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Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas

China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Sebastian Toplisek

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me: Regards, Daniel

—— Daniel Ford

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Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas

Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas
Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas

Large Image :  Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-051.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
Detailed Product Description
Base Material: RT/Duroid 6002 Layer Count: 2 Layers
PCB Thickness: 0.3mm PCB Size: 78 X 77 Mm=1PCS
Copper Weight: 1oz Surface Finish: Immersion Gold
High Light:

DK2.94 Rogers PCB Board


10mil Rogers PCB Board


Phased Array Antennas Rogers PCB Board


Rogers PCB Built on RT/Duroid 6002 10mil 0.254mm DK2.94 With Immersion Gold for Phased Array Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers RT/duroid 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.


The thermal coefficient of dielectric constant is extremely low from -55℃ to +150℃ which provides the designers of filters, oscillators and delay lines the electrical stability needed in today's demanding applications.


A low Z axis coefficient of thermal expansion(CTE) ensures excellent reliability of plated through holes. RT/duroid 6002 materials have been successfully temperature cycled (-55℃ TO 125℃) for over 5000 cycles without a single via failure.


Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by matching the X and Y coefficient of expansion to copper. This often eliminates double etching to achieve tight positional tolerances.


The low tensile modulus (X,Y) greatly reduces the stress applied to solder joints and allows the expansion of the laminate to be constrained by a minimum amount of low CTE metal (6 ppm/℃) further increasing surface mount reliability.


Applications particularly suited to the unique properties of RT/duroid 6002 material include flat and non-planar structures such antennas, complex mutli-layer circuits with inter-layer connections, and microwave circuits for aerospace designs in hostile environments.


 Typical applications:

1. Airborne radar systems

2. Commercial airline collision avoidance

3. Ground base systems

4. High reliability complex multi-layer circuits 


PCB Specifications

PCB SIZE 78 x 77 mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RT/duroid 6002 0.254mm
copper ------- 35um(1 oz)+plate BOT layer
Minimum Trace and Space: 10 mil / 10 mil
Minimum / Maximum Holes: 0.3 mm / 0.6 mm
Number of Different Holes: 1
Number of Drill Holes: 2
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy: RT/duroid 6002 0.254mm
Final foil external: 1 oz
Final foil internal: 1 oz
Final height of PCB: 0.3 mm ±0.1
Surface Finish Immersion gold (51.3% ) 0.05µm over 3µm nickel
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas 0


Data Sheet of Rogers 6002 (RT/duroid 6002)

RT/duroid 6002 Typical Value
Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z   10 GHz/23 IPC-TM-650
Dielectric Constant,εDesign 2.94     8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z   10 GHz/23 IPC-TM-650
Thermal Coefficient of ε +12 Z ppm/ 10 GHz 0-100 IPC-TM-650
Volume Resistivity 106 Z A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23 ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi)   ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650
ASTM D 570
Thermal Conductivity 0.6   W/m/k 80 ASTM C518
Coefficient of Thermal Expansion
(-55 to 288
ppm/ 23/50% RH IPC-TM-650 2.4.41
Td 500   TGA   ASTM D 3850
Density 2.1   gm/cm3   ASTM D 792
Specific Heat 0.93(0.22)   j/g/k
Copper Peel 8.9(1.6)   Ibs/in.(N/mm)   IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


Rogers 6002 10mil 0.254mm DK2.94 Rogers PCB Board For Phased Array Antennas 1


Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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