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Our custom-made 2-layer rigid PCB has been supplied to meet the unique requirements of our clients. Taconic RF-35TC high frequency PCB's are PTFE based, ceramic filled fiberglass laminates which provide low dissipation factor and high thermal conductivity.
The extremely low dissipation factor of 0.0011 and high thermal conductivity of 0.87 W/mK are particularly suited for power amplifier applications. The heat is diffused away from both transmission lines and surface mount components such as transistors or capacitors.
RF-35TC PCB's have very low coefficient thermal expansion (CTE) on X, Y and Z axis (11, 13 and 34 ppm/°C respectively). Low CTE values on X and Y axis are crucial for maintaining critical distances between trace elements in a printed filter; low Z-axis CTE and stable Dk are critical for both narrow band and broad band overlay couplers.
|RF-35TC TYPICAL VALUES|
|DK @10 GHz||IPC-650 220.127.116.11.1(modified)||3.5||3.5|
|Tck(-30 to 120℃)||IPC-650 18.104.22.168.1(modified)||ppm||24||ppm||24|
|Df @10 GHz||IPC-650 22.214.171.124.1(modified)||0.0011||0.0011|
|Dielectric Breakdown||IPC-650 2.5.6(in-Plane,Two Pins in Oil)||kV||56.7||kV||56.7|
|Dielectric Strength||ASTM D 149(Through Plane)||V/mil||570||V/mm||22,441|
|Arc Resistance||IPC-650 2.5.1||Seconds||304||Seconds||304|
|Moisture Absorption||IPC-650 126.96.36.199||%||0.05||%||0.05|
|Flexural Strength(MD)||ASTM D 790/IPC-650 2.4.4||psi||12,900||N/mm2||88.94|
|Flexural Strength(CD)||ASTM D 790/IPC-650 2.4.4||psi||11,700||N/mm2||80.67|
|Tensile Strength(MD)||ASTM D 3039/IPC-TM-650 2.4.19||psi||9,020||N/mm2||62.19|
|Tensile Strength(CD)||ASTM D 3039/IPC-TM-650 2.4.19||psi||7,740||N/mm2||53.37|
|Elongation at Break(MD)||ASTM D 3039/IPC-TM-650 2.4.19||%||1.89||N/mm||1.89|
|Elongation at Break(CD)||ASTM D 3039/IPC-TM-650 2.4.19||%||1.7||%||1.7|
|Young's Modulus(MD)||ASTM D 3039/IPC-TM-650 2.4.19||psi||667,000||N/mm2||4,599|
|Young's Modulus(CD)||ASTM D 3039/IPC-TM-650 2.4.19||psi||637,000||N/mm2||4,392|
|Poisson's Ratio(MD)||ASTM D 3039/IPC-TM-650 2.4.19||0.18||0.18|
|Poisson's Ratio(CD)||ASTM D 3039/IPC-TM-650 2.4.19||0.23||0.18|
|Compressive Modulus||ASTM D 695(23℃)||psi||560,000||N/mm2||3,861|
|Flexural Strength(MD)||ASTM D 790/IPC-650 2.4.4||psi||1.46 x 106||N/mm2||10,309|
|Flexural Strength(CD)||ASTM D 790/IPC-650 2.4.4||psi||1.50 x 106||N/mm2||10,076|
|Peel Stength(½ oz.CVH)||IPC-650 2.4.8(Thermal Stress.)||Ibs./inch||7||g/cm3||1.25|
|Thermal Conductivity(Unclad,125℃)||ASTM F433(Guarded Heat Flow)||W/(mK)||0.6||W/(mK)||0.6|
|Thermal Conductivity(C1/C1,125℃)||ASTM F433(Guarded Heat Flow)||W/(mK)||0.92||W/(mK)||0.92|
|Thermal Conductivity(CH/CH,125℃)||ASTM F433(Guarded Heat Flow)||W/(mK)||0.87||W/(mK)||0.87|
|Dimensional Stability(MD)||IPC-650-2.4.39 Sec.5.4(After Etch)||mils/in.||0.23||mm/M||0.23|
|Dimensional Stability(CD)||IPC-650-2.4.39 Sec.5.4(After Etch)||mils/in.||0.64||mm/M||0.64|
|Dimensional Stability(MD)||IPC-650-2.4.39 Sec.5.5(Thermal Stress.)||mils/in.||-0.04||mm/M||-0.04|
|Dimensional Stability(CD)||IPC-650-2.4.39 Sec.5.5(Thermal Stress.)||mils/in.||0.46||mm/M||0.46|
|Surface Resistivity||IPC-650 188.8.131.52(after elevated temp.)||Mohms||8.33 x 107||Mohms||8.33 x 107|
|Surface Resistivity||IPC-650 184.108.40.206(after humidity)||Mohms||6.42 x 107||Mohms||6.42 x 107|
|Volume Resistivity||IPC-650 220.127.116.11(after elevated temp.)||Mohms/cm||5.19 x 108||Mohms/cm||5.19 x 108|
|Volume Resistivity||IPC-650 18.104.22.168(after humidity)||Mohms/cm||2.91 x 108||Mohms/cm||2.91 x 108|
|CTE(X axis)(25-260℃)||IPC-650 2.4.41/ASTM D 3386||ppm/℃||11||ppm/℃||11|
|CTE(Y axis)(25-260℃)||IPC-650 2.4.41/ASTM D 3386||ppm/℃||13||ppm/℃||13|
|CTE(Z axis)(25-260℃)||IPC-650 2.4.41/ASTM D 3386||ppm/℃||34||ppm/℃||34|
|Density||ASTM D 792||g/cm3||2.35||g/cm3||2.35|
|Hardness||ASTM D 2240(Shore D)||79.1||79.1|
|Strain at Break(MD)||ASTM D 790/IPC-650 2.4.4||%||0.014||%||0.014|
|Strain at Break(CD)||ASTM D 790/IPC-650 2.4.4||%||0.013||%||0.013|
|Specific Heat||ASTM E 1269-05,E 967-08,E968-02||j/(g℃)||0.94||j/(g℃)||0.94|
|Td(2% Weight Loss)||IPC-650 22.214.171.124/TGA||oF||788||℃||420|
|Td(5% Weight Loss)||IPC-650 126.96.36.199/TGA||oF||817||℃||436|
The PCB material is compatible with a lead-free process and can operate within a temperature range of -40℃ to +85℃, making it ideal for use in harsh environments. The stackup consists of finished copper of 35um, RF-35 dielectric of 30 mil (0.762mm), and finished copper of 35um, providing excellent signal integrity and performance.
The construction details include a board dimension of 110mm x 92mm (1PCS, +/- 0.15mm), minimum trace/space of 5/5 mils, and a minimum hole size of 0.35mm. The PCB has no blind or buried vias, and the finished board thickness is 0.8mm. The finished Cu weight is 1 oz (1.4 mils) all layers, and via plating thickness is 1 mil. A surface finish of Hot Air Soldering Level (HASL) has been used, and the top silkscreen is white. The top solder mask is green, and there is no bottom silkscreen or bottom solder mask. The PCB has no silkscreen on solder pads, and a 100% electrical test has been used to ensure the highest quality.
The PCB includes 35 components, 98 total pads, 61 thru-hole pads, 37 top SMT pads, 0 bottom SMT pads, 104 vias, and 15 nets, meeting the IPC-Class-2 standard.
At Bicheng PCB, we understand the importance of meeting the unique requirements of our clients. This is why we offer custom-made PCB solutions that meet their specific needs.
The Gerber RS-274-X artwork was supplied by the customer.We will provide PCB as per their specific requirements. Our PCB services are available worldwide. If there are any technical questions or further assistance needed, please contact Ivy at email@example.com.
Bicheng PCB is committed to providing the highest quality custom-made PCB solutions that meet the specific needs of our clients. Trust us to provide you with a customized PCB solution that meets your requirements and exceeds your expectations. Contact us to learn more about our custom-made 2-layer rigid PCB solutions and experience the highest level of performance and reliability.
Contact Person: Ms. Ivy Deng