MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing a high-performance PCB constructed from Rogers RO3003 material, designed specifically for advanced RF and microwave applications.With dimensions of 45mm x 44.5mm, this compact PCB delivers exceptional reliability and signal integrity, making it an ideal choice for cutting-edge technologies, including automotive radar and 5G wireless infrastructure.
Understanding Rogers RO3003 Material
Rogers RO3003 is a ceramic-filled PTFE composite known for its outstanding electrical and thermal properties, making it ideal for commercial microwave and RF applications. The material exhibits excellent stability of dielectric constant (Dk) over various temperatures and frequencies, eliminating the step change in Dk typically seen in PTFE glass materials. This characteristic is crucial in applications such as automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure, where consistent performance is paramount.
Key Material Properties
- Dielectric Constant: 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Conductivity: 0.5 W/mK
- Moisture Absorption: 0.04%
- Coefficient of Thermal Expansion: -55 to 288 °C with low expansion coefficients in the X, Y, and Z axes
Construction Details
This 2-layer PCB features a rigid construction with the following specifications:
- Base Material: Rogers RO3003
- Layer Count: 2
- Board Dimensions: 45mm x 44.5mm
- Finished Board Thickness: 0.3mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm (no blind vias)
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Silkscreen: Black on the top; no silkscreen on the bottom
RO3003 Typical Value | |||||
Property | RO3003 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.9 | j/g/k | Calculated | ||
Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits of Our RO3003 PCB
1. High-Frequency Performance
The low dielectric loss of the RO3003 material enables the PCB to function effectively in high-frequency applications, reaching up to 77 GHz. This makes it an excellent choice for RF applications where signal integrity is critical.
2. Thermal Stability
With a thermal conductivity of 0.5 W/mK and a Td greater than 500°C, our PCB can withstand extreme temperatures without compromising performance. This is essential for applications that experience fluctuating thermal conditions.
3. Dimensional Stability
The low in-plane expansion coefficient of the material ensures that the PCB maintains its integrity and performance even with temperature changes. This reliability is crucial for surface-mounted assemblies that are sensitive to thermal variations.
4. Cost-Effective Manufacturing
Our PCB is designed for volume manufacturing, providing economical laminate pricing while maintaining high standards of quality and reliability. This makes it an appealing choice for businesses looking to scale their production without sacrificing performance.
Typical Applications
Rogers RO3003 PCB is versatile and suitable for various applications, including:
- Automotive Radar Systems: Essential for advanced driver assistance systems and collision avoidance technologies.
- GPS Antennas: Providing precise location tracking in various devices.
- Cellular Telecommunications: Supporting power amplifiers and antennas for robust communication networks.
- Wireless Communication: Ideal for patch antennas and other wireless technologies.
- Direct Broadcast Satellites: Ensuring reliable signal transmission for satellite communications.
- Remote Meter Readers: Facilitating efficient data collection in utilities.
- Power Backplanes: Supporting power distribution in complex electronic systems.
Conclusion
As industries continue to advance towards higher frequencies and more complex applications, Rogers RO3003 PCB stands at the forefront of PCB technology. Combining high-performance materials with meticulous construction, this PCB offers unmatched reliability and efficiency in a compact design.
For further inquiries or to place an order, please contact our sales team. Let us help you achieve your high-frequency performance goals with our PCB solutions.
MOQ: | 1PCS |
Price: | USD9.99-99.99/PCS |
Standard Packaging: | Vacuum bags+Cartons |
Delivery Period: | 8-9 working days |
Payment Method: | T/T |
Supply Capacity: | 5000PCS per month |
Introducing a high-performance PCB constructed from Rogers RO3003 material, designed specifically for advanced RF and microwave applications.With dimensions of 45mm x 44.5mm, this compact PCB delivers exceptional reliability and signal integrity, making it an ideal choice for cutting-edge technologies, including automotive radar and 5G wireless infrastructure.
Understanding Rogers RO3003 Material
Rogers RO3003 is a ceramic-filled PTFE composite known for its outstanding electrical and thermal properties, making it ideal for commercial microwave and RF applications. The material exhibits excellent stability of dielectric constant (Dk) over various temperatures and frequencies, eliminating the step change in Dk typically seen in PTFE glass materials. This characteristic is crucial in applications such as automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure, where consistent performance is paramount.
Key Material Properties
- Dielectric Constant: 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Conductivity: 0.5 W/mK
- Moisture Absorption: 0.04%
- Coefficient of Thermal Expansion: -55 to 288 °C with low expansion coefficients in the X, Y, and Z axes
Construction Details
This 2-layer PCB features a rigid construction with the following specifications:
- Base Material: Rogers RO3003
- Layer Count: 2
- Board Dimensions: 45mm x 44.5mm
- Finished Board Thickness: 0.3mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.3mm (no blind vias)
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Silkscreen: Black on the top; no silkscreen on the bottom
RO3003 Typical Value | |||||
Property | RO3003 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.06 0.07 |
X Y |
mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 930 823 |
X Y |
MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.9 | j/g/k | Calculated | ||
Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) |
17 16 25 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits of Our RO3003 PCB
1. High-Frequency Performance
The low dielectric loss of the RO3003 material enables the PCB to function effectively in high-frequency applications, reaching up to 77 GHz. This makes it an excellent choice for RF applications where signal integrity is critical.
2. Thermal Stability
With a thermal conductivity of 0.5 W/mK and a Td greater than 500°C, our PCB can withstand extreme temperatures without compromising performance. This is essential for applications that experience fluctuating thermal conditions.
3. Dimensional Stability
The low in-plane expansion coefficient of the material ensures that the PCB maintains its integrity and performance even with temperature changes. This reliability is crucial for surface-mounted assemblies that are sensitive to thermal variations.
4. Cost-Effective Manufacturing
Our PCB is designed for volume manufacturing, providing economical laminate pricing while maintaining high standards of quality and reliability. This makes it an appealing choice for businesses looking to scale their production without sacrificing performance.
Typical Applications
Rogers RO3003 PCB is versatile and suitable for various applications, including:
- Automotive Radar Systems: Essential for advanced driver assistance systems and collision avoidance technologies.
- GPS Antennas: Providing precise location tracking in various devices.
- Cellular Telecommunications: Supporting power amplifiers and antennas for robust communication networks.
- Wireless Communication: Ideal for patch antennas and other wireless technologies.
- Direct Broadcast Satellites: Ensuring reliable signal transmission for satellite communications.
- Remote Meter Readers: Facilitating efficient data collection in utilities.
- Power Backplanes: Supporting power distribution in complex electronic systems.
Conclusion
As industries continue to advance towards higher frequencies and more complex applications, Rogers RO3003 PCB stands at the forefront of PCB technology. Combining high-performance materials with meticulous construction, this PCB offers unmatched reliability and efficiency in a compact design.
For further inquiries or to place an order, please contact our sales team. Let us help you achieve your high-frequency performance goals with our PCB solutions.