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3mm No Silkscreen PTFE PCB Board Hot Air Soldering

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3mm No Silkscreen PTFE PCB Board Hot Air Soldering

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Details Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-100.V1.0

Base Material:

PTFE F4B Series

Layer Count:

1 Layer, 2 Layer, Multilayer, Hybrid Type

PCB Thickness:

0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm And 5.0mm, Etc.

PCB Size:

≤400mm X 500mm

Solder Mask:

Silkscreen:

Copper Weight:

0.5oz, 1oz, 2oz,3oz

Surfacefinish:

Bare Copper, HASL, ENIG, Immersion Tin Etc.

Highlight:

No Silkscreen Teflon PCB Board

3.0mm Teflon PCB Board

Product Description

Hello everybody,

Today we talk about a type of F4B high frequency circuit board at 3.0mm thick.

The F4B series of high frequency materials predominantly comprises PTFE glass fiber cloth and ceramic-filled PTFE glass fiber cloth. This series is a cost-effective choice while also being dependable due to its consistent quality. It finds its use in various modern applications such as navigation, satellite communication, radar, and the latest technologies like 4G and 5G communications.

PCB Specifications
Layer count:	Double sided
Base material:	F4B DK 2.2
Dimension:	25 x 26mm
Finished thickness	3.0mm ±10%
Finished Copper weight:	1oz
SMOBC:	No
Surface finish:	HASL Pb free

The main specifications of this board is double sided board, substrate is F4B, DK at 2.2, 61mm long by 62mm wide, finished thickness at 3.0mm, finished copper at 1.0oz, no solder mask no silkscreen and surface finish is OSP.

Let’s see the stack up.
3mm No Silkscreen PTFE PCB Board Hot Air Soldering 0

Top layer and bottom layer are 1oz copper finished. F4b dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.2, 3.0mm thick.

3mm No Silkscreen PTFE PCB Board Hot Air Soldering 1

This is the photo of this board. The basic colour of F4B PCB is brown.

PCB Capability
PCB Material:	PTFE
Code:	F4B series
Dielectric constant:	2.2, 2.55 and 2.65
Dielectric constant:	2.17, 2.45, 2.75 and 3.0
Layer count:	1 Layer, 2 Layer, Multilayer, Hybrid type
Copper weight:	0.5oz, 1oz, 2oz, 3oz
PCB thickness:	0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm,
PCB thickness:	1.5mm, 2.0mm, 3.0mm, 4.0mm and 5.0mm, etc.
PCB Size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

The dielectric constant of F4B material is wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can provide you with prototype service, small batches and mass production service.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet PTFE(F4B)

Name	Test condition			Unit	Value
Density	Normal state			g/ cm³	2.1～2.35
Moisture Absorption	Dip in the distilled water of 20±2℃ for 24 hours			%	≤0.02
Operating Temperature	High-low temperature chamber			℃	-50℃～+260℃
Thermal Conductivity				W/m/k	0.8
CTE (typical)	0～100℃ (εr :2.1~2.3)			ppm/℃	25(x)

					34(y)
					252(z)
CTE (typical)	0～100℃ (εr :2.3~2.9)			ppm/℃	14(x)

					21(y)
					173(z)
CTE (typical)	0～100℃ (εr :2.9~3.5)			ppm/℃	12(x)

					15(y)
					95(z)
Shrinkage Factor	2 hours in boiling water			%	0.0002
Surface Resistivity	500V DC		Normal state	M·Ω	≥1×10⁴

			Constant humidity and temperature		≥1×10³
Volume Resistivity	Normal state			MΩ.cm	≥1×10⁶
	Constant humidity and temperature				≥1×10⁵
Pin Resistance	500V DC	Normal state		MΩ	≥1×10⁵
		Constant humidity and temperature			≥1×10³
Surface dielectric strength	Normal state			d=1mm(Kv/mm)	≥1.2
	Constant humidity and temperature				≥1.1
Dielectric Constant	10GHZ			εr	2.20,2.55,2.65,3.0,3.5 (±2%)

Dissipation Factor	10GHZ			tgδ	2.2	≤7×10^-4
					2.55~2.65	≤1×10^-3
					3.0~3.5	≤1.5×10^-3

3mm No Silkscreen PTFE PCB Board Hot Air Soldering 2

Tags:

Products

MOQ:	1PCS
Price:	USD9.99-99.99
Standard Packaging:	Vacuum bags+Cartons
Delivery Period:	8-9 working days
Payment Method:	T/T
Supply Capacity:	5000PCS per month

Detail Information

Product Description

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng

Certification

UL, ISO9001, IATF16949

Model Number

BIC-100.V1.0

Base Material:

PTFE F4B Series

Layer Count:

1 Layer, 2 Layer, Multilayer, Hybrid Type

PCB Thickness:

0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm And 5.0mm, Etc.

PCB Size:

≤400mm X 500mm

Solder Mask:

Silkscreen:

Copper Weight:

0.5oz, 1oz, 2oz,3oz

Surfacefinish:

Bare Copper, HASL, ENIG, Immersion Tin Etc.

Minimum Order Quantity:

1PCS

Price:

USD9.99-99.99

Packaging Details:

Vacuum bags+Cartons

Delivery Time:

8-9 working days

Payment Terms:

T/T

Supply Ability:

5000PCS per month

Highlight

No Silkscreen Teflon PCB Board

3.0mm Teflon PCB Board

Product Description

Hello everybody,

Today we talk about a type of F4B high frequency circuit board at 3.0mm thick.

PCB Specifications
Layer count:	Double sided
Base material:	F4B DK 2.2
Dimension:	25 x 26mm
Finished thickness	3.0mm ±10%
Finished Copper weight:	1oz
SMOBC:	No
Surface finish:	HASL Pb free

Let’s see the stack up.
3mm No Silkscreen PTFE PCB Board Hot Air Soldering 0

PCB Capability
PCB Material:	PTFE
Code:	F4B series
Dielectric constant:	2.2, 2.55 and 2.65
Dielectric constant:	2.17, 2.45, 2.75 and 3.0
Layer count:	1 Layer, 2 Layer, Multilayer, Hybrid type
Copper weight:	0.5oz, 1oz, 2oz, 3oz
PCB thickness:	0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm,
PCB thickness:	1.5mm, 2.0mm, 3.0mm, 4.0mm and 5.0mm, etc.
PCB Size:	≤400mm X 500mm
Surface finish:	Bare copper, HASL, ENIG, Immersion tin etc.

The dielectric constant of F4B material is wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can provide you with prototype service, small batches and mass production service.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet PTFE(F4B)

Name	Test condition			Unit	Value
Density	Normal state			g/ cm³	2.1～2.35
Moisture Absorption	Dip in the distilled water of 20±2℃ for 24 hours			%	≤0.02
Operating Temperature	High-low temperature chamber			℃	-50℃～+260℃
Thermal Conductivity				W/m/k	0.8
CTE (typical)	0～100℃ (εr :2.1~2.3)			ppm/℃	25(x)

					34(y)
					252(z)
CTE (typical)	0～100℃ (εr :2.3~2.9)			ppm/℃	14(x)

					21(y)
					173(z)
CTE (typical)	0～100℃ (εr :2.9~3.5)			ppm/℃	12(x)

					15(y)
					95(z)
Shrinkage Factor	2 hours in boiling water			%	0.0002
Surface Resistivity	500V DC		Normal state	M·Ω	≥1×10⁴

			Constant humidity and temperature		≥1×10³
Volume Resistivity	Normal state			MΩ.cm	≥1×10⁶
	Constant humidity and temperature				≥1×10⁵
Pin Resistance	500V DC	Normal state		MΩ	≥1×10⁵
		Constant humidity and temperature			≥1×10³
Surface dielectric strength	Normal state			d=1mm(Kv/mm)	≥1.2
	Constant humidity and temperature				≥1.1
Dielectric Constant	10GHZ			εr	2.20,2.55,2.65,3.0,3.5 (±2%)

Dissipation Factor	10GHZ			tgδ	2.2	≤7×10^-4
					2.55~2.65	≤1×10^-3
					3.0~3.5	≤1.5×10^-3

3mm No Silkscreen PTFE PCB Board Hot Air Soldering 2

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