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125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold

125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10 Core - 125mil (3.175mm)
Layer Count:
2-layer
PCB Size:
45mm X 70mm=1PCS, +/- 0.15mm
PCB Thickness:
3.2mm
Finished Cu Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Highlight:

Immersion Gold RF-10 PCBs

,

Double-Sided Circuits RF-10 PCBs

,

125mil RF-10 PCBs

Product Description

In the fast-evolving world of electronics, revolutionary advancements in RF design are critical. The newly launched RF-10 PCB stands out, engineered for excellence in signal transmission and optimized for high-frequency applications.

 

Material Composition and Structure

Constructed from advanced RF-10 copper clad laminates, this PCB combines ceramic-filled PTFE with woven fiberglass. This unique composition ensures unmatched performance for high-frequency circuits, paving the way for compact solutions to modern electronic challenges.

 

Key Features of RF-10 PCBs

The RF-10 PCB boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, allowing for significant size reduction in RF circuit designs. Coupled with a low dissipation factor of 0.0025 at the same frequency, the PCB minimizes signal loss, ensuring reliable and efficient communication.

 

Performance Benefits for High-Frequency Applications

High thermal conductivity of 0.85 W/mk enhances thermal management, making the RF-10 PCB ideal for applications where reliability is paramount. The low coefficients of thermal expansion (CTE) further ensure dimensional stability, reducing the risk of mechanical failure during operation.

 

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

Technical Specifications Overview

Featuring a 2-layer rigid stackup, the RF-10 PCB includes precise technical specifications that cater to demanding RF applications. With a finished board thickness of 3.2mm and a comprehensive quality assurance process, this PCB is designed for peak performance.

 

Versatile Applications in Modern Electronics

The versatility of the RF-10 PCB allows for its use in various applications, including microstrip patch antennas, GPS systems, and passive components. It is a game changer for RF applications worldwide, enabling engineers to unlock new potentials in circuit design.

 

Quality Assurance and Manufacturing Standards

Adhering to IPC-Class-2 standards, the RF-10 PCB undergoes 100% electrical testing prior to shipment. This commitment to quality ensures that every unit meets the high expectations of performance and reliability.

 

125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold 0

 

Global Availability and Accessibility

With worldwide availability, the RF-10 PCB is accessible to manufacturers and engineers looking to enhance their RF designs. The industry-compliant delivery times make it a preferred choice for modern electronic applications.

 

Future Trends in RF Technology

As we look ahead, the RF-10 PCB positions itself at the forefront of RF technology innovation. It embodies the principles of precision engineering and reliability, setting the stage for future advancements in electronic design.

 

Conclusion: Embracing the Future with RF-10

In conclusion, the RF-10 PCB represents a significant leap forward in high-frequency technology. With its superior features and benefits, it is more than just a product; it is a catalyst for innovation in the RF landscape. Embrace the future of RF design with the unmatched capabilities of the RF-10 PCB.

 

125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold 1

products
PRODUCTS DETAILS
125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10 Core - 125mil (3.175mm)
Layer Count:
2-layer
PCB Size:
45mm X 70mm=1PCS, +/- 0.15mm
PCB Thickness:
3.2mm
Finished Cu Weight:
1oz (1.4 Mils) Outer Layers
Surface Finish:
Immersion Gold
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Immersion Gold RF-10 PCBs

,

Double-Sided Circuits RF-10 PCBs

,

125mil RF-10 PCBs

Product Description

In the fast-evolving world of electronics, revolutionary advancements in RF design are critical. The newly launched RF-10 PCB stands out, engineered for excellence in signal transmission and optimized for high-frequency applications.

 

Material Composition and Structure

Constructed from advanced RF-10 copper clad laminates, this PCB combines ceramic-filled PTFE with woven fiberglass. This unique composition ensures unmatched performance for high-frequency circuits, paving the way for compact solutions to modern electronic challenges.

 

Key Features of RF-10 PCBs

The RF-10 PCB boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, allowing for significant size reduction in RF circuit designs. Coupled with a low dissipation factor of 0.0025 at the same frequency, the PCB minimizes signal loss, ensuring reliable and efficient communication.

 

Performance Benefits for High-Frequency Applications

High thermal conductivity of 0.85 W/mk enhances thermal management, making the RF-10 PCB ideal for applications where reliability is paramount. The low coefficients of thermal expansion (CTE) further ensure dimensional stability, reducing the risk of mechanical failure during operation.

 

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

Technical Specifications Overview

Featuring a 2-layer rigid stackup, the RF-10 PCB includes precise technical specifications that cater to demanding RF applications. With a finished board thickness of 3.2mm and a comprehensive quality assurance process, this PCB is designed for peak performance.

 

Versatile Applications in Modern Electronics

The versatility of the RF-10 PCB allows for its use in various applications, including microstrip patch antennas, GPS systems, and passive components. It is a game changer for RF applications worldwide, enabling engineers to unlock new potentials in circuit design.

 

Quality Assurance and Manufacturing Standards

Adhering to IPC-Class-2 standards, the RF-10 PCB undergoes 100% electrical testing prior to shipment. This commitment to quality ensures that every unit meets the high expectations of performance and reliability.

 

125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold 0

 

Global Availability and Accessibility

With worldwide availability, the RF-10 PCB is accessible to manufacturers and engineers looking to enhance their RF designs. The industry-compliant delivery times make it a preferred choice for modern electronic applications.

 

Future Trends in RF Technology

As we look ahead, the RF-10 PCB positions itself at the forefront of RF technology innovation. It embodies the principles of precision engineering and reliability, setting the stage for future advancements in electronic design.

 

Conclusion: Embracing the Future with RF-10

In conclusion, the RF-10 PCB represents a significant leap forward in high-frequency technology. With its superior features and benefits, it is more than just a product; it is a catalyst for innovation in the RF landscape. Embrace the future of RF design with the unmatched capabilities of the RF-10 PCB.

 

125mil RF-10 PCBs Double-Sided Circuits with Immersion Gold 1

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