This 2-layer F4BME275 RF PCB is a high-performance microwave circuit board purpose-built for demanding RF and high-frequency microwave scenarios. Adopting Wangling’s upgraded F4BME275 high-stability PTFE composite laminate and premium reverse-treated (RTF) copper foil, this rigid PCB features a thickened 1.6mm finished board thickness and high-precision 5μm pure gold surface plating.
What Is F4BME275? Advanced Substrate Introduction
F4BME275 is a next-generation high-performance PTFE composite laminate developed by Wangling, specially optimized for high-standard RF and microwave circuit applications. Manufactured with precision-blended woven fiberglass cloth, high-purity PTFE resin, and specialized composite film, this substrate delivers highly consistent and reliable electrical performance across high-frequency operating environments.
As an upgraded iteration of the classic F4BM275 material, F4BME275 achieves comprehensive performance upgrades with lower dielectric loss, higher insulation resistance, and superior long-term parameter stability. It serves as a cost-effective, high-reliability domestic alternative to mainstream imported high-frequency laminates. Standardly clad with reverse-treated (RTF) copper foil, the material ensures excellent low-PIM performance, supports precise fine-line circuit etching, and effectively reduces high-frequency conductor loss, fully meeting the requirements of high-precision RF circuit designs.
Core Features & Advantages of F4BME275
F4BME275 features customizable electrical and mechanical properties through precisely calibrated PTFE and fiberglass ratio blending, achieving an optimal balance between low-loss performance, structural stability, and manufacturability for diverse high-frequency circuit designs:
Tunable Dielectric Performance: Features a precisely adjustable fiberglass-to-PTFE ratio, delivering a stable dielectric constant (Dk) of 2.75 at 10GHz with ultra-low dielectric loss. This customizable dielectric property enables flexible impedance matching and precise material adaptation for various civilian and military high-frequency band designs
Enhanced Dimensional Stability: Optimized fiberglass composition effectively lowers thermal expansion and suppresses dielectric temperature drift. The material maintains stable physical and electrical performance across -55°C to 125°C, minimizing board warpage and parameter deviation under alternating thermal operating conditions
Balanced Comprehensive Performance: Adopts a scientific performance trade-off formula with moderate fiberglass proportioning. It significantly improves mechanical rigidity and structural flatness while retaining ultra-low dissipation factor (Df) characteristics, ensuring stable low-loss high-frequency signal transmission up to 20GHz
High Design Flexibility: Supports customizable dielectric constant configurations and structural optimization. RF engineers can tailor material parameters to perfectly balance high-frequency electrical performance, mechanical load-bearing robustness, and SMT/through-hole production process adaptability for diverse RF product development
Superior Low-PIM & Low-Loss Performance: Paired with premium RTF reverse-treated copper foil, it greatly reduces high-frequency conductor loss.
Reliable Insulation Performance: Upgraded composite formula delivers excellent volume insulation resistance, effectively isolating high-frequency circuit signals
Key PCB Construction Specifications
| Parameter Item |
Specific Specification |
| Base Material |
Wangling F4BME275 high-stability PTFE composite laminate with RTF copper foil |
| Layer Count |
2 layers (rigid RF PCB structure) |
| Board Dimensions |
103mm × 76mm (±0.15mm tolerance, 1 piece) |
| Minimum Trace/Space |
6/9 mils, adapting to precision RF fine-line circuit layout |
| Minimum Hole Size |
0.5mm, facilitating standardized component assembly |
| Finished Board Thickness |
1.6mm thickened board design for enhanced structural stability |
| Finished Copper Weight |
1oz (1.4 mils) outer RTF copper layers for low conductor loss and low-PIM performance |
| Via Plating Thickness |
20μm, ensuring stable via conductivity and long-term reliability |
| Surface Finish |
5μm (197μ") pure gold plating, delivering excellent conductivity and corrosion resistance |
| Silkscreen |
White top silkscreen with no bottom silkscreen for clear component marking |
| Solder Mask |
Black top solder mask, no bottom solder mask for optimized heat dissipation |
| Quality Test Standard |
100% full electrical testing before shipment to eliminate circuit defects |
2-Layer F4BME275 PCB Stack-up Structure
This professional 2-layer rigid stackup adopts high-performance F4BME275 PTFE composite core, paired with low-loss RTF copper foil. The balanced layered structure minimizes high-frequency signal loss and ensures uniform mechanical and electrical performance, ideal for precision microwave and RF applications:
| Layer Sequence |
Material Specification |
Thickness |
Core Function |
| Outer Layer 1 (Top) |
RTF low-loss conductive copper foil |
35μm |
High-frequency RF signal transmission and precision component soldering layer |
| Core Dielectric Layer |
F4BME275 high-stability PTFE composite core substrate |
1.524mm (60mil) |
Low-loss dielectric isolation, stable temperature resistance and consistent dielectric performance for RF circuits |
| Outer Layer 2 (Bottom) |
RTF low-loss conductive copper foil |
35μm |
Auxiliary circuit transmission layer to balance overall structural stability |
PCB Statistics
| Parameter Item |
Specific Value |
| Components |
37 |
| Total Pads |
56 |
| Thru Hole Pads |
37 |
| Top SMT Pads |
19 |
| Bottom SMT Pads |
0 |
| Vias |
21 |
| Nets |
7 |
Accepted Artwork Format: We support standard Gerber RS-274-X design file submissions from global customers. This universal industry-standard format enables accurate technical assessment, customized quotation, and precise mass production, ensuring efficient and error-free collaboration for all international PCB customization projects.
Production Quality Standard: All F4BME275 high-frequency RF PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industrial reliability criteria. Standardized production processes and rigorous quality inspections guarantee excellent dimensional consistency and stable electrical performance for every batch.
Global Supply Service: We provide worldwide custom PCB quotation and international shipping services. Global clients can submit Gerber files for exclusive customized quotes, with full one-stop services including technical confirmation, precision manufacturing, comprehensive quality testing, and global logistics delivery.
Typical Application Scenarios
Microwave, RF & Radar Systems: High-frequency microwave modules, general RF signal circuits, and precision radar detection equipment
RF Passive Components: High-performance phase shifters and various precision passive RF functional components
Power Distribution Components: Custom power dividers, RF couplers, and signal combiners for communication systems
Antenna Feed Systems: Antenna feed network modules and high-precision phased array antenna systems
Wireless Communication Equipment: Satellite communication terminals and high-stability base station antenna systems
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