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High Frequency PCB TMM10i 15mil 2L Pure Gold Plating

High Frequency PCB TMM10i 15mil 2L Pure Gold Plating

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-470.V1.0
Base Material:
Rogers TMM10i
Layer Count:
2 Layers
PCB Thickness:
0.5mm
PCB Size:
102.8mm X 59mm Per Piece, With A Tolerance Of +/- 0.15mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Pure Gold Plating (No Nickel)
Highlight:

Rogers PCB TMM10i material

,

High Frequency PCB gold plating

,

2 layer Rogers PCB board

Product Description

This PCB is a high-performance double-sided (2-layer) rigid board, constructed in strict accordance with relevant specifications to ensure reliable functionality and stable performance. It adopts Rogers TMM10i isotropic thermoset microwave material as the base material, suitable for various high-frequency applications that require excellent dielectric properties and reliability.

 

PCB specification

Item Details
Base Material Rogers TMM10i
Layer Count Double sided (2 layers, no blind vias)
Board Dimensions 102.8mm x 59mm per piece, with a tolerance of +/- 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Finished Board Thickness 0.5mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Pure Gold Plating (No nickel)
Silkscreen No silkscreen on both top and bottom layers
Solder Mask No solder mask on both top and bottom layers
Quality Control 100% Electrical test conducted prior to shipment

 

PCB Stack-up

Layer Specifications
Copper Layer 1 35 μm
Rogers TMM10i Core 0.381 mm (15 mil) core substrate
Copper Layer 2 35 μm

 

High Frequency PCB TMM10i 15mil 2L Pure Gold Plating 0

 

Artwork and Quality Standard

Type of Artwork Supplied: Gerber RS-274-X, which is recognized as the global industry standard for PCB fabrication.

 

Quality Standard: IPC-Class-2, a widely adopted quality benchmark formulated by the Association Connecting Electronics Industries (IPC) for printed circuit boards.

 

Availability

This PCB is available for worldwide shipping to meet the diverse needs of global projects.

 

Introduction to Rogers TMM10i Base Material

Rogers TMM10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. TMM10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

 

Key Features of Rogers TMM10i Material

Key Features Specifications & Descriptions
Dielectric Constant (Dk) 9.80 +/- 0.245
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk -43 ppm/°K
Coefficient of Thermal Expansion (CTE) Matched to copper; x=19 ppm/K, y=19 ppm/K, z=20 ppm/K
Decomposition Temperature (Td) 425 °C (TGA)
Thermal Conductivity 0.76 W/mk
Available Thickness Range 0.0015 to 0.500 inches +/- 0.0015”

 

Benefits of Using Rogers TMM10i Material

-Mechanical properties resist creep and cold flow, maintaining structural integrity over time

 

-Resistant to process chemicals, reducing damage during PCB fabrication

 

-Material does not require a sodium napthanate treatment prior to electroless plating

 

-Based on a thermoset resin, allowing for reliable wire-bonding

 

-Ensures reliable wire-bonding performance

 

Typical Applications

-RF and microwave circuitry

-Power amplifiers and combiners

-Filters and couplers

-Satellite communication systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric polarizers and lenses

-Chip testers

 

Conclusion

This PCB demonstrates excellent high-frequency performance, reliable structural stability, and superior manufacturability, which are attributed to the outstanding properties of Rogers TMM10i material and rigorous quality control procedures.

 

These characteristics make it an ideal choice for global manufacturers seeking a cost-effective and reliable solution for high-frequency and precision electronic projects—particularly those involving RF and microwave devices that require consistent performance, wide accessibility, and compatibility with standard production workflows.

 

High Frequency PCB TMM10i 15mil 2L Pure Gold Plating 1

products
PRODUCTS DETAILS
High Frequency PCB TMM10i 15mil 2L Pure Gold Plating
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-470.V1.0
Base Material:
Rogers TMM10i
Layer Count:
2 Layers
PCB Thickness:
0.5mm
PCB Size:
102.8mm X 59mm Per Piece, With A Tolerance Of +/- 0.15mm
Solder Mask:
No
Silkscreen:
No
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Pure Gold Plating (No Nickel)
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers PCB TMM10i material

,

High Frequency PCB gold plating

,

2 layer Rogers PCB board

Product Description

This PCB is a high-performance double-sided (2-layer) rigid board, constructed in strict accordance with relevant specifications to ensure reliable functionality and stable performance. It adopts Rogers TMM10i isotropic thermoset microwave material as the base material, suitable for various high-frequency applications that require excellent dielectric properties and reliability.

 

PCB specification

Item Details
Base Material Rogers TMM10i
Layer Count Double sided (2 layers, no blind vias)
Board Dimensions 102.8mm x 59mm per piece, with a tolerance of +/- 0.15mm
Minimum Trace/Space 5/6 mils
Minimum Hole Size 0.25mm
Finished Board Thickness 0.5mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Pure Gold Plating (No nickel)
Silkscreen No silkscreen on both top and bottom layers
Solder Mask No solder mask on both top and bottom layers
Quality Control 100% Electrical test conducted prior to shipment

 

PCB Stack-up

Layer Specifications
Copper Layer 1 35 μm
Rogers TMM10i Core 0.381 mm (15 mil) core substrate
Copper Layer 2 35 μm

 

High Frequency PCB TMM10i 15mil 2L Pure Gold Plating 0

 

Artwork and Quality Standard

Type of Artwork Supplied: Gerber RS-274-X, which is recognized as the global industry standard for PCB fabrication.

 

Quality Standard: IPC-Class-2, a widely adopted quality benchmark formulated by the Association Connecting Electronics Industries (IPC) for printed circuit boards.

 

Availability

This PCB is available for worldwide shipping to meet the diverse needs of global projects.

 

Introduction to Rogers TMM10i Base Material

Rogers TMM10i isotropic thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability in strip-line and micro-strip applications. TMM10i microwave material has an isotropic dielectric constant (Dk). Like the other TMM series materials, TMM10i combines many of the desirable features of ceramic and PTFE substrates, with the ease of soft substrate processing techniques.

 

Key Features of Rogers TMM10i Material

Key Features Specifications & Descriptions
Dielectric Constant (Dk) 9.80 +/- 0.245
Dissipation Factor 0.0020 at 10GHz
Thermal Coefficient of Dk -43 ppm/°K
Coefficient of Thermal Expansion (CTE) Matched to copper; x=19 ppm/K, y=19 ppm/K, z=20 ppm/K
Decomposition Temperature (Td) 425 °C (TGA)
Thermal Conductivity 0.76 W/mk
Available Thickness Range 0.0015 to 0.500 inches +/- 0.0015”

 

Benefits of Using Rogers TMM10i Material

-Mechanical properties resist creep and cold flow, maintaining structural integrity over time

 

-Resistant to process chemicals, reducing damage during PCB fabrication

 

-Material does not require a sodium napthanate treatment prior to electroless plating

 

-Based on a thermoset resin, allowing for reliable wire-bonding

 

-Ensures reliable wire-bonding performance

 

Typical Applications

-RF and microwave circuitry

-Power amplifiers and combiners

-Filters and couplers

-Satellite communication systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric polarizers and lenses

-Chip testers

 

Conclusion

This PCB demonstrates excellent high-frequency performance, reliable structural stability, and superior manufacturability, which are attributed to the outstanding properties of Rogers TMM10i material and rigorous quality control procedures.

 

These characteristics make it an ideal choice for global manufacturers seeking a cost-effective and reliable solution for high-frequency and precision electronic projects—particularly those involving RF and microwave devices that require consistent performance, wide accessibility, and compatibility with standard production workflows.

 

High Frequency PCB TMM10i 15mil 2L Pure Gold Plating 1

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