|
Product Details:
Payment & Shipping Terms:
|
| Base Material: | TLY-5Z 0.762mm | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 0.8 Mm ±0.1 | PCB Size: | 72 X 55mm=1up |
| Solder Mask: | Green | Silkscreen: | White |
| Copper Weight: | 1oz | Surface Finish: | Immersion Gold |
| High Light: | TLY-5Z PCB Material,0.8mm PCB Board,Immersion Gold PCB Material |
||
TLY-5Z PCB: A High-Performance Solution for Demanding Applications
TLY-5Z PCB is a type of printed circuit board that is widely used in many different applications due to its high performance and reliability. This type ofPCB is commonly used in industries such as telecommunications, consumer electronics, computers, and automotive applications. In this article, we'll beexploring the key characteristics and advantages of TLY-5Z PCB, as well as some of the industries and applications in which it is commonly used.
Key Characteristics and Advantages
TLY-5Z PCB is characterized by its high thermal conductivity and excellent electrical insulation properties. These properties make it ideal for use inhigh-performance applications where heat dissipation and electrical insulation are critical. Additionally, TLY-5Z PCB is known for its high reliability anddurability, making it a popular choice for use in harsh environments and demanding applications.
One of the key advantages of TLY-5Z PCB is its ability to handle high-frequency signals without signal loss or degradation. This makes it an idealchoice for applications such as radio frequency (RF) amplifiers, high-speed data transfer, and microwave communications, among others.
Industries and Applications
TLY-5Z PCB is widely used in the telecommunications industry, particularly in the construction of cellular base stations and other telecommunications infrastructure. Its high thermal conductivity and electrical insulation properties make it an ideal choice for use in equipment that generates a significantamount of heat, such as high-power amplifiers and transmitters.
In the consumer electronics industry, TLY-5Z PCB is commonly used in the construction of high-performance audio equipment, such as amplifiers andspeakers. Its ability to handle high-frequency signals without signal loss or degradation makes it an ideal choice for use in audio equipment thatrequires high clarity and fidelity.
TLY-5Z PCB is also frequently used in the automotive industry, particularly in the construction of high-performance engine control units (ECUs) andother electronic control systems. Its high thermal conductivity and reliability make it an ideal choice for use in harsh environments and demandingapplications, such as those found in high-performance automobiles.
Conclusion
In conclusion, TLY-5Z PCB is a high-performance and reliable type of printed circuit board that is widely used in many different industries andapplications. Its high thermal conductivity, electrical insulation properties, and ability to handle high-frequency signals make it an ideal choice for use inhigh-performance applications that require heat dissipation, electrical insulation, and signal clarity.
Our Advantages
1. PCB Products and Manufacturing are certified by authorized organizations;
2. Quick CADCAM checking and free PCB quotation;
3. A Team with passion, discipline, responsibility and honesty;
4. Delivery on time: >98%, Customer complaint rate: <1%
5. IPC Class 2 / IPC Class 3;
Our PCB Capabilities(2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0079" - 0.25" (0.2mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Appendix: Typical Value of TLY-5Z
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 2.20+/- 0.04 | 2.20+/- 0.04 | ||
| Df @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 0.001 | 0.001 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0015 | 0.0015 | ||
| Tc(D)K (-55 ~150°C) | IPC-650 2.5.5.6 Mod. | ppm/°C | -72 | ppm/°C | -72 |
| Dielectric Breakdown Voltage | IPC-650 2.5.6 | kV | 45 | kV | 45 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 770 | V/mm | 30,315 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Peel Strength (1 oz. copper) | IPC-650 2.4.8 | lbs./inch | 7 | N/mm | 1.3 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohms/cm | 10^9 | Mohms/cm | 10^9 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohms | 10^8 | Mohms | 10^8 |
| Tensile Strength (MD) | IPC-650 2.4.18.3 | psi | 9137 | N/mm2 | 63 |
| Tensile Strength (CD) | IPC-650 2.4.18.3 | psi | 9572 | N/mm2 | 66 |
| Tensile Modulus (MD) | IPC-650 2.4.18.3 | psi | 182,748 | N/mm2 | 1260 |
| Tensile Modulus (CD) | IPC-650 2.4.18.3 | psi | 165,344 | N/mm2 | 1140 |
| Elongation (MD) | IPC-650 2.4.18.3 | % | 6 | % | 6 |
| Elongation (CD) | IPC-650 2.4.18.3 | % | 6.9 | % | 6.9 |
| Flex Strength (MD) | ASTM D790 | psi | 10,300 | N/mm2 | 71 |
| Flex Strength (CD) | ASTM D790 | psi | 11,600 | N/mm2 | 80 |
| Flex Modulus (MD) | ASTM D790 | psi | 377,100 | N/mm2 | 2600 |
| Flex Modulus (CD) | ASTM D790 | psi | 432,213 | N/mm2 | 2980 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.05 | % (30 mil) | -0.05 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.17 | % (30 mil) | -0.11 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.07 | % (30 mil) | -0.07 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.22 | % (30 mil) | -0.14 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 1.92 | g/cm3 | 1.92 |
| Specific Heat | IPC-650 2.4.50 | J/g°C | 0.95 | J/g°C | 0.95 |
| Thermal Conductivity | IPC-650 2.4.50 | W/M*K | 0.2 | W/M*K | 0.2 |
| CTE (x-y) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 30-40 | ppm/ºC | 30-40 |
| CTE (z) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 130 | ppm/ºC | 130 |
| Hardness | ASTM D2240 (Durometer) | - | 68 | - | 68 |
| UL-94 Flammability Rating | UL-94 | V-0 | V-0 |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
