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Product Details:
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| Material: | TLX-0 | PCB Size: | 26.64mm X 64.97 Mm=1PCS, +/- 0.15mm |
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| Copper Weight: | 1oz (1.4 Mils) | Surface Finish: | Immersion Gold |
| Layer Count: | 2-layer | PCB Thickness: | 0.2mm |
| High Light: | TLX-0 rf pcb board,5mil rf pcb board,1OZ Immersion Gold rf pcb board |
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Introduction
The TLX-0 is a high-performance printed circuit board made using PTFE fiberglass composite material. The TLX series laminates offer excellent reliability and versatility for a wide range of RF and microwave applications. With a dielectric constant of 2.45 ± 0.04 and low dissipation factor, the TLX-0 is an ideal choice for low-layer count microwave designs.
Features
Dielectric Constant (Dk): 2.45 ± 0.04 at 10 GHz
Dissipation Factor (Df): 0.0021 at 10 GHz
Low Moisture Absorption: 0.02%
Coefficient of Thermal Expansion (CTE):
X-Axis: 21 ppm/°C
Y-Axis: 23 ppm/°C
Z-Axis: 215 ppm/°C
Strong Peel Strength: 12 lbs/in
| Type | DK | |
| TLY-5A | 2.17 | |
| TLY-5 | 2.20 | |
| TLY-3 | 2.33 | |
| TLT-0 | TLX-0 | 2.45 |
| TLT-9 | TLX-9 | 2.50 |
| TLT-8 | TLX-8 | 2.55 |
| TLT-7 | TLX-7 | 2.60 |
| TLT-6 | TLX-6 | 2.65 |
| TLE-95 | 2.95 | |
| TLC-27 | 2.75 | |
| TLC-30 | RF-30 | 3.00 |
| TLC-32 | 3.20 | |
| TLF-35 | 3.50 | |
| TLF-35-xxxx-A | 3.50 | |
| RF-35 | RF-35A2 | 3.50 |
| TRF-41 | 4.10 | |
| TRF-43 | 4.30 | |
| TRF-45 | 4.50 | |
| RF-60A | 6.15 | |
| CER-10 | 10 | |
Benefits
Excellent PIM performance (< -160 dBc)
Robust mechanical and thermal properties
Low and stable dielectric constant
Dimensionally stable
Low moisture absorption
Tight Dk tolerance
Low dissipation factor
UL 94 V0 flammability rating
Suitable for low-layer count microwave designs
Applications
The TLX-0 PCB is well-suited for a variety of RF and microwave applications, including:
Couplers, splitters, combiners, amplifiers
Antennas and passive components
Radar systems and mobile communications
Microwave test equipment
Microwave transmission devices and RF components
PCB Specifications
Material: TLX-0 PTFE Fiberglass Composite
Layer Stack-up: 2-layer rigid
Copper Thickness: 1 oz (35 μm) on both layers
Board Dimensions: 26.64 mm x 64.97 mm ± 0.15 mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3 mm
Finished Board Thickness: 0.2 mm
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
This PCB is manufactured to IPC-Class-2 quality standards and is available worldwide. Contact us today to discuss your RF and microwave design requirements.
Contact Person: Ms. Ivy Deng
Tel: 86-755-27374946
Fax: 86-755-27374848
