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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

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Certification
China Bicheng Electronics Technology Co., Ltd certification
China Bicheng Electronics Technology Co., Ltd certification
Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

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Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Large Image :  RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Product Details:
Place of Origin: CHINA
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Model Number: BIC-332.V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD9.99-99.99
Packaging Details: Vacuum bags+Cartons
Delivery Time: 8-9 working days
Payment Terms: T/T
Supply Ability: 5000PCS per month
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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Description
Base Material: Rogers RO4360G2 Layer Count: 2 Layers
PCB Thickness: 0.9mm PCB Size: 73.12mm X 44.71mm Per Piece (1PCS),
Silkscreen: White Solder Mask: Green
Copper Weight: 1oz (1.4 Mils) For Outer Layers Surface Finish: Immersion Gold
Highlight:

RO4360G2 PCB 2 layer

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Rogers PCB immersion gold finish

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32mil substrate PCB board

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
Parameter Details
Base Material Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count 2 layers (rigid structure)
Board Dimensions 73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.30mm
Vias No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness 0.9mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing prior shipment
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4360G2 0.813mm (32mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
RO4360G2 PCB board sample
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
  • Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
  • Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
  • Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
Feature Specification
Dielectric Constant (Dk) 6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF) 0.0038 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >407°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.75 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 13 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating UL 94 V-0
Process Compatibility Lead-free process compatible; FR-4-like fabrication
Core Benefits
  • High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
  • Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
  • Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
  • Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
  • Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
  • Base Station Power Amplifiers
  • Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
RO4360G2 PCB application example

Tag:

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8mil Rogers PCB Board,

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Contact Details
Bicheng Electronics Technology Co., Ltd

Contact Person: Ms. Ivy Deng

Tel: 86-755-27374946

Fax: 86-755-27374848

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