2-Layer F4BTMS1000 PCB 10mil High Frequency Laminate OSP Finish

Are you looking for a high-reliability 2-layer rigid RF PCB designed to meet the rigorous demands of aerospace, military, and high-frequency applications? This 2-layer rigid RF PCB is built with F4BTMS1000 with an OSP finish. Compliant with IPC-Class 2 quality standards, this PCB ensures consistent and reliable performance for critical applications such as aerospace equipment, military radar systems, satellite communications, and phased array antennas. With a strong emphasis on high reliability, low dielectric loss, and wide frequency adaptability, it stands out as the ideal selection for engineers and procurement teams seeking a domestically manufactured, foreign-substitutable substrate for high-precision aerospace and RF projects.

PCB Specifications

PCB Stack-up Configuration

Artwork Format & Availability

Artwork Format: Supplied by Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility and reliability.

Availability: Worldwide – We offer global shipping to cater to the needs of engineers and manufacturers around the world, with delivery times that meet industry standards.

F4BTMS1000 Substrate: The Key to High-Reliability Performance

As part of the upgraded F4BTMS series, the F4BTMS1000 substrate forms the backbone of our PCB’s exceptional reliability and performance, engineered to meet the strict demands of aerospace, military, and high-frequency applications:

The F4BTMS series represents an upgraded version of the F4BTM series, achieving technological breakthroughs in both material formulation and manufacturing processes. Enriched with a significant quantity of ceramics and reinforced with ultra-thin, ultra-fine glass fiber cloth, this material delivers substantial improvements in overall performance and a broader range of dielectric constants. It is a high-reliability material specifically suited for aerospace applications and can serve as a substitute for similar foreign products.

By integrating a small amount of ultra-thin, ultra-fine glass fiber cloth and a large volume of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the material minimizes the negative impact of glass fiber on electromagnetic wave propagation. This design reduces dielectric loss, enhances dimensional stability, and decreases the X/Y/Z anisotropy of the material. It also expands the usable frequency range, improves electrical strength, and boosts thermal conductivity. Additionally, the material exhibits an excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

As a standard feature, the F4BTMS series is equipped with RTF (Reverse-Treated Foil) low-roughness copper foil, which reduces conductor loss and provides excellent peel strength. It is compatible with both copper and aluminum bases, further enhancing its versatility for a wide range of high-reliability applications.

Key Features of F4BTMS1000 PCB

F4BTMS1000 boasts outstanding electrical and mechanical features tailored specifically for high-reliability, high-frequency applications, including:

Dielectric Constant (Dk): 10.2 at 10GHz – Ensures stable signal propagation for high-frequency RF and microwave applications

Dissipation Factor: 0.0020 at 10GHz and 0.0023 at 20GHz – Low dielectric loss, critical for preserving signal integrity in high-frequency circuits

CTE (Coefficient of Thermal Expansion): X-axis 16 ppm/°C, Y-axis 18 ppm/°C, Z-axis 32 ppm/°C (range: -55°C to 288°C) – Excellent dimensional stability across extreme temperature ranges, making it ideal for aerospace environments

Low Thermal Coefficient of Dk: -320 ppm/°C (range: -55°C to 150°C) – Stable dielectric properties under temperature fluctuations, ensuring consistent performance

High Thermal Conductivity: 0.81 W/mk – Enables efficient heat dissipation, protecting components in high-power and harsh environments

Low Moisture Absorption: 0.03% – Enhances reliability in humid or harsh operating conditions, making it suitable for aerospace and military use

Applications

F4BTMS1000 2-layer RF PCB is specifically engineered for high-reliability, high-frequency applications, including:

• Aerospace equipment, space and cabin equipment
• Microwave and RF systems
• Radar systems, particularly military radar
• Feed networks
• Phase-sensitive antennas and phased array antennas
• Satellite communications, and more