In the fast-evolving world of electronics, revolutionary advancements in RF design are critical. The newly launched RF-10 PCB stands out, engineered for excellence in signal transmission and optimized for high-frequency applications.
Material Composition and Structure
Constructed from advanced RF-10 copper clad laminates, this PCB combines ceramic-filled PTFE with woven fiberglass. This unique composition ensures unmatched performance for high-frequency circuits, paving the way for compact solutions to modern electronic challenges.
Key Features of RF-10 PCBs
The RF-10 PCB boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, allowing for significant size reduction in RF circuit designs. Coupled with a low dissipation factor of 0.0025 at the same frequency, the PCB minimizes signal loss, ensuring reliable and efficient communication.
Performance Benefits for High-Frequency Applications
High thermal conductivity of 0.85 W/mk enhances thermal management, making the RF-10 PCB ideal for applications where reliability is paramount. The low coefficients of thermal expansion (CTE) further ensure dimensional stability, reducing the risk of mechanical failure during operation.
| Property |
Test Method |
Unit |
Value |
Unit |
Value |
| Dk @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
|
10.2 ± 0.3 |
|
10.2 ± 0.3 |
| Df @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
|
0.0025 |
|
0.0025 |
| TcK† (-55 to 150 °C) |
IPC-650 2.5.5.6 |
ppm/°C |
-370 |
ppm/°C |
-370 |
| Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.08 |
% |
0.08 |
| Peel Strength (1 oz. RT copper) |
IPC-650 2.4.8 (solder) |
lbs/in |
10 |
N/mm |
1.7 |
| Volume Resistivity |
IPC-650 2.5.17.1 |
Mohm/cm |
6.0 x 107 |
Mohm/cm |
6.0 x 107 |
| Surface Resistivity |
IPC-650 2.5.17.1 |
Mohm |
1.0 x 108 |
Mohm |
1.0 x 108 |
| Flexural Strength (MD) |
IPC - 650 - 2.4.4 |
psi |
14,000 |
N/mm2 |
96.53 |
| Flexural Strength (CD) |
IPC - 650 - 2.4.4 |
psi |
10,000 |
N/mm2 |
68.95 |
| Tensile Strength (MD) |
IPC - 650 - 2.4.19 |
psi |
8,900 |
N/mm2 |
62.57 |
| Tensile Strength (CD) |
IPC - 650 - 2.4.19 |
psi |
5,300 |
N/mm2 |
37.26 |
| Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (25 mil-MD) |
-0.0032 |
% (25 mil-CD) |
-0.0239 |
| Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (25 mil-MD) |
-0.0215 |
% (25 mil-CD) |
-0.0529 |
| Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (25 mil-MD) |
-0.0301 |
% (25 mil-CD) |
-0.0653 |
| Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (60 mil-MD) |
-0.0027 |
% (60 mil-CD) |
-0.0142 |
| Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (60 mil-MD) |
-0.1500 |
% (60 mil-CD) |
-0.0326 |
| Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (60 mil-MD) |
-0.0167 |
% (60 mil-CD) |
-0.0377 |
| Density (Specific Gravity) |
IPC-650-2.3.5 |
g/cm3 |
2.77 |
g/cm3 |
2.77 |
| Specific Heat |
IPC-650-2.4.50 |
J/g°C |
0.9 |
J/g°C |
0.9 |
| Thermal Conductivity (Unclad) |
IPC-650-2.4.50 |
W/M*K |
0.85 |
W/M*K |
0.85 |
| CTE (X -Y axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
16-20 |
ppm/°C |
16-20 |
| CTE (Z axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
25 |
ppm/°C |
25 |
| Flammability Rating |
Internal |
|
V-0 |
|
V-0 |
Technical Specifications Overview
Featuring a 2-layer rigid stackup, the RF-10 PCB includes precise technical specifications that cater to demanding RF applications. With a finished board thickness of 3.2mm and a comprehensive quality assurance process, this PCB is designed for peak performance.
Versatile Applications in Modern Electronics
The versatility of the RF-10 PCB allows for its use in various applications, including microstrip patch antennas, GPS systems, and passive components. It is a game changer for RF applications worldwide, enabling engineers to unlock new potentials in circuit design.
Quality Assurance and Manufacturing Standards
Adhering to IPC-Class-2 standards, the RF-10 PCB undergoes 100% electrical testing prior to shipment. This commitment to quality ensures that every unit meets the high expectations of performance and reliability.
Global Availability and Accessibility
With worldwide availability, the RF-10 PCB is accessible to manufacturers and engineers looking to enhance their RF designs. The industry-compliant delivery times make it a preferred choice for modern electronic applications.
Future Trends in RF Technology
As we look ahead, the RF-10 PCB positions itself at the forefront of RF technology innovation. It embodies the principles of precision engineering and reliability, setting the stage for future advancements in electronic design.
Conclusion: Embracing the Future with RF-10
In conclusion, the RF-10 PCB represents a significant leap forward in high-frequency technology. With its superior features and benefits, it is more than just a product; it is a catalyst for innovation in the RF landscape. Embrace the future of RF design with the unmatched capabilities of the RF-10 PCB.
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