|
Product Details:
Payment & Shipping Terms:
|
| PCB Material: | Rogers 4003C Core - 0.305 Mm (12mil) | Layer Count: | 2-layer |
|---|---|---|---|
| PCB Thickness: | 0.4mm | Solder Mask: | Green |
| Silkscreen: | White | Surface Finish: | Electroless Nickle Electroless Palladium Immersion Gold (ENEPIG) |
| Highlight: | RO4003C PCB,12mil Rogers PCB Board,ENEPIG Finished Rogers PCB Board |
||
We are delighted to introduce our a newly shipped PCB with rogers RO4003C 12mil laminates. Rogers RO4003C laminates stand out as a superior choice for engineers and designers seeking exceptional electrical performance and manufacturability. Designed for performance-sensitive, high-volume applications, RO4003C materials combine the electrical properties of PTFE/woven glass with the ease of processing of epoxy/glass, making them an ideal solution for a wide range of industries.
Key Features of RO4003C PCB
Exceptional Electrical Performance
Dielectric Constant (Dk): 3.38 ±0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz, 0.0021 at 2.5 GHz
Low loss and tight control over dielectric properties ensure superior signal integrity, making it perfect for high-frequency applications.
Thermal Stability
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C
High Tg (>280°C or 536°F) ensures stable performance across a wide range of temperatures, even in severe thermal shock environments.
Dimensional Stability
X-axis CTE: 11 ppm/°C, Y-axis CTE: 14 ppm/°C, Z-axis CTE: 46 ppm/°C
Matches the thermal expansion of copper, ensuring excellent dimensional stability and reliable plated through-hole quality.
Low Moisture Absorption
Moisture Absorption: 0.06%
This low moisture absorption rate enhances reliability in humid or demanding environments.
Cost-Effective Manufacturing
Processes like FR-4, eliminating the need for special through-hole treatments or handling procedures.
Competitively priced compared to conventional microwave laminates.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Construction Details
This 2-layer rigid PCB utilizing Rogers RO4003C core is designed to meet the highest standards of quality and performance:
Board Dimensions: 50mm x 70mm (±0.15mm)
Layer Stackup:
Copper Layer 1: 35 μm
Rogers RO4003C Core: 0.305 mm (12 mil)
Copper Layer 2: 35 μm
Trace/Space: 5/5 mils (minimum)
Hole Size: 0.25mm (minimum)
Finished Board Thickness: 0.4mm
Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Solder Mask: Top – Green, Bottom – None
Silkscreen: Top – White, Bottom – None
Quality Assurance: 100% electrical testing prior to shipment, compliant with IPC-Class-2 standards.
Why Choose RO4003C PCB?
Ideal for Multi-Layer Board (MLB) Constructions
The thermal and dimensional stability of RO4003C makes it perfect for mixed dielectric multi-layer boards, ensuring reliable performance in complex designs.
High-Volume Applications
Designed for performance-sensitive applications, RO4003C PCBs are suitable for high-volume production without compromising on quality or cost.
Global Availability
Our RO4003C PCBs are available worldwide, ensuring timely delivery and support for your projects.
Typical Applications
Rogers RO4003C PCBs are widely used in industries requiring high-frequency performance and reliability, including:
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites
Quality and Reliability
The RO4003C PCBs are manufactured to meet IPC-Class-2 standards, ensuring high reliability and performance. With 100% electrical testing before shipment, you can trust that every board meets your exact specifications.
Get a Quote Today!
Whether you're designing for telecommunications, automotive, or satellite systems, Rogers RO4003C PCBs offer the perfect blend of performance, reliability, and cost-effectiveness. Contact us today to discuss your requirements and request a quote. Let us help you bring your high-frequency designs to life with RO4003C laminates!
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
