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RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
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RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
  • name
  • name

RF-10 PCB 60mil 2-Layer Immersion Silver Circuits

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Details Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10
PCB Thickness:
60mil
PCB Size:
40 Mm X 40 Mm ± 0.15 Mm
Layer Count:
2-layer
Copper Weight:
1OZ
Surface Finish:
Immersion Silver
Highlight:

2-Layer Immersion Silver Circuits PCB

,

60mil Immersion Silver Circuits PCB

,

Immersion Silver Circuits PCB 2 layer

Product Description

We are pleased to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-10 copper clad laminates. Engineered for high-frequency applications, RF-10 combines ceramic-filled PTFE and woven fiberglass to deliver a cost-effective substrate with exceptional electrical and thermal performance.

 

Key Features

The RF-10 material boasts a dielectric constant of 10.2 ± 0.3 at 10 GHz and a low dissipation factor of 0.0025, making it ideal for RF circuit size reduction. Its high thermal conductivity of 0.85 W/mK ensures effective thermal management, while its tight dimensional tolerances enhance stability in multilayer circuits. The material is also resistant to moisture (0.08% absorption) and has a flammability rating of V-0, ensuring safety and reliability.

 

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

PCB Specifications

This PCB features a well-structured stackup, consisting of:

- Copper Layer 1: 35 μm (1 oz)
- RF-10 Core: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm (1 oz)

 

The overall dimensions of this PCB are 40 mm x 40 mm ± 0.15 mm, with a finished thickness of 1.6 mm. The PCB supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.4 mm. It includes 1 oz finished copper weight on both outer layers and a via plating thickness of 20 μm.

 

For surface finish, it utilizes immersion silver, complemented by a black solder mask on the top side. A white silkscreen is applied for clear labeling, while the bottom side remains without a silkscreen or solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure high quality and performance.

 

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Applications

This versatile PCB is suitable for a variety of applications, including:

 

- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite Components

 

Quality Assurance and Availability

It meets IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with standard PCB design processes.

 

With RF-10, you gain a reliable and high-performance PCB solution tailored for your advanced RF applications.

 

RF-10 PCB 60mil 2-Layer Immersion Silver Circuits 0

Tags: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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products
PRODUCTS DETAILS
Products

RF PCB Board

Rogers PCB Board

PTFE PCB Board

High TG PCB

Multi Layer PCB

Taconic PCB

HDI PCB Board

High Speed PCB

Impedance Controlled PCB

Flexible PCB Board

FR4 PCB Board

PCB Stencil

Metal Core PCB
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
  • name
  • name
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Product Description
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RF-10
PCB Thickness:
60mil
PCB Size:
40 Mm X 40 Mm ± 0.15 Mm
Layer Count:
2-layer
Copper Weight:
1OZ
Surface Finish:
Immersion Silver
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

2-Layer Immersion Silver Circuits PCB

,

60mil Immersion Silver Circuits PCB

,

Immersion Silver Circuits PCB 2 layer

Product Description

We are pleased to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-10 copper clad laminates. Engineered for high-frequency applications, RF-10 combines ceramic-filled PTFE and woven fiberglass to deliver a cost-effective substrate with exceptional electrical and thermal performance.

 

Key Features

The RF-10 material boasts a dielectric constant of 10.2 ± 0.3 at 10 GHz and a low dissipation factor of 0.0025, making it ideal for RF circuit size reduction. Its high thermal conductivity of 0.85 W/mK ensures effective thermal management, while its tight dimensional tolerances enhance stability in multilayer circuits. The material is also resistant to moisture (0.08% absorption) and has a flammability rating of V-0, ensuring safety and reliability.

 

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

PCB Specifications

This PCB features a well-structured stackup, consisting of:

- Copper Layer 1: 35 μm (1 oz)
- RF-10 Core: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm (1 oz)

 

The overall dimensions of this PCB are 40 mm x 40 mm ± 0.15 mm, with a finished thickness of 1.6 mm. The PCB supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.4 mm. It includes 1 oz finished copper weight on both outer layers and a via plating thickness of 20 μm.

 

For surface finish, it utilizes immersion silver, complemented by a black solder mask on the top side. A white silkscreen is applied for clear labeling, while the bottom side remains without a silkscreen or solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure high quality and performance.

 

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

 

Applications

This versatile PCB is suitable for a variety of applications, including:

 

- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite Components

 

Quality Assurance and Availability

It meets IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with standard PCB design processes.

 

With RF-10, you gain a reliable and high-performance PCB solution tailored for your advanced RF applications.

 

RF-10 PCB 60mil 2-Layer Immersion Silver Circuits 0

Tags: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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