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M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant
M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant

Large Image :  M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-173.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: Low DK Glass Cloth Layer Count: Multilayer PCB, Hybrid PCB
PCB Thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm PCB Size: ≤400mm X 500mm
Solder Mask: Green, Black, Blue, Yellow, Red Etc. Copper Weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface Finish: Bare Copper, HASL, ENIG, Immersion Silver, Immersion Tin, OSP Etc..
High Light:

Multilayer Printed High Speed PCB

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Heat Resistant Multilayer Printed PCB

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Mobile Networking Multilayer Printed PCB

 

M6 High Speed Low Loss Multilayer Printed Circuit Board Megtron 6 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Dear PCB friends,

Today, I am going to talk about a type of high speed low loss multilayer PCB: M6 R-5775 PCB.

 

Megtron 6 is an ultra-low loss, highly heat resistant circuit board material designed for mobile, networking, and wireless applications etc. The main properties of Megtron 6 are low dielectric constant (DK) and dielectric dissipation factors (DF), low transmission loss and high heat resistance.

 

Part Numbers

Low Dielectric Constant (Dk) Glass Cloth - Laminate R-5775(N) / PrepregR-5670(N)

Standard E Glass Cloth - Laminate R-5775 / PrepregR-5670

 

Main Features

Low Dk = 3.7 (@ 1GHz), Low Df = 0.002 (@ 1GHz)

Excellent through-hole reliability (5x better than our conventional high Tg FR4 material)

Lead-free, ROHS-compliant soldering

High heat resistance

M6 also provides excellent high-density interconnect (HDI) and thermal performance.

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 0

 

Our PCB Capabilities (Megtron 6)

PCB Material: Low DK Glass Cloth
Designation: Laminate R-5775(G), Prepreg R-5670(G)
Dielectric constant: 3.61 at 10GHz
Dissipation Factor 0.004 at 10GHz
Layer count: Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Main Applications

Antenna (Automotive millimeter wave radar, Base station)

ICT infrastructure equipment,

Measuring instrument,

Super computer,

 

Typical Value of R-5775

Property Units Test Method Condition Typical Value
THERMAL Glass Transition Temp ( Tg ) C DSC As received 185
  DMA As received 210
Thermal Decomposition Temp C TGA As received 410
Time to Delam (T288) Without Cu Min IPC TM-650 2.4.24.1 As received > 120
With Cu Min IPC TM-650 2.4.24.1 As received > 120
CTE : α1 X - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Y - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 14 - 16
Z - axis ppm / C ppm / C IPC TM-650 2.4.24 < Tg 45
CTE : α2 Z - axis ppm / C ppm / C IPC TM-650 2.4.24 > Tg 260 260
ELECTRICAL Volume Resistivity MΩ - cm IPC TM-650 2.5.17.1 C-96/35/90 1 x 109
Surface Resistivity MΩ IPC TM-650 2.5.17.1 C-96/35/90 1 x 108
Dielectric Constant ( Dk ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 3.71
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 3.61
Dissipation Factor ( Df ) @ 1GHz / IPC TM-650 2.5.5.9 C-24/23/50 0.002
@ 10GHz / IPC TM-650 2.5.5.5 C-24/23/50 0.004
PHYSICAL Water Absorption % IPC TM-650 2.6.2.1 D-24/23 0.14
Peel Strength 1oz ( H-VLP ) kN / m IPC TM-650 2.4.8 As Received 0.8 0.8
Flammability / UL C-48/23/50 94V-0

 

Megtron 6 Material List in stock (as of September 2021)

Item Thickness (mil) Thickness(mm) Structure Copper weight(oz) Type of copper
R5775G 2.0 0.050 1035*1 H/H HVLP
R5775G 2.6 0.065 1080*1 H/H HVLP
R5775G 3.0 0.075 1078*1 1.0/1.0 RTF
R5775G 3.0 0.075 1078*1 H/H RTF
R5775G 3.0 0.075 1078*1 1.0/1.0 HVLP
R5775G 3.0 0.075 1078*1 H/H HVLP
R5775G 3.9 0.100 3313*1 H/H RTF
R5775G 3.9 0.100 3313*1 1.0/1.0 RTF
R5775G 5.9 0.150 1080*2 2.0/2.0 RTF
R5775G 9.8 0.250 2116*2 H/H RTF

 

M6 Low Loss Multilayer Printed High Speed PCB Heat Resistant 1

 

We can provide you with prototypes, small batches and mass production PCB’s. Any questions, please feel free to contact us.

 

Thanks for your reading.

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

Send your inquiry directly to us (0 / 3000)