logo
products
PRODUCTS DETAILS
Home > Products >
M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
Contact Us
Ms. Ivy Deng
sales10@bichengpcb.com
86-755-27374847
Contact Now
M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant
  • name
  • name
  • name
  • name

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant

MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-173.V1.0
Base Material:
Low DK Glass Cloth
Layer Count:
Multilayer PCB, Hybrid PCB
PCB Thickness:
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Highlight:

Multilayer Printed High Speed PCB

,

Heat Resistant Multilayer Printed PCB

,

Mobile Networking Multilayer Printed PCB

Product Description

 

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Dear friends,

Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.

 

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.

 

Part Numbers

Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)

Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670

 

They Features low Dk = 3.7 (@ 1GHz), low Df = 0.002 (@ 1GHz), excellent through-hole reliability (5x better than our conventional high Tg FR4 material), lead-free, ROHS-compliant soldering, high heat resistance. M6 also provides excellent high-density interconnect (HDI) and thermal performance.

 

Our PCB Capabilities (Megtron 6)

PCB Material: Low DK Glass Cloth
Designation: Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant: 3.61 at 10GHz
Dissipation Factor 0.004 at 10GHz
Layer count: Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Main Applications

Antenna (Automotive millimeter wave radar, Base station)

ICT infrastructure equipment,

Measuring instrument,

Super computer,

 

Typical Value of R-5775

Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
  DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 0

 

Megtron 6 Material List in stock (as of September 2021)

Item Thickness (mil) Thickness(mm) Structure Copper weight(oz) Type of copper
R5775G 2.0 0.050 1035*1 H/H HVLP
R5775G 2.6 0.065 1080*1 H/H HVLP
R5775G 3.0 0.075 1078*1 1.0/1.0 RTF
R5775G 3.0 0.075 1078*1 H/H RTF
R5775G 3.0 0.075 1078*1 1.0/1.0 HVLP
R5775G 3.0 0.075 1078*1 H/H HVLP
R5775G 3.9 0.100 3313*1 H/H RTF
R5775G 3.9 0.100 3313*1 1.0/1.0 RTF
R5775G 5.9 0.150 1080*2 2.0/2.0 RTF
R5775G 9.8 0.250 2116*2 H/H RTF

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 1

 

We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.

 

Thanks for your reading.

 

Tags: 

1oz Medical Equipment PCB,  

1oz Immersion Gold PCB,  

Tg150 FR4 Medical Equipment PCB

Recommended Products
60.7mil RO4725JXR PCB Board With ENIG On Pads No Top Or Bottom Silkscreen Or Solder Mask

60.7mil RO4725JXR PCB Board With ENIG On Pads No Top Or Bottom Silkscreen Or Solder Mask

Contact Now
25mil RT Duroid 6006 RF PCB With Green Solder Mask And Immersion Gold

25mil RT Duroid 6006 RF PCB With Green Solder Mask And Immersion Gold

Contact Now
RT duroid 6010.2LM PCB 50mil Immersion Gold for RF Patch Antennas

RT duroid 6010.2LM PCB 50mil Immersion Gold for RF Patch Antennas

Contact Now
M6 High Speed PCB Low Loss Multilayer 2mm Impedance Circuit Board

M6 High Speed PCB Low Loss Multilayer 2mm Impedance Circuit Board

Contact Now
Immersion Gold 4 Layers High Speed PCB 0.8mm Thickness 94V-0 Rating

Immersion Gold 4 Layers High Speed PCB 0.8mm Thickness 94V-0 Rating

Contact Now
150mil TMM10 High Frequency PCB Thermoset Microwave Material With Immersion Gold

150mil TMM10 High Frequency PCB Thermoset Microwave Material With Immersion Gold

Contact Now
50mil RT Duroid 6010.2LM High Frequency PCB 1.27mm With Immersion Silver

50mil RT Duroid 6010.2LM High Frequency PCB 1.27mm With Immersion Silver

Contact Now
50mil RO3206 PCB Board With ENIG For Microstrip Patch Antennas

50mil RO3206 PCB Board With ENIG For Microstrip Patch Antennas

Contact Now
20mil IsoClad 917 Substrates High Frequency PCB Non Woven Fiberglass / PTFE Composites

20mil IsoClad 917 Substrates High Frequency PCB Non Woven Fiberglass / PTFE Composites

Contact Now
60mil TMM10i RF Circuit Boards Immersion Silver PTFE Microwave PCB

60mil TMM10i RF Circuit Boards Immersion Silver PTFE Microwave PCB

Contact Now
2 Layer TLY-5 Immersion Tin Pcb For High Frequency Project

2 Layer TLY-5 Immersion Tin Pcb For High Frequency Project

Contact Now
products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant
  • name
  • name
  • name
  • name
M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant
MOQ: 1PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-173.V1.0
Base Material:
Low DK Glass Cloth
Layer Count:
Multilayer PCB, Hybrid PCB
PCB Thickness:
0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB Size:
≤400mm X 500mm
Solder Mask:
Green, Black, Blue, Yellow, Red Etc.
Copper Weight:
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish:
Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
Minimum Order Quantity:
1PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Multilayer Printed High Speed PCB

,

Heat Resistant Multilayer Printed PCB

,

Mobile Networking Multilayer Printed PCB

Product Description

 

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Dear friends,

Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.

 

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.

 

Part Numbers

Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)

Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670

 

They Features low Dk = 3.7 (@ 1GHz), low Df = 0.002 (@ 1GHz), excellent through-hole reliability (5x better than our conventional high Tg FR4 material), lead-free, ROHS-compliant soldering, high heat resistance. M6 also provides excellent high-density interconnect (HDI) and thermal performance.

 

Our PCB Capabilities (Megtron 6)

PCB Material: Low DK Glass Cloth
Designation: Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant: 3.61 at 10GHz
Dissipation Factor 0.004 at 10GHz
Layer count: Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Main Applications

Antenna (Automotive millimeter wave radar, Base station)

ICT infrastructure equipment,

Measuring instrument,

Super computer,

 

Typical Value of R-5775

Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
  DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 0

 

Megtron 6 Material List in stock (as of September 2021)

Item Thickness (mil) Thickness(mm) Structure Copper weight(oz) Type of copper
R5775G 2.0 0.050 1035*1 H/H HVLP
R5775G 2.6 0.065 1080*1 H/H HVLP
R5775G 3.0 0.075 1078*1 1.0/1.0 RTF
R5775G 3.0 0.075 1078*1 H/H RTF
R5775G 3.0 0.075 1078*1 1.0/1.0 HVLP
R5775G 3.0 0.075 1078*1 H/H HVLP
R5775G 3.9 0.100 3313*1 H/H RTF
R5775G 3.9 0.100 3313*1 1.0/1.0 RTF
R5775G 5.9 0.150 1080*2 2.0/2.0 RTF
R5775G 9.8 0.250 2116*2 H/H RTF

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 1

 

We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.

 

Thanks for your reading.

 

Tags: 

1oz Medical Equipment PCB,

1oz Immersion Gold PCB,

Tg150 FR4 Medical Equipment PCB

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Sitemap |  Privacy Policy | China Good Quality RF PCB Board Supplier. Copyright © 2020-2025 Bicheng Electronics Technology Co., Ltd . All Rights Reserved.