This custom single-layer rigid high-frequency PCB utilizes Rogers TMM10 thermoset microwave composite laminate, delivering combined advantages of ceramic and PTFE substrates with improved manufacturability. It features solder mask-free and silkscreen-free construction with OSP surface finish, all units are 100% electrically tested before delivery to ensure reliable structural integrity and stable RF/microwave performance for precision high-frequency applications.
PCB Specifications
| Parameter Item |
Specification |
| Base Material |
Rogers TMM10 thermoset microwave composite laminate |
| Layer Configuration |
Single-sided rigid PCB structure |
| Board Dimension |
99.05mm × 56.9mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space |
4 mils / 5 mils |
| Minimum Mechanical Hole Diameter |
0.35mm |
| Via Type |
Pure through-hole via design, no blind vias |
| Finished Board Thickness |
1.6mm |
| Outer Copper Weight |
1oz (1.4 mils) outer copper layer |
| Via Plating Thickness |
20μm |
| Surface Finishing |
OSP (Organic Solderability Preservative) |
| Silkscreen Layer |
Silkscreen-free |
| Solder Mask Layer |
Solder mask-free |
| Quality Inspection |
100% full electrical testing performed prior to delivery |
PCB Layer Stack-up Structure
| Layer Definition |
Technical Specification |
| Top Copper Layer |
35μm finished copper thickness |
| Dielectric Core Substrate |
Rogers TMM10 core, 1.524mm (60mil) thickness |
Artwork & Quality Compliance
Artwork Format: Manufactured with standard Gerber RS-274-X data for precise patterning and universal process compatibility.
Quality Compliance: Fully compliant with IPC-Class-2 criteria to ensure consistent electrical performance and structural reliability.
Global Supply Capability: Supports worldwide delivery to serve global high-frequency PCB applications.
Rogers TMM10 Material Profile
Rogers TMM10 is a high-performance thermoset microwave composite dielectric laminate. It integrates the superior characteristics of traditional PTFE and ceramic substrates while eliminating the inherent mechanical limitations and complicated processing workflows of conventional high-frequency materials. This material delivers outstanding electrical stability, reliable mechanical robustness and simplified manufacturability, making it ideal for diverse high-precision microwave circuit designs.
Material Advantages
Superior Mechanical Stability: Resists creep and cold flow under continuous operating stress, maintaining accurate circuit geometry and stable high-frequency performance long-term.
Excellent Chemical Compatibility: Tolerates standard PCB processing chemicals, minimizing substrate damage and optimizing fabrication yield and quality stability.
Simplified Plating Process: Eliminates sodium napthanate pre-treatment for electroless plating, streamlining fabrication and reducing production costs.
High Wire-Bonding Reliability: Stable thermoset resin structure enables dependable wire-bonding capability for high-end precision packaging applications.
Typical Application Fields
Combining high dielectric constant, ultra-low high-frequency loss, copper-matched thermal expansion and superior process adaptability, Rogers TMM10-based PCBs are widely applied in high-precision microwave and satellite communication systems:
- High-precision semiconductor chip testing equipment
- Microwave dielectric polarizer components
- Satellite communication system modules
- GPS antennas, patch antennas and high-frequency antenna systems
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