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2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board
2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board 2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

Large Image :  2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-287.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month

2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

Description
Base Material: Taconic TLX-8 PTFE Fiberglass Laminate Layer Count: 2 Layers
PCB Thickness: 1.3mm PCB Size: 45mm × 66.04mm (±0.15mm Tolerance, 1PCS)
Solder Mask: No Silkscreen: No
Copper Weight: 1oz Surface Finish: ENIG
Highlight:

Multilayer Flex PCB

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4-layer Flexible Printed Circuit

Crafted with premium Taconic TLX-8 PTFE fiberglass laminate, this custom 2-layer rigid PCB is purpose-built to deliver dependable, high-performance operation across demanding RF and microwave scenarios. Sporting a 1.3mm overall thickness and a compact 45mm × 66.04mm footprint with a strict ±0.15mm dimensional tolerance, the board adopts a pure ENIG surface treatment with no solder mask or silkscreen applied on either side. Engineered with exclusive through-hole structures and zero blind vias, it supports precise 6/9 mil trace/space routing and 0.4mm minimum drilling size. Every unit undergoes comprehensive 100% electrical testing prior to delivery, adheres to IPC-Class-2 quality benchmarks, and is available for reliable worldwide supply.

 

PCB Specifications

Tailored for low-layer microwave circuit design, this TLX-8 PCB balances precise fabrication precision and robust environmental adaptability. Every structural parameter follows standardized industrial specifications to sustain stable electrical transmission and mechanical durability in high-frequency working scenarios.

Specification Item Parameter Details
Base Material Taconic TLX-8 PTFE fiberglass laminate
Layer Configuration 2-layer rigid PCB
Board Dimensions 45mm × 66.04mm (±0.15mm tolerance, 1PCS)
Minimum Trace / Space 6/9 mils
Minimum Hole Size 0.4mm
Via Type Through-hole only, no blind vias
Finished Board Thickness 1.3mm
Outer Copper Weight 1oz (1.4 mils)
Via Plating Thickness 20μm
Surface Finish ENIG
Silkscreen Top: None, Bottom: None
Solder Mask Top: None, Bottom: None
Pre-Shipment Test 100% electrical test prior to shipment

 

PCB Stack-up Structure

Built with a fully symmetrical 2-layer stackup, this PCB centers on a 1.27mm (50mil) thick Taconic TLX-8 core substrate. Matching 35μm copper layers cover both top and bottom sides of the core, forming a balanced structural layout that minimizes signal deviation and delivers consistent mechanical and electrical performance for low-layer microwave designs.

Layer Structure Material & Thickness
Copper_layer_1 35 μm
TLX-8 Core 1.27 mm (50mil)
Copper_layer_2 35 μm

 

PCB Statistic

Optimized for compact RF circuit assembly and small-batch prototyping, the board features a reasonable layout of components, pads and vias to fit diverse microwave circuit design needs.

Statistical Item Quantity
Components 13
Total Pads 26
Thru Hole Pads 12
Top SMT Pads 14
Bottom SMT Pads 0
Vias 8
Nets 2

 

2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

 

TLX-8 Material Overview

As a high-volume, application-centric PTFE fiberglass laminate, Taconic TLX-8 has earned wide recognition for reliable performance across the full spectrum of RF applications. Its flexible customizable thickness and copper cladding options make it an ideal choice for simplified low-layer microwave designs. More importantly, this material delivers exceptional mechanical reinforcement, enabling end circuits to withstand extreme and harsh operating environments—from high-vibration space launch conditions and high-temperature engine module exposure, to space radiation, severe marine scenarios for shipboard antennas, and wide temperature fluctuations faced by flight altimeter substrates.

 

2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

 

TLX-8 Properties

TLX-8 TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.3   2.55   2.55
Df @1.9 GHz IPC-650 2.5.5.5.1   0.0012   0.0012
Df @10 GHz IPC-650 2.5.5.5.1   0.0017   0.0017
Dielectric Breakdown IPC-650 2.5.6 kV >45 kV >45
Moisture Absorption IPC-650 2.6.2.1 % 0.02 % 0.02
Flexural Strength(MD) ASTM D 709 psi 28,900 N/mm2  
Flexural Strength(CD) ASTM D 709 psi 20,600 N/mm2  
Tensile Strength(MD) ASTM D 902 psi 35,600 N/mm2  
Tensile Strength(CD) ASTM D 902 psi 27,500 N/mm2  
Elongation at Break(MD) ASTM D 902 % 3.94 % 3.94
Elongation at Break(CD) ASTM D 902 % 3.92 % 3.92
Young's Modulus(MD) ASTM D 902 kpsi 980 N/mm2  
Young's Modulus(CD) ASTM D 902 kpsi 1,200 N/mm2  
Young's Modulus(MD) ASTM D 3039 kpsi 1,630 N/mm2  
Poisson's Ratio ASTM D 3039   0.135 N/mm  
Peel Stength(1 oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 15 N/mm  
Peel Stength(1 oz.RTF) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 17 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8.3(Elevated Temp.) Ibs./linear inch 14 N/mm  
Peel Stength(½ oz.ed) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 11 N/mm  
Peel Stength(1 oz.rolled) IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) Ibs./linear inch 13 N/mm 2.1
Thermal Conductivity ASTM F433/ASTM 1530-06 W/M*K 0.19 W/M*K 0.19
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(After Bake.) mils/in. 0.06 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.4(After Bake.) mils/in. 0.08 mm/M  
Dimensional Stability(MD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.09 mm/M  
Dimensional Stability(CD) IPC-650 2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.1 mm/M  
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm 6.605 x 108 Mohm 6.605 x 108
Surface Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm 3.550 x 106 Mohm 3.550 x 106
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) Mohm/cm 1.110 x 1010 Mohm/cm 1.110 x 1010
Volume Resistivity IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) Mohm/cm 1.046 x 1010 Mohm/cm 1.046 x 1010
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 21 ppm/℃ 21
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 23 ppm/℃ 23
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 215 ppm/℃ 215
Density(Specific Gravity) ASTM D 792 g/cm3 2.25 g/cm3 2.25
Td(2% Weight Loss) IPC-650 2.4.24.6(TGA) ℃ 535 ℃  
Td(5% Weight Loss) IPC-650 2.4.24.6(TGA) ℃ 553 ℃  
Flammability Rating UL-94   V-0   V-0

 

Typical Applications

Leveraging ultra-low signal loss, precise dielectric control and outstanding environmental tolerance, this TLX-8 PCB serves as a reliable core component for multiple high-end RF and microwave industrial systems:

 

  • High-precision radar systems
  • Commercial mobile communication equipment
  • Professional microwave test and measurement devices
  • Microwave signal transmission equipment
  • RF passive devices including couplers, splitters, combiners and amplifiers
  • High-stability communication antenna systems

 

Conclusion

Engineered with Taconic TLX-8 high-performance laminate and finished with premium ENIG surface treatment, this 2-layer PCB delivers unrivaled low-Dk, low-Df and high PIM stability for microwave and RF applications. Its exceptional dimensional stability, minimal moisture absorption and strong resistance to extreme environments enable consistent performance in aerospace, marine, high-temperature and high-vibration scenarios. Fully tested electrically and certified to IPC-Class-2 standards, this PCB supports flexible customization and global delivery, catering to prototyping and batch production demands for communication, radar and microwave test projects.

 

2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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