Introducing our newly shipped 2-layer rigid PCB featuring RF-30, a high-performance, low-cost antenna laminate designed for microwave and radio frequency applications. This PCB combines advanced material technology with precise engineering to meet the demands of modern electronic devices.
1. Technical Specifications
PCB Construction
This 2-layer rigid PCB is engineered with precision to ensure optimal performance for various uses. Here are its key specifications:
- Base Material: RF-30, renowned for its excellent electrical characteristics.
- Layer Count: 2 layers, providing a solid foundation for circuit designs.
- Board Dimensions: 151 mm x 82 mm (± 0.15mm), suitable for diverse applications.
- Finished Board Thickness: 1.1mm, offering durability while maintaining a compact profile.
- Finished Copper Weight: 1oz (1.4 mils), enhancing signal integrity.
- Minimum Trace/Space: 5/4 mils, enabling high-density layouts.
- Minimum Hole Size: 0.3mm, accommodating various components.
- Via Plating Thickness: 20 μm, ensuring dependable electrical connections.
- Surface Finish: Immersion tin, providing excellent solderability and resistance to corrosion.
PCB Stackup
- Copper Layer 1: 35 μm
- RF-30 Core: 1.016 mm (40 mil), optimized to reduce phase shift and improve signal quality.
- Copper Layer 2: 35 μm
2. Advantages of RF-30 Material
High Dielectric Constant
RF-30 features a dielectric constant of 3.0 ± 0.05 at 1.9 GHz, making it ideal for RF applications where size reduction is essential without sacrificing performance. This is particularly advantageous for compact devices requiring effective signal processing.
Low Dissipation Factor
With a dissipation factor of 0.0014 at 1.9 GHz, RF-30 minimizes energy losses, resulting in enhanced circuit efficiency. This characteristic is critical for maintaining signal integrity in high-frequency environments.
Excellent Dimensional Stability
The woven glass reinforcement in RF-30 provides exceptional stability, ensuring that the PCB can endure thermal and mechanical stresses during assembly and operation. This stability is vital for consistent performance across various conditions.
Superior Thermal and Electrical Properties
RF-30 boasts a dielectric breakdown of > 60kV and a volume resistivity of 1.26 x 10^9 Mohm-cm, making it suitable for high-power applications. Additionally, its low moisture absorption rate of 0.02% enhances reliability in humid environments.
3. Applications
RF-30 PCB is perfectly suited for a range of applications, including:
- Antenna and Subcomponents: Crucial for enabling wireless communication in numerous devices.
- RF Passive Components: Such as filters, couplers, and power dividers, essential for effective signal processing.
- Power Amplifiers: Supporting high-performance RF circuits that necessitate robust thermal management.
4. Quality Assurance
We adhere to IPC-Class-2 manufacturing standards, ensuring that all our PCBs meet rigorous quality benchmarks. Each board undergoes comprehensive 100% electrical testing before shipment, assuring reliability and performance.
5. Global Availability
We are pleased to offer our RF-30 PCB worldwide.This broad accessibility allows manufacturers and developers from various sectors to incorporate our advanced technology into their projects.
Conclusion
In summary, this PCB utilizing RF-30 material is a significant innovation in the PCB field. With its outstanding specifications, material benefits, and suitability for a wide range of applications, this PCB stands out as a premier choice for modern electronic designs.
For manufacturers and developers seeking high-performance solutions at competitive prices, our RF-30 PCB provides an exceptional blend of reliability, efficiency, and value. Contact us today to place an order!
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