MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
This 4-layer printed circuit board (PCB) constructed with RT/duroid 5880 and RO4450F materials. Designed for high-frequency applications, it offers exceptional performance and reliability, making it ideal for advanced telecommunications and radar systems.
Material Composition
The base materials of this PCB are RT/duroid 5880 and RO4450F:
- RT/duroid 5880: A PTFE composite reinforced with glass microfibers, known for its uniform dielectric properties and low loss at high frequencies.
- RO4450F: A bonding layer that complements the RT/duroid material, enhancing overall performance.
PCB specification
Parameter | Specification |
Base Material | RT/duroid 5880 / RO4450F |
Layer Count | 4 Layers of Copper |
Board Dimensions | 50mm x 60mm ± 0.15mm |
Minimum Trace/Space | 5/7 mils |
Minimum Hole Size | 0.45mm |
Blind Vias | Top - Inner Layer 3 |
Finished Board Thickness | 3.0mm |
Finished Cu Weight | 1oz (1.4 mils) for outer/inner layers |
Via Plating Thickness | 20 μm |
Surface Finish | OSP |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Electrical Testing | 100% electrical test used prior to shipment |
Artwork and Compliance
The artwork for this PCB is provided in the Gerber RS-274-X format, which is widely accepted in the industry. Compliance with IPC-Class-2 standards guarantees that the PCB meets rigorous quality benchmarks for reliability and performance. This adherence is critical for applications where failure is not an option.
Global Availability
This advanced 4-layer PCB is available worldwide, making it accessible for various industries and applications. Its design is versatile enough to be utilized in multiple high-tech sectors.
Introduction to RT/duroid 5880
RT/duroid 5880 is specifically designed for high-frequency applications. Its key characteristics include:
- Dielectric Constant: 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C
- Dissipation Factor: 0.0009 at 10 GHz
- Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C
- Low Moisture Absorption: 0.02%
- CTE: 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), 237 ppm/°C (Z-axis)
These properties ensure that RT/duroid 5880 maintains excellent electrical performance across a wide frequency range, making it suitable for Ku-band and millimeter wave applications.
Benefits of RT/duroid 5880
1. Uniform Electrical Properties: The dielectric constant remains consistent across different panels, which is crucial for high-frequency applications.
2. Ease of Machining: RT/duroid 5880 can be easily cut and shaped, allowing for precise design implementations.
3. Chemical Resistance: It is resistant to solvents and reagents commonly used in PCB manufacturing, ensuring durability and longevity.
4. Ideal for Moisture-Rich Environments: Its low moisture absorption makes it suitable for high-humidity applications.
Applications
This 4-layer PCB is particularly suited for various high-tech applications, including:
- Commercial Airline Broadband Antennas: Ensuring reliable communication in-flight.
- Microstrip and Stripline Circuits: Widely used in RF applications where space is constrained.
- Millimeter Wave Applications: Essential for cutting-edge technologies such as 5G and beyond.
- Radar Systems: Critical for navigation and targeting systems in military and civilian applications.
- Guidance Systems: Used in precision navigation technologies.
- Point-to-Point Digital Radio Antennas: Enabling high-speed data transmission.
Conclusion
The 4-layer PCB constructed with RT/duroid 5880 and RO4450F represents a significant advancement in PCB technology. Its robust design, combined with high-frequency performance characteristics, makes it an ideal choice for modern electronic applications that demand reliability and precision. With its global availability and adherence to strict quality standards, this PCB stands ready to meet the challenges of today's high-tech environments.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
This 4-layer printed circuit board (PCB) constructed with RT/duroid 5880 and RO4450F materials. Designed for high-frequency applications, it offers exceptional performance and reliability, making it ideal for advanced telecommunications and radar systems.
Material Composition
The base materials of this PCB are RT/duroid 5880 and RO4450F:
- RT/duroid 5880: A PTFE composite reinforced with glass microfibers, known for its uniform dielectric properties and low loss at high frequencies.
- RO4450F: A bonding layer that complements the RT/duroid material, enhancing overall performance.
PCB specification
Parameter | Specification |
Base Material | RT/duroid 5880 / RO4450F |
Layer Count | 4 Layers of Copper |
Board Dimensions | 50mm x 60mm ± 0.15mm |
Minimum Trace/Space | 5/7 mils |
Minimum Hole Size | 0.45mm |
Blind Vias | Top - Inner Layer 3 |
Finished Board Thickness | 3.0mm |
Finished Cu Weight | 1oz (1.4 mils) for outer/inner layers |
Via Plating Thickness | 20 μm |
Surface Finish | OSP |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Electrical Testing | 100% electrical test used prior to shipment |
Artwork and Compliance
The artwork for this PCB is provided in the Gerber RS-274-X format, which is widely accepted in the industry. Compliance with IPC-Class-2 standards guarantees that the PCB meets rigorous quality benchmarks for reliability and performance. This adherence is critical for applications where failure is not an option.
Global Availability
This advanced 4-layer PCB is available worldwide, making it accessible for various industries and applications. Its design is versatile enough to be utilized in multiple high-tech sectors.
Introduction to RT/duroid 5880
RT/duroid 5880 is specifically designed for high-frequency applications. Its key characteristics include:
- Dielectric Constant: 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C
- Dissipation Factor: 0.0009 at 10 GHz
- Temperature Coefficient of Dielectric Constant (TCDk): -125 ppm/°C
- Low Moisture Absorption: 0.02%
- CTE: 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), 237 ppm/°C (Z-axis)
These properties ensure that RT/duroid 5880 maintains excellent electrical performance across a wide frequency range, making it suitable for Ku-band and millimeter wave applications.
Benefits of RT/duroid 5880
1. Uniform Electrical Properties: The dielectric constant remains consistent across different panels, which is crucial for high-frequency applications.
2. Ease of Machining: RT/duroid 5880 can be easily cut and shaped, allowing for precise design implementations.
3. Chemical Resistance: It is resistant to solvents and reagents commonly used in PCB manufacturing, ensuring durability and longevity.
4. Ideal for Moisture-Rich Environments: Its low moisture absorption makes it suitable for high-humidity applications.
Applications
This 4-layer PCB is particularly suited for various high-tech applications, including:
- Commercial Airline Broadband Antennas: Ensuring reliable communication in-flight.
- Microstrip and Stripline Circuits: Widely used in RF applications where space is constrained.
- Millimeter Wave Applications: Essential for cutting-edge technologies such as 5G and beyond.
- Radar Systems: Critical for navigation and targeting systems in military and civilian applications.
- Guidance Systems: Used in precision navigation technologies.
- Point-to-Point Digital Radio Antennas: Enabling high-speed data transmission.
Conclusion
The 4-layer PCB constructed with RT/duroid 5880 and RO4450F represents a significant advancement in PCB technology. Its robust design, combined with high-frequency performance characteristics, makes it an ideal choice for modern electronic applications that demand reliability and precision. With its global availability and adherence to strict quality standards, this PCB stands ready to meet the challenges of today's high-tech environments.