hours |
% |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
| Density |
Room Temperature |
g/cm3 |
2.17 |
2.18 |
2.20 |
2.22 |
2.25 |
2.25 |
2.28 |
2.29 |
2.29 |
| Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
| Thermal Conductivity |
Z direction |
W/(M.K) |
0.24 |
0.24 |
0.28 |
0.30 |
0.33 |
0.36 |
0.38 |
0.41 |
0.42 |
| PIM |
Only applicable to F4BME |
dBc |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
| Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
| Material Composition |
/ |
/ |
PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
PCB Construction and Specifications:
It is utilized as a 2-layer rigid PCB with a core thickness of 3.00mm (118mil). The copper foil thickness for both layers is 70 μm, ensuring optimal conductivity. The finished board dimensions are precisely maintained at 45.33mm x 50.2mm with a tolerance of +/- 0.15mm. Supporting fine trace widths and spacing, the PCB has a minimum requirement of 5/5 mils. It accommodates holes as small as 0.5mm.
The finished board thickness is 3.1mm, providing robustness and durability. The outer layers feature a copper weight of 1oz (1.4 mils). Via plating thickness is 20 μm, ensuring reliable interconnectivity. The surface finish is a lead-free HASL, while the top solder mask is black for improved visibility during assembly. Prior to shipment, each PCB undergoes a comprehensive 100% electrical test, guaranteeing optimal functionality.
Applications:
F4BM265 PCBs find extensive use in various applications, including:
- Microwave, RF, and radar systems
- Phase shifters
- Power dividers, couplers, and combiners
- Feed networks
- Phase-sensitive antennas and phased array antennas
- Satellite communications
- Base station antennas
| PCB Material: |
PTFE glass fiber cloth copper clad laminates |
| Designation (F4BM ) |
F4BM |
DK (10GHz) |
DF (10 GHz) |
| F4BM217 |
2.17±0.04 |
0.0010 |
| F4BM220 |
2.20±0.04 |
0.0010 |
| F4BM233 |
2.33±0.04 |
0.0011 |
| F4BM245 |
2.45±0.05 |
0.0012 |
| F4BM255 |
2.55±0.05 |
0.0013 |
| F4BM265 |
2.65±0.05 |
0.0013 |
| F4BM275 |
2.75±0.05 |
0.0015 |
| F4BM294 |
2.94±0.06 |
0.0016 |
| F4BM300 |
3.00±0.06 |
0.0017 |
| Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness (or overall thickness) |
0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
Quality and Availability:
This PCB adhere to IPC-Class-2 quality standards, ensuring reliability and consistent performance. These high-performance laminates are readily available worldwide, offering easy accessibility to designers and manufacturers seeking top-notch PCB solutions for their projects.
Unlock the potential of F4BM265 and experience unparalleled performance, stability, and reliability in your high-frequency applications. Choose Wangling's F4BM265 to elevate your designs to new heights of excellence.
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