This PCB is a high-performance 2-layer printed circuit board made from advanced RO4533 material. It is engineered for precision and reliability, meeting stringent specifications to ensure controlled dielectric constant and low loss performance, making it ideal for mobile infrastructure and antenna applications.
PCB Stackup
The stackup of the PCB is structured as follows:
- Copper Layer 1: 35 μm
- Rogers 4533 Core: 0.508 mm (20 mil)
- Copper Layer 2: 35 μm
This configuration ensures optimal performance while maintaining structural integrity.
PCB specification
| Parameter |
Specification |
| Base Material |
RO4533 |
| Layer Count |
2 Layers |
| Board Dimensions |
52mm x 35mm ± 0.15mm |
| Minimum Trace/Space |
4/7 mils |
| Minimum Hole Size |
0.3mm |
| Blind Vias |
No |
| Finished Board Thickness |
0.6mm |
| Finished Cu Weight |
1oz (1.4 mils) outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Immersion Gold |
| Top Silkscreen |
White |
| Bottom Silkscreen |
No |
| Top Solder Mask |
Green |
| Bottom Solder Mask |
No |
| Electrical Testing |
100% electrical test used prior to shipment |
Artwork and Quality Standards
The PCB artwork is provided in the Gerber RS-274-X format, complying with IPC-Class-2 quality standards. This adherence ensures the PCB meets industry benchmarks for reliability and performance.
Global Availability
This high-performance PCB is available on a global scale, making it an ideal choice for various applications across multiple industries.
Introduction to RO4533
Rogers RO4533 laminates are known for their ceramic-filled, glass-reinforced hydrocarbon composition. They deliver controlled dielectric constants and low loss performance, crucial for microstrip antenna applications. Key features include:
- Dielectric Constant (Dk): 3.3 at 10GHz
- Dissipation Factor: 0.0025 at 10GHz
- Thermal Conductivity: 0.6 W/mK
- Glass Transition Temperature (Tg): >280°C
This material serves as an affordable alternative to traditional PTFE materials, allowing designers to optimize both cost and performance.
Benefits
The RO4533 material offers numerous advantages:
- Low loss and low dielectric constant suitable for a wide range of applications
- Compatibility with conventional PCB fabrication processes
- Excellent dimensional stability for higher yield on larger panels
- Uniform mechanical properties that maintain integrity during handling
- High thermal conductivity for enhanced power handling capabilities
Typical Applications
This 2-layer PCB is particularly suited for:
- Cellular infrastructure base station antennas
- WiMAX antenna networks
Conclusion
The 2-layer PCB utilizing RO4533 is engineered for high-performance applications, particularly in telecommunications and antenna technology. Its combination of advanced materials, rigorous quality standards, and global availability make it an excellent choice for modern electronic designs.
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