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RT Duroid 6002 PCB 2-layer 5mil Immersion Tin RF Circuits

RT Duroid 6002 PCB 2-layer 5mil Immersion Tin RF Circuits

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RT/duroid 6002 Substrate - 5mil (0.127mm)
Layer Count:
2-layer
PCB Size:
390mm X 310.9mm=1PCS
PCB Thickness:
0.2 Mm
Surface Finish:
Immersion Tin
Solder Mask:
No
Highlight:

5mil Immersion Tin PCB

,

RF Circuits Immersion Tin PCB

Product Description

Introducing our high-performance 2-layer PCB, meticulously engineered for advanced applications. This board is constructed from Rogers RT/duroid 6002, a ceramic-filled PTFE material renowned for its low dielectric constant and exceptional high-frequency performance.

 

PCB Construction: An Overview

Our 2-layer PCB is designed with precision, featuring:

 

- Base Material: Rogers RT/Duroid 6002, a ceramic-filled PTFE laminate known for its superior electrical and mechanical properties.
 

- Layer Count: 2 layers, ensuring a compact design while maintaining performance.
 

- Board Dimensions: 390mm x 310.9mm, providing ample space for complex circuitry.
 

- Minimum Trace/Space: 4/5 mils, allowing for dense layouts that are critical in modern electronics.
 

- Minimum Hole Size: 0.2mm, facilitating the integration of finer components.
 

- Finished Board Thickness: 0.2mm, which is ideal for applications requiring minimal weight and thickness.
 

- Surface Finish: Immersion Tin, providing excellent solderability and protection against oxidation.

 

Electrical Integrity and Testing

Prior to shipment, each board undergoes 100% electrical testing, ensuring reliability and performance. This rigorous quality control process guarantees that our customers receive only the highest quality PCBs, ready for deployment in mission-critical applications.

 

Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.94     8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/℃ 10 GHz 0℃-100℃ IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23℃ ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi)   ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3   ASTM D 792
Specific Heat 0.93(0.22)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 8.9(1.6)   Ibs/in.(N/mm)   IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Material Insights: Rogers RT/Duroid 6002

 

What Makes RT/Duroid 6002 Special?

Rogers RT/Duroid 6002 is a unique material characterized by:

 

- Low Dielectric Constant (Dk): 2.94 +/- 0.04, which minimizes signal loss at high frequencies.
 

- Low Thermal Coefficient of Dk: 12 ppm/°C, ensuring stability across temperature variations.
 

- Dissipation Factor: 0.0012 at 10GHz, ideal for microwave applications.
 

- Thermal Conductivity: 0.6 W/m/k, providing efficient heat dissipation.
 

- Moisture Absorption: 0.02%, which is critical for maintaining performance in humid environments.

 

RT Duroid 6002 PCB 2-layer 5mil Immersion Tin RF Circuits 0

 

Benefits of Using RT/Duroid 6002

1. Low Loss Characteristics: The material allows for excellent high-frequency performance, making it suitable for RF and microwave applications.
 

2. Dimensional Stability: Its low coefficient of thermal expansion reduces the risk of warping or distortion, ensuring the integrity of the board over time.
 

3. Mechanical Reliability: RT/Duroid 6002 offers robust mechanical properties, making it ideal for applications where durability is essential.

 

PCB Stack-up

The stackup of our 2-layer PCB consists of:

 

- Copper Layer 1: 35 μm
- Rogers RT/Duroid 6002 Substrate: 5 mil (0.127mm)
- Copper Layer 2: 35 μm

 

This configuration optimizes the electrical performance while maintaining a lightweight profile, necessary for modern electronic devices.

 

Typical Applications

Our 2-layer PCB is particularly well-suited for:

 

- Phased Array Antennas: Essential in advanced communication systems.
 

- Radar Systems: Both ground-based and airborne, where precision is critical.
 

- GPS Antennas: Supporting navigation technologies globally.
 

- Power Backplanes: Facilitating efficient power distribution in high-performance systems.
 

- Commercial Airline Collision Avoidance Systems: Enhancing safety in aviation.
 

- Beam Forming Networks: Key in signal processing and transmission.

 

Conclusion

In conclusion, our newly shipped 2-layer PCB made from Rogers RT/Duroid 6002 and featuring an immersion tin surface finish represents a significant advancement in PCB technology. With its exceptional electrical performance, robust construction, and suitability for various demanding applications, this PCB is poised to meet the needs of industries ranging from telecommunications to aerospace.

 

By choosing our PCB, you are opting for reliability, performance, and innovation. We are committed to providing our customers with the highest quality products that enhance their designs and drive their success in the competitive electronics market.

For inquiries or to place an order, please contact our sales team today!

products
PRODUCTS DETAILS
RT Duroid 6002 PCB 2-layer 5mil Immersion Tin RF Circuits
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
Rogers RT/duroid 6002 Substrate - 5mil (0.127mm)
Layer Count:
2-layer
PCB Size:
390mm X 310.9mm=1PCS
PCB Thickness:
0.2 Mm
Surface Finish:
Immersion Tin
Solder Mask:
No
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

5mil Immersion Tin PCB

,

RF Circuits Immersion Tin PCB

Product Description

Introducing our high-performance 2-layer PCB, meticulously engineered for advanced applications. This board is constructed from Rogers RT/duroid 6002, a ceramic-filled PTFE material renowned for its low dielectric constant and exceptional high-frequency performance.

 

PCB Construction: An Overview

Our 2-layer PCB is designed with precision, featuring:

 

- Base Material: Rogers RT/Duroid 6002, a ceramic-filled PTFE laminate known for its superior electrical and mechanical properties.
 

- Layer Count: 2 layers, ensuring a compact design while maintaining performance.
 

- Board Dimensions: 390mm x 310.9mm, providing ample space for complex circuitry.
 

- Minimum Trace/Space: 4/5 mils, allowing for dense layouts that are critical in modern electronics.
 

- Minimum Hole Size: 0.2mm, facilitating the integration of finer components.
 

- Finished Board Thickness: 0.2mm, which is ideal for applications requiring minimal weight and thickness.
 

- Surface Finish: Immersion Tin, providing excellent solderability and protection against oxidation.

 

Electrical Integrity and Testing

Prior to shipment, each board undergoes 100% electrical testing, ensuring reliability and performance. This rigorous quality control process guarantees that our customers receive only the highest quality PCBs, ready for deployment in mission-critical applications.

 

Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.94     8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/℃ 10 GHz 0℃-100℃ IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23℃ ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi)   ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6   W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500   ℃ TGA   ASTM D 3850
Density 2.1   gm/cm3   ASTM D 792
Specific Heat 0.93(0.22)   j/g/k
(BTU/ib/OF)
  Calculated
Copper Peel 8.9(1.6)   Ibs/in.(N/mm)   IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        

 

Material Insights: Rogers RT/Duroid 6002

 

What Makes RT/Duroid 6002 Special?

Rogers RT/Duroid 6002 is a unique material characterized by:

 

- Low Dielectric Constant (Dk): 2.94 +/- 0.04, which minimizes signal loss at high frequencies.
 

- Low Thermal Coefficient of Dk: 12 ppm/°C, ensuring stability across temperature variations.
 

- Dissipation Factor: 0.0012 at 10GHz, ideal for microwave applications.
 

- Thermal Conductivity: 0.6 W/m/k, providing efficient heat dissipation.
 

- Moisture Absorption: 0.02%, which is critical for maintaining performance in humid environments.

 

RT Duroid 6002 PCB 2-layer 5mil Immersion Tin RF Circuits 0

 

Benefits of Using RT/Duroid 6002

1. Low Loss Characteristics: The material allows for excellent high-frequency performance, making it suitable for RF and microwave applications.
 

2. Dimensional Stability: Its low coefficient of thermal expansion reduces the risk of warping or distortion, ensuring the integrity of the board over time.
 

3. Mechanical Reliability: RT/Duroid 6002 offers robust mechanical properties, making it ideal for applications where durability is essential.

 

PCB Stack-up

The stackup of our 2-layer PCB consists of:

 

- Copper Layer 1: 35 μm
- Rogers RT/Duroid 6002 Substrate: 5 mil (0.127mm)
- Copper Layer 2: 35 μm

 

This configuration optimizes the electrical performance while maintaining a lightweight profile, necessary for modern electronic devices.

 

Typical Applications

Our 2-layer PCB is particularly well-suited for:

 

- Phased Array Antennas: Essential in advanced communication systems.
 

- Radar Systems: Both ground-based and airborne, where precision is critical.
 

- GPS Antennas: Supporting navigation technologies globally.
 

- Power Backplanes: Facilitating efficient power distribution in high-performance systems.
 

- Commercial Airline Collision Avoidance Systems: Enhancing safety in aviation.
 

- Beam Forming Networks: Key in signal processing and transmission.

 

Conclusion

In conclusion, our newly shipped 2-layer PCB made from Rogers RT/Duroid 6002 and featuring an immersion tin surface finish represents a significant advancement in PCB technology. With its exceptional electrical performance, robust construction, and suitability for various demanding applications, this PCB is poised to meet the needs of industries ranging from telecommunications to aerospace.

 

By choosing our PCB, you are opting for reliability, performance, and innovation. We are committed to providing our customers with the highest quality products that enhance their designs and drive their success in the competitive electronics market.

For inquiries or to place an order, please contact our sales team today!

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