We are pleased to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-10 copper clad laminates. Engineered for high-frequency applications, RF-10 combines ceramic-filled PTFE and woven fiberglass to deliver a cost-effective substrate with exceptional electrical and thermal performance.
Key Features
The RF-10 material boasts a dielectric constant of 10.2 ± 0.3 at 10 GHz and a low dissipation factor of 0.0025, making it ideal for RF circuit size reduction. Its high thermal conductivity of 0.85 W/mK ensures effective thermal management, while its tight dimensional tolerances enhance stability in multilayer circuits. The material is also resistant to moisture (0.08% absorption) and has a flammability rating of V-0, ensuring safety and reliability.
| RF-10 Typical Values |
| Property |
Test Method |
Unit |
Value |
Unit |
Value |
| Dk @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
|
10.2 ± 0.3 |
|
10.2 ± 0.3 |
| Df @ 10 GHz |
IPC-650 2.5.5.5.1 Mod. |
|
0.0025 |
|
0.0025 |
| TcK† (-55 to 150 °C) |
IPC-650 2.5.5.6 |
ppm/°C |
-370 |
ppm/°C |
-370 |
| Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.08 |
% |
0.08 |
| Peel Strength (1 oz. RT copper) |
IPC-650 2.4.8 (solder) |
lbs/in |
10 |
N/mm |
1.7 |
| Volume Resistivity |
IPC-650 2.5.17.1 |
Mohm/cm |
6.0 x 107 |
Mohm/cm |
6.0 x 107 |
| Surface Resistivity |
IPC-650 2.5.17.1 |
Mohm |
1.0 x 108 |
Mohm |
1.0 x 108 |
| Flexural Strength (MD) |
IPC - 650 - 2.4.4 |
psi |
14,000 |
N/mm2 |
96.53 |
| Flexural Strength (CD) |
IPC - 650 - 2.4.4 |
psi |
10,000 |
N/mm2 |
68.95 |
| Tensile Strength (MD) |
IPC - 650 - 2.4.19 |
psi |
8,900 |
N/mm2 |
62.57 |
| Tensile Strength (CD) |
IPC - 650 - 2.4.19 |
psi |
5,300 |
N/mm2 |
37.26 |
| Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (25 mil-MD) |
-0.0032 |
% (25 mil-CD) |
-0.0239 |
| Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (25 mil-MD) |
-0.0215 |
% (25 mil-CD) |
-0.0529 |
| Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (25 mil-MD) |
-0.0301 |
% (25 mil-CD) |
-0.0653 |
| Dimensional Stability |
IPC-650 2.4.39 (After Etch) |
% (60 mil-MD) |
-0.0027 |
% (60 mil-CD) |
-0.0142 |
| Dimensional Stability |
IPC-650 2.4.39 (After Bake) |
% (60 mil-MD) |
-0.1500 |
% (60 mil-CD) |
-0.0326 |
| Dimensional Stability |
IPC-650 2.4.39 (After Stress) |
% (60 mil-MD) |
-0.0167 |
% (60 mil-CD) |
-0.0377 |
| Density (Specific Gravity) |
IPC-650-2.3.5 |
g/cm3 |
2.77 |
g/cm3 |
2.77 |
| Specific Heat |
IPC-650-2.4.50 |
J/g°C |
0.9 |
J/g°C |
0.9 |
| Thermal Conductivity (Unclad) |
IPC-650-2.4.50 |
W/M*K |
0.85 |
W/M*K |
0.85 |
| CTE (X -Y axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
16-20 |
ppm/°C |
16-20 |
| CTE (Z axis) (50 to 150 °C) |
IPC-650 2.4.41 |
ppm/°C |
25 |
ppm/°C |
25 |
| Flammability Rating |
Internal |
|
V-0 |
|
V-0 |
PCB Specifications
This PCB features a well-structured stackup, consisting of:
- Copper Layer 1: 35 μm (1 oz)
- RF-10 Core: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm (1 oz)
The overall dimensions of this PCB are 40 mm x 40 mm ± 0.15 mm, with a finished thickness of 1.6 mm. The PCB supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.4 mm. It includes 1 oz finished copper weight on both outer layers and a via plating thickness of 20 μm.
For surface finish, it utilizes immersion silver, complemented by a black solder mask on the top side. A white silkscreen is applied for clear labeling, while the bottom side remains without a silkscreen or solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure high quality and performance.
| PCB Material: |
Composites of Ceramic Filled PTFE and Woven Fiberglass |
| Designation: |
RF-10 |
| Dielectric constant: |
10.2 |
| Dissipation Factor |
0.0025 10GHz |
| Layer count: |
Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: |
10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm ) |
| PCB size: |
≤400mm X 500mm |
| Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
| Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications
This versatile PCB is suitable for a variety of applications, including:
- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite Components
Quality Assurance and Availability
It meets IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with standard PCB design processes.
With RF-10, you gain a reliable and high-performance PCB solution tailored for your advanced RF applications.
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