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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
  • name

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4360G2
Layer Count:
2 Layers
PCB Thickness:
0.9mm
PCB Size:
73.12mm X 44.71mm Per Piece (1PCS),
Silkscreen:
White
Solder Mask:
Green
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Highlight:

RO4360G2 PCB 2 layer

,

Rogers PCB immersion gold finish

,

32mil substrate PCB board

Product Description
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
Parameter Details
Base Material Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count 2 layers (rigid structure)
Board Dimensions 73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.30mm
Vias No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness 0.9mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing prior shipment
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4360G2 0.813mm (32mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 0
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
  • Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
  • Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
  • Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
Feature Specification
Dielectric Constant (Dk) 6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF) 0.0038 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >407°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.75 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 13 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating UL 94 V-0
Process Compatibility Lead-free process compatible; FR-4-like fabrication
Core Benefits
  • High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
  • Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
  • Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
  • Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
  • Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
  • Base Station Power Amplifiers
  • Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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Products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
  • name
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
MOQ: 1PCS
Price: USD9.99-99.99
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Model Number
BIC-332.V1.0
Base Material:
Rogers RO4360G2
Layer Count:
2 Layers
PCB Thickness:
0.9mm
PCB Size:
73.12mm X 44.71mm Per Piece (1PCS),
Silkscreen:
White
Solder Mask:
Green
Copper Weight:
1oz (1.4 Mils) For Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

RO4360G2 PCB 2 layer

,

Rogers PCB immersion gold finish

,

32mil substrate PCB board

Product Description
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish
Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
Parameter Details
Base Material Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count 2 layers (rigid structure)
Board Dimensions 73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 6 mils (space)
Minimum Hole Size 0.30mm
Vias No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness 0.9mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing prior shipment
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4360G2 0.813mm (32mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 0
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
  • Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
  • Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
  • Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
Feature Specification
Dielectric Constant (Dk) 6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF) 0.0038 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >407°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.75 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 13 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating UL 94 V-0
Process Compatibility Lead-free process compatible; FR-4-like fabrication
Core Benefits
  • High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
  • Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
  • Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
  • Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
  • Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
  • Base Station Power Amplifiers
  • Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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