60mil 1.524mm RO4350B Rogers PCB RF Circuit Board Double Sided Patch Antenna

Rogers 4350 PCB is a high-performance circuit board material widely used in various high-frequency applications. It is a type of high-frequency laminate material that offers excellent electrical and mechanical properties, making it a popular choice in the electronics industry. Bicheng PCB, a leading PCB vendor, offers high frequency PCB with substrates Rogers 4350 with high precision and efficiency.

RO4350B is a high-frequency laminate material made by Rogers Corporation. It is known for its excellent dielectric properties, low loss tangent, and thermal stability. RO4350B has a dielectric constant of 3.48±0.05 at 10 GHz and 23℃, as tested by IPC-TM-650 2.5.5.5 Clamped Stripline method. Using the Differential Phase Length Technique, the material's dielectric constant spans from 8 to 40 GHz.

One of the key advantages of RO4350B is its low loss tangent, with a dissipation factor tan(δ) of 0.0037 at 10 GHz and 23℃, and 0.0031 at 2.5 GHz and 23℃, as tested by IPC-TM-650 2.5.5.5. This low loss tangent makes it an ideal material for high-frequency applications that require low signal loss.

RO4350B also has a high thermal stability, with a thermal coefficient of ε of +50 ppm/℃ from -50℃ to 150℃, as tested by IPC-TM-650 2.5.5.5. This property ensures that the material's electrical properties remain stable even at high temperatures.

In terms of mechanical properties, RO4350B has a tensile modulus of 16,767 MPa (2,432 ksi) in the X direction and 14,153 MPa (2,053 ksi) in the Y direction, as tested by ASTM D 638. It also has a tensile strength of 203 MPa (29.5 ksi) in the X direction and 130 MPa (18.9 ksi) in the Y direction. The flexural strength of RO4350B is 255 MPa (37 kpsi) as tested by IPC-TM-650 2.4.4. The dimensional stability of RO4350B is less than 0.5 mm/m (mil/inch) after etch+E2/150℃, as tested by IPC-TM-650 2.4.39A.

RO4350B has a coefficient of thermal expansion of 10 ppm/℃ in the X direction, 12 ppm/℃ in the Y direction, and 32 ppm/℃ in the Z direction, as tested by IPC-TM-650 2.4.41. Its glass transition temperature (Tg) is greater than 280℃ as tested by IPC-TM-650 2.4.24.3, and its decomposition temperature (Td) is 390℃ as tested by ASTM D 3850. The thermal conductivity of RO4350B is 0.69 W/M/oK at 80℃, as tested by ASTM C518.

Bicheng PCB's rich experience and capablities can sure the product of Rogers 4350 PCB is optimized for manufacturability. This capability includes checking the supplying for any potential manufacturing issues and providing the necessary adjustments to ensure that the PCB can be produced with high precision and efficiency. Bicheng PCB can also provide guidance on the selection of the appropriate materials and manufacturing processes to achieve the desired performance and reliability.

Throughout the PCB production process, it is essential to consider various parameters to ensure the PCB's reliability and functionality. The PCB's size, layers, technology, material, plating and coating, and flammability rating are some of the critical factors that need to be considered during PCB making process. This article will explore the different parameters and capabilities of a double-sided high frequency PCB based on the specifications provided by Bicheng PCB, a PCB supplying company that offers worldwide service.

Here let's see a type of double sided 60mil PCB based on RO4350B.

PCB Size and Type

The PCB's size and type determine the overall space required for the electronic components to be placed on the board. In this case, the PCB size is 135 x 135mm, and the board type is high frequency PCB, RF PCB. High-frequency PCBs are used in applications where high-frequency signals need to be transmitted without significant loss. RF PCBs are designed to operate at frequencies above 100 MHz and are used in various applications such as wireless communication, satellite communication, and radar systems.

Number of Layers

The number of layers in a PCB determines the complexity of the board design. A double-sided PCB has two copper layers, one on each side of the board. Surface mount components and through-hole components can be placed on both sides of the board.

Layer Stackup

The layer stackup describes the arrangement of the different layers of the PCB. In this case, the layer stackup is copper (35um) + RO4350B 60mil + copper (35um). The RO4350B is a high-performance dielectric material that has a dielectric constant of 3.48±0.05 and a thermal coefficient of ε of +50 ppm/℃. The copper layers are used to provide a conductive path for the electrical signals to flow through the PCB.

Technology

The technology used in the PCB determines the minimum trace and space, the minimum and maximum hole sizes, and the number of different holes in the PCB. In this case, the minimum trace and space are 11mil/12mil, and the minimum and maximum hole sizes are 0.3mm and 2.2mm, respectively. The PCB has a total of 184 drill holes and five different hole sizes. The PCB also has no milled slots or internal cutouts.

Impedance Control

Impedance control is essential in high-frequency PCBs, where signal integrity is critical. Impedance control ensures that the electrical signals transmitted through the PCB maintain a constant impedance. In this case, the PCB has no impedance control.

Board Material

The board material is the substrate on which the conductive traces and components are placed. In this case, the board material is glass epoxy with RO4350B 60mil, Tg 288℃. The glass epoxy substrate provides mechanical support, and the RO4350B provides the dielectric properties required for high-frequency applications.

Plating and Coating

The plating and coating on the PCB determine the surface finish and the protection of the board from external elements. In this case, the surface finish is electroless nickel over immersion gold (ENIG) with 2 microinch over 100 microinch nickel. The ENIG surface finish provides excellent solderability, corrosion resistance, and electrical conductivity.

Contour/Cutting and Marking

The contour/cutting and marking of the PCB determine the shape of the board and the labeling of the components. In this case, the PCB is routed, and there is no side of component legend, color of component legend, or manufacturer name or logo.