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3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
RO4003C /RO4450F
Layer Count:
3 Layers
PCB Thickness:
1.82mm
PCB Size:
291mm X 155 Mm=2 Types=2PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers / 1oz Inner Layers
Solder Mask:
Black
Silkscreen:
White
Surface Finish:
Immersion Gold
Highlight:

3-layer Rogers RO4003C PCB

,

1.8mm thick RO4003C PCB

,

Blind vias Rogers PCB board

Product Description

This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.

 

PCB details

Parameter Specification
Base Material RO4003C / RO4450F
Layer Count 3 Layers
Board Dimensions 291mm x 155mm ± 0.15mm (2 Types, 2 PCS)
Minimum Trace/Space 5/4 mils
Minimum Hole Size 0.3mm
Blind Vias Top Layer to Inner Layer 1
Finished Board Thickness 1.82mm
Finished Cu Weight 1oz (1.4 mils) outer layers / 1oz inner layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Black
Bottom Solder Mask No
Electrical Testing 100% electrical test used prior to shipment

 

The stack-up of this 3-layer rigid PCB is structured as follows:

 

- Copper Layer 1: 35 μm

-Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 2: 35 μm

- Bonding Ply: RO4450F - 0.102 mm (4 mil)

- Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 3: 35 μm

 

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias 0

 

Artwork and Quality Standards

The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.

 

Global Availability

This high-performance PCB is available worldwide, making it accessible for various applications across different markets.

 

Introduction to RO4003C

Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:

 

- Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz

- Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz

- Thermal Coefficient of Dielectric Constant: +40 ppm/°C

- Thermal Conductivity: 0.71 W/m/°K

- Low Moisture Absorption: 0.06%

 

The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.

 

Benefits

Rogers RO4003C offers numerous benefits, including:

- Ideal for multi-layer board constructions

- Lower fabrication costs compared to standard materials like FR-4

- Designed for performance-sensitive, high-volume applications

- Competitively priced, making it a popular choice

 

Typical Applications

RO4003C PCB is suitable for various applications, including:

 

- Cellular base station antennas and power amplifiers

- RF identification tags

- Automotive radar and sensors

- LNBs for direct broadcast satellites

 

Conclusion

The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.

 

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias 1

products
PRODUCTS DETAILS
3-Layer RO4003C PCB 1.8mm Thick with Blind Vias
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
China
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
PCB Material:
RO4003C /RO4450F
Layer Count:
3 Layers
PCB Thickness:
1.82mm
PCB Size:
291mm X 155 Mm=2 Types=2PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils) Outer Layers / 1oz Inner Layers
Solder Mask:
Black
Silkscreen:
White
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

3-layer Rogers RO4003C PCB

,

1.8mm thick RO4003C PCB

,

Blind vias Rogers PCB board

Product Description

This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.

 

PCB details

Parameter Specification
Base Material RO4003C / RO4450F
Layer Count 3 Layers
Board Dimensions 291mm x 155mm ± 0.15mm (2 Types, 2 PCS)
Minimum Trace/Space 5/4 mils
Minimum Hole Size 0.3mm
Blind Vias Top Layer to Inner Layer 1
Finished Board Thickness 1.82mm
Finished Cu Weight 1oz (1.4 mils) outer layers / 1oz inner layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Black
Bottom Solder Mask No
Electrical Testing 100% electrical test used prior to shipment

 

The stack-up of this 3-layer rigid PCB is structured as follows:

 

- Copper Layer 1: 35 μm

-Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 2: 35 μm

- Bonding Ply: RO4450F - 0.102 mm (4 mil)

- Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 3: 35 μm

 

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias 0

 

Artwork and Quality Standards

The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.

 

Global Availability

This high-performance PCB is available worldwide, making it accessible for various applications across different markets.

 

Introduction to RO4003C

Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:

 

- Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz

- Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz

- Thermal Coefficient of Dielectric Constant: +40 ppm/°C

- Thermal Conductivity: 0.71 W/m/°K

- Low Moisture Absorption: 0.06%

 

The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.

 

Benefits

Rogers RO4003C offers numerous benefits, including:

- Ideal for multi-layer board constructions

- Lower fabrication costs compared to standard materials like FR-4

- Designed for performance-sensitive, high-volume applications

- Competitively priced, making it a popular choice

 

Typical Applications

RO4003C PCB is suitable for various applications, including:

 

- Cellular base station antennas and power amplifiers

- RF identification tags

- Automotive radar and sensors

- LNBs for direct broadcast satellites

 

Conclusion

The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.

 

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias 1

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