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Product Details:
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| Base Material: | Rogers RO3203 | Layer Count: | 2 Layers |
|---|---|---|---|
| PCB Thickness: | 0.35mm | PCB Size: | 74.57mm X 23.28mm Per Piece (1PCS), |
| Silkscreen: | White | Solder Mask: | Green |
| Copper Weight: | 1oz (1.4 Mils) For Outer Layers | Surface Finish: | ENEPIG |
| Highlight: | Rogers RO3203 double-layer PCB,10mil ENEPIG finish PCB,Rogers PCB with ENEPIG coating |
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| Parameter | Details |
|---|---|
| Base Material | Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite) |
| Layer Count | 2-Layer (rigid structure) |
| Board Dimensions | 74.57mm x 23.28mm per piece (1PCS) |
| Minimum Trace/Space | 4 mils (trace) / 7 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; via plating thickness = 20 μm |
| Finished Board Thickness | 0.35mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | ENEPIG |
| Silkscreen | White silkscreen on top layer, no silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer, no solder mask on bottom layer |
| Quality Assurance | 100% electrical testing conducted prior to shipment |
| Layer Name | Material | Thickness |
|---|---|---|
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Substrate Layer | Rogers RO3203 | 0.254mm (10mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
| Feature | Specification |
|---|---|
| Material Composition | Ceramic-filled PTFE composite (woven fiberglass-reinforced) |
| Dielectric Constant (Dk) | 3.02 ± 0.04 at 10GHz/23°C |
| Dissipation Factor (DF) | 0.0016 at 10GHz/23°C |
| Decomposition Temperature (Td) | >500°C |
| Thermal Conductivity | 0.87 W/mK |
| Coefficient of Thermal Expansion (CTE) | X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C) |
| Process Compatibility | Lead-free process compatible |
| Flammability Rating | UL 94 V-0 |
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848