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Rogers RO4725JXR Antenna Grade PCB Delivering Exceptional RF Performance Affordable Price

Rogers RO4725JXR Antenna Grade PCB Delivering Exceptional RF Performance Affordable Price

MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO4725JXR
PCB Size:
42.13mm X 112.96 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.8mm
Highlight:

Rogers RO4725JXR PCB

,

Affordable Price Antenna-Grade PCB

,

Rogers RO4725JXR Antenna-Grade PCB

Product Description

Introduction
In the ever-evolving world of wireless communications, the demand for high-performance, cost-effective antenna solutions has never been greater. Rogers Corporation, a renowned leader in advanced circuit materials, has developed the RO4725JXR PCB to address this need. This 2-layer rigid circuit board leverages the company's innovative RO4725JXR hydrocarbon/ceramic/woven glass laminate material, offering an affordable and reliable alternative to traditional PTFE-based laminates.

 

Features and Benefits
The RO4725JXR PCB boasts an impressive array of features that make it a standout choice for antenna and RF applications. Featuring a dielectric constant (Dk) of 2.55 ± 0.05 at 10 GHz, this material delivers exceptional electrical performance, with a low dissipation factor (Df) of 0.0026 at 10 GHz and 0.0022 at 2.5 GHz. This combination of low loss and stable Dk ensures that antenna designers can achieve substantial gain values while minimizing signal degradation.

 

One of the RO4725JXR's key advantages is its excellent thermal coefficient of dielectric constant, rated at +34 ppm/°C. This remarkable stability ensures consistent circuit performance across a wide range of environmental conditions, a critical factor for mission-critical applications. Furthermore, the material's CTE is closely matched to copper, with X, Y, and Z axes of 13.9, 19, and 25.6 ppm/°C, respectively, minimizing the risk of delamination and other reliability issues.

 

In addition to its impressive electrical and thermal properties, the RO4725JXR PCB also boasts a high Tg value of greater than 280°C, making it compatible with standard FR-4 and lead-free assembly processes. This allows for seamless integration into existing manufacturing workflows, reducing the need for specialized handling and processing.

 

Notably, the RO4725JXR PCB has demonstrated excellent passive intermodulation (PIM) performance, with values better than -160 dBc (43 dBm 1,900 MHz signal). This low PIM characteristic is crucial for cellular base station antennas and other high-performance RF systems, where clean signal integrity is of paramount importance.

 

Property RO4725JXR Direction Units Condition Test Method
Dielectric Constant, εr Process 2.55 ± 0.05 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design 2.64 Z   1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor 0.0026 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
0.0022   2.5GHz
Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030") 2.16 X 10^8   MΩ•cm COND A IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030") 4.8 X 10^7   MΩ COND A IPC-TM-650, 2.5.17.1
PIM -166   dBc 50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”) 630 Z V/mil   IPC-TM-650, 2.5.6.2
Flexural Strength MD 121 (17.5)   MPa
(kpsi)
RT ASTM D790
CMD 92 (13.3)  
Dimensional Stability <0.4 X,Y mm/m after etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24
19.0 Y
25.6 Z
Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470
Moisture Absorption 0.24%   % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Tg >280   °C   IPC-TM-650 2.4.24
Td 439   °C   ASTM D3850
Density 1.27   gm/cm3   ASTM D792
Copper Peel Strength 8.5   pli 1 oz LoPro EDC IPC-TM-650 2.4.8
Flammability N/A       UL94
Lead-Free Process Compatible YES        

 

Applications and Specifications
The RO4725JXR PCB is ideally suited for a wide range of antenna and RF applications, with a particular focus on cellular base station antennas. Its combination of low loss, stable Dk, and low PIM make it an excellent choice for designers seeking to optimize both cost and performance in their wireless solutions.

 

In terms of specifications, this PCB is a 2-layer rigid circuit board with dimensions of 42.13 mm x 112.96 mm ± 0.15 mm. The copper thickness is 1 oz (1.4 mil) on both outer layers, and the minimum trace/space is 5/5 mil. The board features a minimum hole size of 0.4 mm and a finished thickness of 0.8 mm, with a via plating thickness of 20 μm. The surface finish is immersion gold, and the board is manufactured to the IPC-Class-2 quality standard, with 100% electrical testing prior to shipment.

 

Rogers RO4725JXR Antenna Grade PCB Delivering Exceptional RF Performance Affordable Price 0

 

Conclusion
The Rogers RO4725JXR PCB represents a compelling alternative to traditional PTFE-based laminates, offering a unique blend of exceptional RF performance, thermal stability, and cost-effectiveness. With its robust features and consistent circuit behavior, this PCB is poised to become a go-to solution for antenna designers and RF engineers seeking to optimize their wireless systems.

 

PCB Capability (TMM10)  
PCB material: Hydrocarbon / Ceramic / Woven Glass
Designation: RO4725JXR
Dielectric constant: 2.55
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 30.7mil(0.780mm), 60.7mil (1.542mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow, White etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..
products
PRODUCTS DETAILS
Rogers RO4725JXR Antenna Grade PCB Delivering Exceptional RF Performance Affordable Price
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Standard Packaging: Vacuum bags+Cartons
Delivery Period: 8-9 working days
Payment Method: T/T
Supply Capacity: 5000PCS per month
Detail Information
Place of Origin
CHINA
Brand Name
Bicheng
Certification
UL, ISO9001, IATF16949
Material:
RO4725JXR
PCB Size:
42.13mm X 112.96 Mm=1PCS, +/- 0.15mm
Copper Weight:
1oz (1.4 Mils)
Surface Finish:
Immersion Gold
Layer Count:
2-layer
PCB Thickness:
0.8mm
Minimum Order Quantity:
1PCS
Price:
USD9.99-99.99/PCS
Packaging Details:
Vacuum bags+Cartons
Delivery Time:
8-9 working days
Payment Terms:
T/T
Supply Ability:
5000PCS per month
Highlight

Rogers RO4725JXR PCB

,

Affordable Price Antenna-Grade PCB

,

Rogers RO4725JXR Antenna-Grade PCB

Product Description

Introduction
In the ever-evolving world of wireless communications, the demand for high-performance, cost-effective antenna solutions has never been greater. Rogers Corporation, a renowned leader in advanced circuit materials, has developed the RO4725JXR PCB to address this need. This 2-layer rigid circuit board leverages the company's innovative RO4725JXR hydrocarbon/ceramic/woven glass laminate material, offering an affordable and reliable alternative to traditional PTFE-based laminates.

 

Features and Benefits
The RO4725JXR PCB boasts an impressive array of features that make it a standout choice for antenna and RF applications. Featuring a dielectric constant (Dk) of 2.55 ± 0.05 at 10 GHz, this material delivers exceptional electrical performance, with a low dissipation factor (Df) of 0.0026 at 10 GHz and 0.0022 at 2.5 GHz. This combination of low loss and stable Dk ensures that antenna designers can achieve substantial gain values while minimizing signal degradation.

 

One of the RO4725JXR's key advantages is its excellent thermal coefficient of dielectric constant, rated at +34 ppm/°C. This remarkable stability ensures consistent circuit performance across a wide range of environmental conditions, a critical factor for mission-critical applications. Furthermore, the material's CTE is closely matched to copper, with X, Y, and Z axes of 13.9, 19, and 25.6 ppm/°C, respectively, minimizing the risk of delamination and other reliability issues.

 

In addition to its impressive electrical and thermal properties, the RO4725JXR PCB also boasts a high Tg value of greater than 280°C, making it compatible with standard FR-4 and lead-free assembly processes. This allows for seamless integration into existing manufacturing workflows, reducing the need for specialized handling and processing.

 

Notably, the RO4725JXR PCB has demonstrated excellent passive intermodulation (PIM) performance, with values better than -160 dBc (43 dBm 1,900 MHz signal). This low PIM characteristic is crucial for cellular base station antennas and other high-performance RF systems, where clean signal integrity is of paramount importance.

 

Property RO4725JXR Direction Units Condition Test Method
Dielectric Constant, εr Process 2.55 ± 0.05 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
Dielectric Constant, εr Design 2.64 Z   1.7 GHz - 5
GHz
Differential Phase Length Method
Dissipation Factor 0.0026 Z   10 GHz/23°C IPC-TM-650, 2.5.5.5
0.0022   2.5GHz
Thermal Coefficient of εr +34 Z ppm/°C -50°C to 150°C IPC-TM-650, 2.5.5.5
Volume Resistivity (0.030") 2.16 X 10^8   MΩ•cm COND A IPC-TM-650, 2.5.17.1
Surface Resistivity (0.030") 4.8 X 10^7   MΩ COND A IPC-TM-650, 2.5.17.1
PIM -166   dBc 50 ohm
0.060”
43dBm
1900MHz
Electrical Strength (0.030”) 630 Z V/mil   IPC-TM-650, 2.5.6.2
Flexural Strength MD 121 (17.5)   MPa
(kpsi)
RT ASTM D790
CMD 92 (13.3)  
Dimensional Stability <0.4 X,Y mm/m after etch
+E2/150°C
IPC-TM-650, 2.4.39A
Coefficient of Thermal
Expansion
13.9 X ppm/°C -55 TO 288°C IPC-TM-650, 2.1.24
19.0 Y
25.6 Z
Thermal Conductivity 0.38 Z W/mK° 50°C ASTM D5470
Moisture Absorption 0.24%   % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Tg >280   °C   IPC-TM-650 2.4.24
Td 439   °C   ASTM D3850
Density 1.27   gm/cm3   ASTM D792
Copper Peel Strength 8.5   pli 1 oz LoPro EDC IPC-TM-650 2.4.8
Flammability N/A       UL94
Lead-Free Process Compatible YES        

 

Applications and Specifications
The RO4725JXR PCB is ideally suited for a wide range of antenna and RF applications, with a particular focus on cellular base station antennas. Its combination of low loss, stable Dk, and low PIM make it an excellent choice for designers seeking to optimize both cost and performance in their wireless solutions.

 

In terms of specifications, this PCB is a 2-layer rigid circuit board with dimensions of 42.13 mm x 112.96 mm ± 0.15 mm. The copper thickness is 1 oz (1.4 mil) on both outer layers, and the minimum trace/space is 5/5 mil. The board features a minimum hole size of 0.4 mm and a finished thickness of 0.8 mm, with a via plating thickness of 20 μm. The surface finish is immersion gold, and the board is manufactured to the IPC-Class-2 quality standard, with 100% electrical testing prior to shipment.

 

Rogers RO4725JXR Antenna Grade PCB Delivering Exceptional RF Performance Affordable Price 0

 

Conclusion
The Rogers RO4725JXR PCB represents a compelling alternative to traditional PTFE-based laminates, offering a unique blend of exceptional RF performance, thermal stability, and cost-effectiveness. With its robust features and consistent circuit behavior, this PCB is poised to become a go-to solution for antenna designers and RF engineers seeking to optimize their wireless systems.

 

PCB Capability (TMM10)  
PCB material: Hydrocarbon / Ceramic / Woven Glass
Designation: RO4725JXR
Dielectric constant: 2.55
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 30.7mil(0.780mm), 60.7mil (1.542mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow, White etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..
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