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| Base Material: | Polyimide | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 0.15mm | Coverlay: | Yellow |
| Silkscreen: | White | Copper Weight: | 1oz |
| Surface Finish: | Immersion Gold |
Dual Layer Flexible PCB Built on Polyimide With Immersion Gold and Yellow Mask
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of flexible printed circuit for the application of analog device. It’s a 2 layer board at 0.15mm thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Immersion gold is applied on the pads. Stiffener is applied on the connector part.
Parameter and data sheet
| Number of Layers | 2 |
| Board Type | Flexbile cirucit |
| Board Thickness | 0.15mm +/-10% |
| Board Material | Polyimide (PI) 25um |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 um |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 um |
| Stiffener | 200 um |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Mininum Trace (mil) | 4 mil |
| Minimum Gap(mil) | 4 mil |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
The end can be whole soldered
Low cost
Continuity of processing
Focus on low to medium volume production
Applications
Thin-film switch, mobile phone antenna flex board, automobile GPS navigation flex board
Stiffener
In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.
(1)PI or Polyester
PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.
(2)Glass fibers
Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.
(3)Polymer
Polymer, such as plastic, etc. is also used as stiffeners.
Its water absorption is low, with high pressure and high temperature resistance.
(4)Steel foil, aluminum shim
The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.
More Displays of FR-4 Stiffener
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
