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FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System

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China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System
FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System

Large Image :  FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-275.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: 1.0mm FR-4 / 0.15mm Polyimide Layer Count: 3 Layers
PCB Thickness: 1.0mm PCB Size: 20.23 X 80.91mm
Coverlay: Yellow Coverlay / Green Solder Mask Silkscreen: White
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

FR4 And Polyimide Rigid Flex PCBs

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1.0mm Rigid Flex PCBs

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1.0mm 3 Layer PCB

 

Rigid-flex PCBs Built on FR-4 and Polyimide with Green Solder Mask and Immersion Gold for Telemetry System

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of rigid-flex PCB for the application of Telemetry System. It’s a 3 layer of rigid flex PCB. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.

 

Parameter and data sheet

Size of Flexible PCB 20.23 X 80.91mm
Number of Layers 3
Board Type Rigid flex PCB
Board Thickness 1.0mm
Board Material 1.0mm FR-4 / 0.15mm Polyimide
Board Material Supplier ITEQ
Tg Value of Board Material 60
 
PTH Cu thickness 20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
   
Coverlay Colour Yellow coverlay / Green solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material no
Stiffener Thickness N/A
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 2
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90 No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25±125, 1000 cycles.
Thermal Stress Pass, 300±5,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System 0

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System 1

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

Small quantity order is accepted

DDU Door to door shipment with competitive shipping cost.

 

Applications

LCD module, mobile phone module flex board, Consumer electrostatic Bracelet soft board

 

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

 

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System 2

FR4 And Polyimide 1.0mm Rigid Flex PCBs 3 Layers For Telemetry System 3

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: i.deng

Tel: +8613481420915

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