2 Layer RT Duroid 6002 25mil PCB Substrate Immersion Gold Plating

Our latest shipment of high-quality PCBs is delightedly introduced, aimed at elevating electronic designs to new heights. Meticulous attention is given to superior materials and precise construction, ensuring unparalleled performance, reliability, and flexibility.

At the core of the PCBs lies the utilization of Rogers RT/duroid 6002 Ceramic-filled PTFE composites, renowned for their exceptional properties. Optimal signal integrity is achieved with a process DK of 2.94 at 10 GHz/23°C, while efficient power transmission is ensured with an impressively low dissipation factor of 0.0012 at 10 GHz/23°C. A high thermal stability of Td> 500°C allows our PCBs to withstand demanding high-temperature environments, rendering them suitable for diverse applications. The operational range spans from -40℃ to +85℃, enabling seamless performance in a variety of conditions.

The 2-layer rigid PCB construction is meticulously engineered to optimize functionality. Excellent conductivity and efficient signal transfer are facilitated by the copper layers, each featuring a thickness of 35 μm. Durability and robustness are achieved through the utilization of a substrate made of RT/duroid 6002 at 0.635 mm (25mil). The absence of blind vias simplifies assembly and maintenance processes, ensuring ease of use.

Exceptional performance is further ensured through precise construction details. Board dimensions of 211.74mm x 90 mm (1PCS) and a tolerance of +/- 0.15mm guarantee a perfect fit for your applications. Intricate and detailed designs are made possible by the minimum trace/space requirement of 5/5 mils, while versatile component integration is facilitated by the minimum hole size of 0.35mm.

To guarantee reliability, a rigorous 100% electrical test is conducted on the PCBs prior to shipment. This ensures adherence to the highest quality standards and optimal functionality. The finished board thickness of 0.76mm strikes the ideal balance between durability and flexibility. Excellent corrosion resistance is provided by the immersion gold surface finish, ensuring long-term reliability. Efficient soldering and protection are facilitated by the green solder mask on both the top and bottom layers, while a sleek and minimalist appearance is maintained through the absence of silkscreen on either side.

These PCBs cater to a wide range of design requirements, boasting 58 components and a total of 176 pads. This includes 140 thru-hole pads and 36 top SMT pads. With 190 vias and 11 well-defined nets, efficient and organized signal paths are established.

Artwork in the Gerber RS-274-X format is accepted, ensuring compatibility with industry-standard design tools. Our PCBs adhere to the IPC-Class-2 compliance standard, meeting stringent quality and manufacturing requirements.

Global availability is proudly offered, ensuring accessibility to our PCBs worldwide. For any technical inquiries or questions, exceptional support and guidance are provided by our dedicated team. Contact can be made with Ivy at sales10@bichengpcb.com to unlock the full potential of our advanced PCB technology.

Discover the Advanced Capabilities of RT/duroid 6002 PCBs

RT/duroid 6002 boasts a precise dielectric constant (εProcess) of 2.94±0.04 at 10 GHz/23℃, meeting IPC-TM-650 2.5.5.5 standards. With a low dissipation factor (tanδ) of 0.0012 at 10 GHz/23℃, these PCBs guarantee optimal signal integrity and efficient power transmission.

Thermal stability is a standout feature, with a thermal coefficient of ε of +12 ppm/℃ from 0℃ to 100℃ at 10 GHz, according to IPC-TM-650 2.5.5.5. This ensures the PCBs can withstand high-temperature environments. They also exhibit a high volume resistivity of 106 Mohm.cm and a surface resistivity of 107 Mohm, meeting ASTM D 257 testing requirements.

Mechanical properties are crucial, and our PCBs excel in this regard. With a tensile modulus of 828 MPa (120 kpsi) in the X and Y directions at 23℃ (ASTM D 638), they can withstand external forces without deformation. The ultimate stress is measured at 6.9 MPa (1.0 kpsi), and the ultimate strain for the X and Y directions is 7.3%, indicating their maximum load-bearing capacity.

Compressive properties are equally impressive, with a compressive modulus of 2482 MPa (360 kpsi) in the Z direction (ASTM D 638). This ensures structural integrity under compression forces.

Moisture absorption is minimal at 0.02% (D48/50 and IPC-TM-650 2.6.2.1), ensuring long-term stability, even in humid environments.

These PCBs exhibit a thermal conductivity of 0.6 W/m/k at 80℃ (ASTM C518), facilitating efficient heat dissipation and preventing overheating.

With a coefficient of thermal expansion ranging from 16 to 24 ppm/℃ in the X, Y, and Z directions at 23℃/50% RH (IPC-TM-650 2.4.41), these PCBs can withstand temperature variations without mechanical stress.

They have a decomposition temperature (Td) of 500℃ (ASTM D 3850), enabling them to withstand high temperatures during manufacturing and operation.

Other notable properties include a density of 2.1 gm/cm3 (ASTM D 792) and a specific heat of 0.93 j/g/k (0.22 BTU/ib/OF), calculated values.

The PCBs achieve a V-0 rating in the UL 94 flammability test, ensuring resistance to ignition. They are also compatible with lead-free processes, aligning with environmentally friendly manufacturing practices.