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RF-35TC 0.8mm RF PCB Board
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RF-35TC 0.8mm RF PCB Board
  • name
  • name
  • name

RF-35TC 0.8mm RF PCB Board

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-026.V1.0
Base Material:
RF-35TC
Layer Count:
2 Layers
PCB Size:
90 X 45mm=1PCS
PCB Thickness:
0.8mm
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz
Surface Finish:
ENIG
Highlight:

0.8mm RF PCB Board

,

1oz RF PCB Board

Product Description

 

Taconic High Frequency PCB Built on RF-35TC 30mil 0.762mm With Black Solder Mask for Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

 

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

 

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

 

Antennas, satellites, filters, couplers, and power amplifiers find the RF-35TC laminates to be the perfect fit.

 

PCB Specifications

PCB SIZE 90 x 45mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RF-35TC 0.762mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 9
Number of Drill Holes: 21
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RF-35TC 0.762mm
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
PLATING AND COATING  
Surface Finish ENIG
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

RF-35TC 0.8mm RF PCB Board 0

 

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23℃) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 11 ppm/℃ 11
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 13 ppm/℃ 13
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 34 ppm/℃ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g℃) 0.94 j/(g℃) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 ℃ 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 ℃ 436

 

RF-35TC 0.8mm RF PCB Board 1

 

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
RF-35TC 0.8mm RF PCB Board
  • name
  • name
  • name
RF-35TC 0.8mm RF PCB Board
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-026.V1.0
Base Material:
RF-35TC
Layer Count:
2 Layers
PCB Size:
90 X 45mm=1PCS
PCB Thickness:
0.8mm
Solder Mask:
Green
Silkscreen:
White
Copper Weight:
1oz
Surface Finish:
ENIG
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

0.8mm RF PCB Board

,

1oz RF PCB Board

Product Description

 

Taconic High Frequency PCB Built on RF-35TC 30mil 0.762mm With Black Solder Mask for Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RF-35TC is a type of high frequency material from Taconic company. It offers a "best in class" low dissipation factor with high thermal conductivity. This material is best suited for high power applications where every 1/10th of a dB is critical and the PCB substrate is expected to diffuse heat away from both transmission lines and surface mount components such as transistors.

 

RF-35TC is a PTFE based, ceramic filled fiberglass substrate. It will not oxidize, yellow or show upward drift in dielectric constant and dissipation factor like its synthetic rubber (hydrocarbon) competitors.

 

This laminate has a low dielectric constant value of 3.50 and has extremely low Df of 0.0011. It provides a low dissipation factor with high thermal conductivity and bonds very well to low profile copper, further reducing insertion loss.

 

Antennas, satellites, filters, couplers, and power amplifiers find the RF-35TC laminates to be the perfect fit.

 

PCB Specifications

PCB SIZE 90 x 45mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RF-35TC 0.762mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.5 mm
Number of Different Holes: 9
Number of Drill Holes: 21
Number of Milled Slots: 1
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RF-35TC 0.762mm
Final foil external: 1.5 oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1
PLATING AND COATING  
Surface Finish ENIG
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

RF-35TC 0.8mm RF PCB Board 0

 

Data Sheet of RF-35TC

RF-35TC TYPICAL VALUES
Property Test Method Unit Value Unit Value
DK @10 GHz IPC-650 2.5.5.5.1(modified)   3.5   3.5
Tck(-30 to 120℃) IPC-650 2.5.5.5.1(modified) ppm 24 ppm 24
Df @10 GHz IPC-650 2.5.5.5.1(modified)   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 2.6.2.1 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23℃) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 2.5.17.1(after humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 2.5.17.1(after elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 2.5.17.1(after humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 11 ppm/℃ 11
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 13 ppm/℃ 13
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 34 ppm/℃ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g℃) 0.94 j/(g℃) 0.94
Td(2% Weight Loss) IPC-650 2.4.24.6/TGA oF 788 ℃ 420
Td(5% Weight Loss) IPC-650 2.4.24.6/TGA oF 817 ℃ 436

 

RF-35TC 0.8mm RF PCB Board 1

 

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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