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50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas
50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

Large Image :  50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-057.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RO3210 Layer Count: 2 Layers
PCB Thickness: 1.3mm PCB Size: 102 X 102mm=1PCS
Copper Weight: 0.5oz Surface Finish: Immersion Gold
High Light:

RF Rogers PCB Board

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Immersion Gold Rogers PCB Board

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Rogers RF PCB Board

 

Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.

 

Typical application:

1. Base station infrastructure

2. LMDS and wireless broadband

3. Microstrip patch antennas

4. Wireless telecommunications systems

 

PCB SIZE 102 x 102mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18µm(0.5 oz)+plate TOP layer
RO3210 1.270mm
copper ------- 18µm(0.5 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 6 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 2.5 mm
Number of Different Holes: 8
Number of Drill Holes: 32
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO3210 1.270mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 1.3 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas 0

 

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103   MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103   COND A IPC 2.5.17.1
Tensile Modulus 579
517
MD
CMD
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79   j/g/k   Calculated
Thermal Conductivity 0.81   W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
13
34
 
X,Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500   TGA ASTM D3850
Density 3   gm/cm3    
Copper Peel Stength 11   pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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