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2 Layer High Frequency Circuit Board RT / Duroid 5880 ENIG PCB

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2 Layer High Frequency Circuit Board RT / Duroid 5880 ENIG PCB

Detailed Product Description
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2 Layer High Frequency Circuit Board


ENIG PCB Circuit Board


Duroid 5880 PCB Board

When it comes to a printed circuit board (PCB), selecting the right material, stackup, and construction details can make all the difference. In this article, we will provide an overview of a specific PCB that utilizes RT/duroid 5880 PTFE Random Glass Fiber material and has a 2-layer rigid stackup.


The PCB Material is RT/duroid 5880. This material is known for its high performance, low loss, and lead-free composition, making it more environmentally friendly. It can operate within a temperature range of -40℃ to +85℃.


The stackup for this 2-layer rigid PCB consists of a finished copper thickness of 35um, an RT/duroid 5880 dielectric thickness of 31mil, and another finished copper thickness of 35um. The finished board thickness is 0.9mm, and the finished copper weight is 1 oz (1.4 mils) for all layers.

The via plating thickness is 1 mil, and the surface finish is Electroless Nickle Immersion Gold (ENIG). There is no top or bottom silkscreen or solder mask, and there are no silkscreen on the solder pads.


Regarding construction details, the PCB has a dimension of 195mm x 182mm, with a tolerance of +/- 0.15mm. The minimum trace/space is 4/7 mils, and the minimum hole size is 0.25mm. There are no blind or buried vias, and the PCB has undergone 100% electrical testing to ensure its quality.


The PCB contains 54 components, 91 total pads, 39 thru-hole pads, and 52 top SMT pads, with 43 vias and 12 nets. This design uses PCBDOC artwork, and it conforms to the IPC-Class-II standard. Our service area is worldwide, and if you have any technical questions about this specific PCB, please don't hesitate to contact Ivy at


In conclusion, selecting the right materials and construction details for a PCB is crucial for achieving optimal performance and functionality. This article has provided an overview of the specific PCB material, stackup, and construction details for this particular design, emphasizing the importance of considering specific requirements for each project. At bicheng, we specialize in supplying high-quality PCBs that meet the highest standards of quality and performance. Contact us today to learn more about how we can help you with your next project.


2 Layer High Frequency Circuit Board RT / Duroid 5880 ENIG PCB 0


Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
1 MHz IPC-TM-650
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
Z N/A C24/23/50
1 MHz IPC-TM-650
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A


More about bicheng.


Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress inspection, outgoing delivery inspection and customer service etc.


Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 and ISO14001.


Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.


2 Layer High Frequency Circuit Board RT / Duroid 5880 ENIG PCB 1


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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